Indium Corporation Datasheets for Fluxes
Fluxes are chemical compositions used in soldering, brazing and welding. They clean the metal’s surface, assist with heat transfer, and remove unwanted oxide films.
Fluxes: Learn more
| Product Name | Notes |
|---|---|
| #1210 Battery Flux was specially formulated for high volume cast-on-strap manufacturing where rapid evaporation of solvent is necessary. This fl ux contains no chlorides, heavy metals or organic acids, which... | |
| 1075 VOC-FREE is a resin/rosin-free fl ux specifi cally developed for wave soldering, surface mount, mixedtechnology and through-hole electronic assemblies. 1075 VOC-FREE is a water-based, non-fl ammable formulation eliminating special... | |
| 1075-EX 30 is a resin/rosin-free flux specifically developed for wave soldering, surface-mount, mixed-technology and through-hole electronic assemblies. 1075-EX 30 is a water-based, non-flammable formulation, eliminating special storage requirements, and reducing... | |
| 1075-EX VOC-Free is a resin/rosin-free fl ux specifi cally developed for wave soldering surface-mount, mixedtechnology and through-hole electronic assemblies. 1075-EX VOC-Free is a water-based, non-fl ammable formulation, which eliminates special... | |
| 1075-EXR 30 VOC-Free is a non-halide, synthetic resin flux specifically developed for wave soldering of surface-mount, mixed-technology and through-hole electronic assemblies. 1075-EXR 30 VOC-Free is a water based, non-flammable formulation... | |
| 1075-EXR-40 is a non-halide, synthetic resin flux specifically developed for wave soldering surface mount, mixed technology and through-hole electronic assemblies. 1075-EXR-40 is a water based, non-flammable formulation eliminating special storage... | |
| 1095-NF 1095-NF water-soluble fl ux is a neutral pH formulation water-soluble flux is a neutral pH formulation with a high level of activity for wave soldering through-hole, mixed-technology and surface-mount... | |
| 14 Rosin Flux is an alcohol-based, high solids, high activity flux that is ideal for soldering difficult-to-solder metals. | |
| 2036 is a non-activated rosin flux blended with pure alcohol and water white rosin. This flux is best suited for easy to solder applications where high-reliability of the assembly is... | |
| 2205 Rosin Flux is an alcohol-based flux that is ideal for soldering all surface finishes. It can be used to test solderability according to IPC J-STD-003 and IPC J-STD-002. | |
| 2206 Rosin Flux is an alcohol-based flux that is ideal for soldering all surface finishes. It can be used to test solderability according to IPC J-STD-003 and IPC J-STD-002. | |
| 2632 is an alcohol-based flux developed for soldering can seams. 2632 provides fast wetting for dependable soldering and excellent seam-fill on tin-plated cans. | |
| 3541 No-Clean is a low-solids fl ux specially formulated to be used for wave soldering where the solder cleaning process has been eliminated. This fl ux contains a small amount... | |
| 3590-T is a low solids, non-halide rosin/resin free fl ux designed to eliminate post-cleaning operations. The effective fl ux activators provide superior solderability of surface mount, mixed technology, and through-hole... | |
| 3592 Wave Soldering Flux is a low solids, rosin/ resin-free formulation designed to leave a no-residue appearance. This fl ux contains very effective fl ux activators that provide excellent solderability... | |
| 42-SS is a water-based inorganic salt formulation developed for soldering stainless steel and other difficultto- solder metals. 42-SS provides fast wetting and effective oxide removal for dependable soldering. | |
| 42-SS is a water-based inorganic salt formulation developed for soldering stainless steel and other difficultto-solder metals. 42-SS provides fast wetting and effective oxide removal for dependable soldering. | |
| 5RMA-RC and 5RA-RC are heat-stabilized rosin fluxes designed for soldering with preforms or wire. They are formulated for use with a wide range of temperatures and metallizations. Both fluxes are... | |
| 615 IR Fusing Fluid is an organic, biodegradable liquid formulation developed for use in reflow of solder-plated printed circuit boards by infra-red fusing equipment. 615 IR Fusing Fluid adequately reduces... | |
| 80 Battery Flux is specially formulated for cast-on-strap manufacturing of batteries. This flux offers a wide process window at various temperatures and an extended life. 80 Battery Flux does not... | |
| 80 Battery Flux is specially formulated for cast-on-strap manufacturing of batteries. This flux offers a wide process window at various temperatures and an extended life. 80 Battery Flux does not... | |
| Indalloy Flux #1 is a non-acid*, non toxic*, Pb-free, amber colored paste flux for use on copper, brass, galvanized iron, lead, zinc, tin, silver, nickel, mild steel, terne plate and... | |
| Indalloy Flux #2 is a specialty acid based liquid flux formulated for the purpose of soldering high chromium containing alloys including stainless steel. Indalloy Flux #2 also has proven to... | |
| Benefits Excellent cleanability, residue can be removed with room temperature water Can be used for printing, dipping, and pin transfer deposition Offers high yields in BGA bumping process Excellent solderability... | |
| CU 12 Copper Cleaner is an acid-based water-soluble cleaner formulated to remove copper oxide, leaving a clean, solderable surface. This product prepares copper surfaces for soldering without causing scratches created... | |
| Epoxy fluxes are often used in no-clean SMT component attach applications. The solder bumps on wafer level CSP, micro BGA or BGA packages are dipped in epoxy fluxes, or the... | |
| Features: Halogen-free – no intentionally added (NIA) halogens Flux rheology applicable for all sphere sizes Suitable for Pb-free applications Uniform pin transfer over extended periods Low voiding No “missing ball” | |
| Features: Halogen-free – no intentionally added (NIA) halogens Flux rheology applicable for all sphere sizes Suitable for Pb-free or SnPb applications Uniform pin transfer over extended periods Proven high yields... | |
| Features Application by dipping or dispensing Halide-free Optimized for Pb-Free (SAC alloy) applications Excellent solderability with Cu-OSP, Au/Ni, and Immersion Ag fi nishes Air refl ow • Bubble-free packaging Introduction... | |
| Features Application by dipping or dispensing Halogen-free (no intentionally-added halides) Optimized for Pb-free (SAC alloy) applications Excellent solderability with Cu-OSP, AuNi, and immersion Ag finishes Air reflow Bubble-free packaging Introduction... | |
| Features Application by dipping or dispensing Optimized for Pb-Free (SAC alloy) applications Excellent solderability with Cu-OSP, Au/Ni, and Immersion Ag fi nishes Air reflow Bubble-free packaging Introduction PoP Flux 89-LV... | |
| Features Application by dipping or dispensing Optimized for Pb-free (SAC alloy) applications Excellent solderability with Cu-OSP, AuNi, and immersion Ag finishes Air or nitrogen reflow Air-free packaging Introduction PoP Flux... | |
| Features Application by dipping or dispensing Optimized for Pb-free (SAC alloy)applications Excellent solderability with Cu-OSP, AuNi, and immersion Ag finishes Air reflow Air-free packaging Introduction PoP Flux 89LV-B is a... | |
| Features Designed for ball-attach pin-transfer applications Flux rheology applicable for all sphere sizes Excellent solderability on a wide range of surfaces Water-soluble Does not stain substrates or wash equipment Introduction... | |
| Features Designed for copper-pillar flip-chip dipping applications Tackiness suitable for holding multicore die during assembly Compatible with underfills No wetting onto die surface Dipping with minimal bridging Bubble-free airless packaging... | |
| Features Designed for flip-chip dipping applications Tackiness suitable for holding die during assembly Bubble-free airless packaging Ultra-low residue Halogen-free No-clean Introduction Flip-Chip Flux NC-26-A is a halogen-free, no-clean flipchip dipping... | |
| Features Designed for flip-chip dipping applications Tackiness suitable for holding large die during assembly Bubble-free packaging Red color for ease of detection Introduction Flip-Chip Flux WS-446 is a water soluble... | |
| Features Excellent cleanability, residue can be removed with room temperature DI water Stencil-printable, high tack Offers high yields in BGA bumping process Halide-free with excellent solderability Wide process window Introduction... | |
| Features Excellent cleanability; residue can be removed with room temperature water Pin-transfer and stencil printable Offers high yields in BGA bumping process Halide-free with excellent solderability Wide process window Suitable... | |
| Features Excellent Surface Wetting Eliminates Cleaning Wide Process Window Use with Pb-Free and Sn/Pb Introduction Tabbing Flux GS-1414 is a no-clean fl ux specifi cally developed for Pb-free solar tabbing/stringing... | |
| Features Excellent Surface Wetting Good for high temperature processes Cleaning not required for most applications 725-M is an alcohol based activated rosin flux developed for soldering through-hole assemblies. It uses... | |
| Features Flux rheology applicable for all sphere sizes Suitable for Pb-Free or Sn/Pb applications Uniform pin transfer over extended periods Red color for ease of detection Proven high yields in... | |
| Features Flux rheology applicable for all sphere sizes Suitable for Pb-free or SnPb applications Uniform pin transfer over extended periods Red color for ease of detection Proven high yields in... | |
| Features Halogen-free – no intentionally added (NIA) halogens Designed for flip-chip dipping applications Excellent solderability on a variety of metallizations Reduces flip-chip voids • Uniform dipping performance over extended periods... | |
| Features Halogen-free – no intentionally added (NIA) halogens Designed for flip-chip dipping applications Suitable for both Sn63 and Pb-free applications Excellent solderability on a variety of metallizations Reduces flip-chip voids... | |
| Features Halogen-free – no intentionally added (NIA) halogens Suitable for Pb-free or SnPb alloys Designed for flip-chip dipping applications Ultralow residue Compatible with underfills Bubble-free (airless) packaging Introduction Flip Chip... | |
| Features Halogen-free – no intentionally added (NIA) halogens Uniform dipping volumes over long periods Proven high yields in copper-pillar (Cu-pillar) flip-chip TCB (thermocompression bonding) reflow on interposer Designed for SnAg... | |
| Features Halogen-free (no intentionally-added halogens) Viscosity suitable for 150-300mm wafers Solvent clean Nitrogen reflow atmosphere Suitable for high-Pb, SnPb, and Pb-free solder applications Introduction Wafer Flux SC 5R is a... | |
| Features Halogen-free, no-clean residue Suitable for pin-grid array and standard ball-grid array applications Airless packaging Excellent solderability to all common surface metallizations Can be used for printing, dipping, pin transfer... | |
| Features Halogen-free Air refl ow Designed for Pb-Free applications Excellent solderability on a variety of surfaces Water wash Bubble-free packaging Flux rheology applicable for spheres 50-762microns Uniform pin-transfer over extended... | |
| Features Halogen-free Air reflow Designed for Pb-Free applications Excellent solderability on a variety of surfaces Water wash • Bubble-free packaging Flux rheology applicable for spheres 50-762microns Uniform pin-transfer over extended... | |
| Features No-clean Compatible with epoxy-based underfi ll materials and conformal coatings Excellent wetting of standard Pb-Free alloys onto standard pad metallizations Fast curing Halogen-free Introduction Flip-Chip Epoxy Flux PK-005 is... | |
| Features Rheology optimized for dipping and package-holding Holds packages up to 25mm x 25mm in outline Long pot life/working life Excellent solderability with Cu-OSP and Au/Ni finishes Optimized for Pb-Free... | |
| Features Semiconductor-grade Water-soluble Viscosity suitable for 150-300mm wafers No residue Halogen-free Promotes uniform solder bump formation Suitable for Sn/Pb and Pb-Free solder applications Introduction Wafer Flux WS-3543-A is a low... | |
| Features Sprayable and dispensable Excellent wetting ability Wide refl ow temperature ranges Introduction FC-WS-HT-A1 is a water-washable, halide-free, sprayable liquid fl ux designed for Sn/Pb and Pb-Free wafer level solder... | |
| Features Suitable for Pin-Grid Array and standard Ball Grid Array applications Airless Packaging Excellent solderability to all common surface metallizations No-clean residue Can be used for printing, dipping, and pin... | |
| Features Ultra-low residue Excellent wetting No-clean Sprayable and dispensible Introduction FC-NC-HT-A1 is no-clean, halide-free, sprayable liquid fl ux designed for fl ip-chip attachment. It can be used in a nitrogen... | |
| Features Uniform pin transfer over extended periods Proven high yields in ball-attach process Suitable for Pb-Free or Sn/Pb applications Flux rheology applicable for all sphere sizes Red color for ease... | |
| Features Water-soluble Halogen-free (not intentionally added) Suitable for spray applications Suitable for SnPb and Pb-free applications Non-corrosive to underbump metallization Introduction Flip-Chip Flux WS-575-SP is a liquid flux specifically designed... | |
| Features Water-soluble Halogen-free: no intentionally added halogens Suitable for spray or dipping Suitable for Sn/Pb, Pb-Free, and high-Pb alloy applications Non-corrosive to underbump metallization Introduction Flip-Chip Flux WS-3555 is a... | |
| Features Water-soluble Viscosity suitable for 150–300 mm wafers as a damming flux No residue after multiple reflow/cleaning cycles Uniform bump shape Halogen-free Suitable for SnPb and Pb-free, and high temperature... | |
| Features Water-soluble Viscosity suitable for 150–300 mm wafers No residue after multiple reflow/cleaning cycles Uniform bump shape Halide-free Suitable for SnPb and Pb-free, and high temperature applications Non-corrosive to underbump... | |
| Features Water-soluble Viscosity suitable for 150–300mm wafers No residue • Halide-free Promotes uniform solder bump formation Suitable for SnPb and Pb-free solder applications Introduction Wafer Flux WS-3518 is a low... | |
| Features Water-soluble Viscosity suitable for 150–300mm wafers No residue Halide-free Promotes uniform solder bump formation Suitable for SnPb and Pb-free solder applications Introduction Wafer Flux WS-3543 is a low viscosity... | |
| Flux-coated solder preforms give you exact, repeatable amounts of solder for your manufacturing process without adding an extra step for applying flux. Both the solder preforms and flux are made... | |
| High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs. Additional diameters... | |
| High Lead cored wires available in 1 lb. spools, containing CW201 (RA) flux core. Please choose between diameters of .032" and .062". Minimum order quantity is 5 lbs. | |
| Indalloy Flux #3 is a high viscosity liquid flux formulated for the purpose of soldering aluminum. Indalloy Flux #3 also has proven to be an effective flux for soldering to... | |
| Indalloy Flux #4-OA is a clear liquid flux formulated for the purpose of soldering moderately easy to difficult metallizations such as nickel, oxidized copper, Kovar and brass. This flux contains... | |
| Indalloy Flux #5-OA is a clear liquid flux formulated for the purpose of soldering moderately easy to difficult metallizations such as nickel, oxidized copper, Kovar and brass. This flux contains... | |
| Indium Corporation is quickly becoming known as one of the highest quality, full line suppliers of flux-cored wire solder. Indium Corporation uses only "conflict-free" and grade A (per ASTM B32)... | |
| Indium Corporation manufactures a complete line of TACFlux® , which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT... | |
| Indium Corporation manufactures a complete line of TACFlux® which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT... | |
| Indium Corporation manufactures a complete line of TACFlux® which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT component... | |
| Indium Corporation now offers a full line of flux pens in standard industry packaging. The technologically advanced pen has exceptional leak control and dispensing capability. Each pen contains 10ml of... | |
| Indium Corporation’s new WF-9955 soldering flux is an updated version of Indium’s best-selling WF-9942, designed to conform to the more rigorous standards of J-STD-004B Type ORL0. It has no intentionally... | |
| Indium Corporation’s new WF-9958 soldering flux is an updated version of Indium’s best-selling WF-9942, designed to conform to the more rigorous standards of J-STD-004B Type ORM0. It has no intentionally... | |
| Indium Corporation’s no-clean flux coatings are formulated specifically for solder preforms, combining the latest flux technologies to satisfy the most recent requirements for no-clean and RoHS- and REACH-compliant materials. Flux-coated... | |
| Indium Corporation’s Ultra-Low and Near-Zero Residue (ULR/NZR) Flip-Chip Fluxes are halogenfree, no-clean dipping fluxes, designed to leave a very small amount of a benign, solid, clear residue after reflow. By... | |
| Indium Corporation's Flux #2 effectively reduces the oxides on the nickel and titanium of Nitinol. The recommended solder for use with this is Indalloy #121 (96.5Sn 3.5Ag) which is available... | |
| Indium Corporation's Flux #3 is a more viscous flux that works best with tin-containing alloys. It has a high boiling point and works well with higher temperature solders. The Flux... | |
| Indium Hi Grade Wave Solder Flux 1075 VOC-Free is a non-halide, rosin/resin free flux specifically developed for wave soldering, surface mount, mixed technology and through-hole electronic assembly. | |
| Indium Hi Grade Wave Solder Flux 3590-TX No Residue is a non-halide, rosin/resin free designed to eliminate post-cleaning operations. Very effective flux activators provide superior solderability reduced defects and shiny... | |
| LED TACFlux® 007 is the leading die-attach flux for the light-emitting diode (LED) industry. It was specifically designed for die-to-sub-mount applications with sputtered film or solder preform alloys, with melting... | |
| NC-771 is a halogen-free, low-residue, all-purpose liquid flux that passes the SIR test in the un-reflowed state. It can be used in a standard SnPb or Pb-free rework or soldering... | |
| Our fluxes for flip-chip bonding applications are halide-free. They are designed for both air and nitrogen reflow and may be purchased individually or in a research kit. The no-clean and... | |
| Package-on-Package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped... | |
| PoP Flux 89HF-LV is a thixotropic no-clean flux designed for package-on-package applications with Pb-free solders. PoP Flux 89HF-LV has a unique halogen-free activator system. Features: Application by dipping or dispensing... | |
| Preforms are precise shapes of solder that are manufactured to tight tolerances to give repeatable, accurate solder amounts that are efficiently introduced into the manufacturing process. Adding the flux directly... | |
| Proven in PV module assembly processes, Indium Corporation's No-Clean Liquid Solar Tabbing Fluxes are non-corrosive, non-conductive, and provide excellent solderability on all types of silver metallizations. Formulated to provide a... | |
| Rosin Flux #784 is a specially formulated activated rosin flux exhibiting excellent wetting power. The solvent system keeps evaporation losses to a minimum on continuous exposure to aeration and working... | |
| Tabbing Flux GS-5454 is a no-clean fl ux specifi cally developed for solar tabbing/stringing applications. It is formulated to provide a wide process window and can be used with Sn/Cu,... | |
| TACFlux 026 is no-clean and halide-free fl ux designed especially for fl ip-chip and CSP (chip scale package) attachment. It can be also used for 3D packages (POP). TACFlux 026... | |
| TACFlux® 25 is a water soluble flux designed to be used in rework and repair, SMT component attachment, and virtually all applications where fluxes are required. | |
| TACFlux® 007, 018 and 023 are tacky fluxes designed for ball mounting onto BGA and BGA sockets. | |
| TACFlux® 008 is an electronics-grade no-clean creamy flux. Its many uses include: rework and repair of various electronics assemblies and components, die-attach, SMT component-attach (including BGAs & flip-chips), BGA ball-attach,... | |
| TACFlux® 020B is a no-clean flux formulated for both Sn/Pb and Pb-free soldering. TACFlux® 020B is halogen-free and passes SIR in the unreflowed state. | |
| TACFlux® 055 is an air reflow, halogen-free, no-clean flux used with Sn/Bi and Sn/Bi/Ag alloys. TACFlux® 055 provides excellent wetting in air and nitrogen and provides the low activation temperature... | |
| TACFlux® 089 is a no-clean flux formulated for Sn/Ag/Cu and Sn/Ag solders (also compatible with Sn/Pb solder). TACFlux® 089 provides excellent wetting in air or nitrogen atmospheres. The flux residue... | |
| TACFlux® 089HF is a no-clean flux formulated for Sn/Ag/ Cu and Sn/Ag solders (also compatible with Sn/Pb solder). TACFlux® 089HF provides excellent wetting in air or nitrogen atmospheres. The flux... | |
| TACFlux® 10 is a no-clean flux designed to be used in rework and repair, SMT component attachment, and virtually all applications where flux is required. | |
| TACFlux® 26S is a NIA halogen-free, no-clean rework flux, which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing... | |
| TACFlux® 483 is a no-clean flux formulated for SnPb solders. TACFlux® 483 provides excellent wetting (Air or Nitrogen atmosphere) to many surfaces, including Ni. Its many uses include rework/repair and... | |
| TACFlux®057 is an air reflow, halogen-free, no-clean flux used with SnBi and SnBiAg alloys. TACFlux®057 provides excellent wetting in air and nitrogen and provides the low activation temperature necessar y... | |
| The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the... | |
| The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be... | |
| Wave Solder Flux #1010 is a versatile VOC-Free water-soluble wave fl ux that provides excellent solderability on diffi cult to solder assemblies. Wave Solder Flux #1010 is biodegradable and cleans... | |
| Wave Solder Flux #66 was developed specifically for hot-dip tinning of brass and copper strip, ribbon, or tape. Wave Solder Flux #66 is considered a concentrate and may be diluted... | |
| Wave Solder Flux #NR-10-D is a low solids, rosin/ resin-free fl ux. It is specially formulated to be used for wave soldering where the cleaning process has been eliminated. Any... | |
| Wave Solder Flux 1025 is a high activity, versatile, water-soluble wave soldering fl ux formulated to maximize yields and reduce defects on surface-mount and mixed-technology assemblies. It has a broad... | |
| Wave Solder Flux 1072 is a halide-free, VOC-free, rosin flux specifically developed for wave soldering, surface mount, mixed technology and through-hole electronic assemblies. This unique formulation is a new advancement... | |
| WAVE SOLDER FLUX 1075-EXR 44 is specifically developed for Pb-Free and Sn/Pb wave soldering of surface-mount, mixed-technology and through-hole electronic assemblies. 1075-EXR 44 is water-based and non-flammable, eliminating special storage... | |
| WAVE SOLDER FLUX 1076-30 is a rosin/resin-free flux specifically developed for wave soldering, surface-mount, mixed-technology and through-hole electronic assemblies. 1076-30 is water-based and non-flammable, eliminating special storage requirements, and reducing... | |
| Wave Solder Flux 1081 is a water wash organic flux suitable for all conventional tin-lead alloys. 1081 exhibits excellent solderability with low ionic residues after aqueous cleaning | |
| Wave Solder Flux 1081-T is a water wash organic solder flux suitable for all conventional tin-lead alloys. 1081-T exhibits excellent solderability with low ionic residues after aqueous cleaning. | |
| WAVE SOLDER FLUX 1085 is a water-soluble fl ux specifi cally developed for soldering surface-mount, mixed-technology and through-hole electronic assemblies. 1085 is biodegradable and cleans readily in water to low... | |
| Wave Solder Flux 3577-TF is a low-solids flux especially formulated to eliminate post-cleaning operations. This flux contains a small amount of resin, which enhances the wetting properties. 3577-TF is activated... | |
| Wave Solder Flux 3590-TX No-Residue is a low solids, nonhalide rosin/resin-free fl ux designed to eliminate post-cleaning operations. Very effective fl ux activators provide superior solderability, reduced defects, and shiny... | |
| Wave Soldering Flux Series #2212 is designed to meet current no-clean and historic QQ-S-571F flux specifications. These fluxes are particularly effective for soldering large and thick circuit boards or for... | |
| Wave soldering is still preferred for many kinds of assembly operations, and often complements reflow assembly. Wave soldering is particularly suited to continuous production. Changes to board sizes and configurations... | |
| WF-7742 is a VOC-free, no-clean fl ux specifi cally developed for Pb-free wave soldering of surface-mount, mixed-technology and through-hole electronics assemblies. WF-7742 is a water-based, nonfl ammable formulation dramatically reducing... | |
| WF-7745 is a water-based, VOC-free, halogen-free, no-clean wave solder flux designed for wave soldering through-hole, bottom-side surface mount and mixed-technology circuit boards. It performs well with both Pb-free and SnPb... | |
| WF-9940 is Indium Corporation’s most active and heat stable low solids rosin-containing no-clean wave solder flux. WF-9940 was developed to meet the original requirements of J-STD-004 as an ROL1 and... | |
| WF-9942 is a highly active no-clean wave solder flux designed for use with through-hole and mixedtechnology assemblies. It has been effectively used in both tin-lead and lead-free soldering operations. WF-9942... | |
| WF-9945 is a halogen-free no-clean flux developed for wave soldering mixed-technology and through-hole electronics assemblies. WF-9945 is formulated to provide excellent wetting and superior hole-fill under a wide variety of... | |
| WF-9948 is a fourth generation high-performance no-clean wave solder flux designed for use with through-hole and mixed-technology assemblies. It performs well with both tin-lead and lead-free solders. While only containing... | |
| With the increased demand for flux coatings that have lower voiding, Indium Corporation has developed the next generation of flux coatings. The LV-Series of flux coatings offers low voiding, especially... |