Indium Corporation Semiconductor Solder Paste Indium9.72 Die-Attach Solder Paste

Description
Indium9.72 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. Normally used with high temperature alloys, Indium9.72 is designed for reflow in a forming gas or nitrogen atmosphere. This product has superior wetting capabilities and offers low voiding with minimal attention to profiling.
Description
Indium9.72 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. Normally used with high temperature alloys, Indium9.72 is designed for reflow in a forming gas or nitrogen atmosphere. This product has superior wetting capabilities and offers low voiding with minimal attention to profiling.

Suppliers

Company
Product
Description
Supplier Links
Semiconductor Solder Paste - Indium9.72 Die-Attach Solder Paste - Indium Corporation
Clinton, NY, USA
Semiconductor Solder Paste
Indium9.72 Die-Attach Solder Paste
Semiconductor Solder Paste Indium9.72 Die-Attach Solder Paste
Indium9.72 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. Normally used with high temperature alloys, Indium9.72 is designed for reflow in a forming gas or nitrogen atmosphere. This product has superior wetting capabilities and offers low voiding with minimal attention to profiling.

Indium9.72 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. Normally used with high temperature alloys, Indium9.72 is designed for reflow in a forming gas or nitrogen atmosphere. This product has superior wetting capabilities and offers low voiding with minimal attention to profiling.

Supplier's Site

Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number Indium9.72 Die-Attach Solder Paste
Product Name Semiconductor Solder Paste
Joining Process / Product Form Braze or solder in the form of a paste.
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