Indium Corporation Semiconductor Solder Paste PoP Paste Indium9.88

Description
Features Eliminates defects due to package-warping Air-reflow Rheology optimized for both dipping and package-retention Designed for use with SAC305 Excellent solderability Long pot life Suitable for use down to 0.4mm pitch Introduction PoP Paste Indium9.88 is a no-clean solder paste designed for use in package-on-package (0.4mm and larger) applications. PoP Paste Indium9.88 has a rheology designed to provide a long-lasting dipping process.
Description
Features Eliminates defects due to package-warping Air-reflow Rheology optimized for both dipping and package-retention Designed for use with SAC305 Excellent solderability Long pot life Suitable for use down to 0.4mm pitch Introduction PoP Paste Indium9.88 is a no-clean solder paste designed for use in package-on-package (0.4mm and larger) applications. PoP Paste Indium9.88 has a rheology designed to provide a long-lasting dipping process.

Suppliers

Company
Product
Description
Supplier Links
Semiconductor Solder Paste - PoP Paste Indium9.88 - Indium Corporation
Clinton, NY, USA
Semiconductor Solder Paste
PoP Paste Indium9.88
Semiconductor Solder Paste PoP Paste Indium9.88
Features Eliminates defects due to package-warping Air-reflow Rheology optimized for both dipping and package-retention Designed for use with SAC305 Excellent solderability Long pot life Suitable for use down to 0.4mm pitch Introduction PoP Paste Indium9.88 is a no-clean solder paste designed for use in package-on-package (0.4mm and larger) applications. PoP Paste Indium9.88 has a rheology designed to provide a long-lasting dipping process.

Features

  • Eliminates defects due to package-warping
  • Air-reflow
  • Rheology optimized for both dipping and package-retention
  • Designed for use with SAC305
  • Excellent solderability
  • Long pot life
  • Suitable for use down to 0.4mm pitch

Introduction

PoP Paste Indium9.88 is a no-clean solder paste designed for use in package-on-package (0.4mm and larger) applications. PoP Paste Indium9.88 has a rheology designed to provide a long-lasting dipping process.

Supplier's Site

Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number PoP Paste Indium9.88
Product Name Semiconductor Solder Paste
Approvals / Conformance J-STD-004
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