Indium9.72 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. Normally used with high temperature alloys, Indium9.72 is designed for reflow in a forming gas or nitrogen atmosphere. This product has superior wetting capabilities and offers low voiding with minimal attention to profiling.
| Indium Corporation | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | Indium9.72 Die-Attach Solder Paste |
| Product Name | Semiconductor Solder Paste |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
