Indium Corporation Solder Paste Indium9.91

Features: • Eliminates defects due to package-warping • Air-reflow • Rheology optimized for both dipping and package-retention • Designed for use with SAC305 and Sn63/Pb37 alloys • Excellent solderability • Long pot life • Suitable for use down to 0.3mm pitch Application Solder paste is applied to the spheres in a doctor-bladed dipping process. • Typical package-on-package applications only need dipping to 25-45% of the sphere height Care must be taken to avoid contaminating the bottom of the package itself with PoP paste, as this may cause bridging defects.