Indium Corporation No-Clean RMA-Based Flux TACFlux® for Ball Attachment

Description
TACFlux® 007, 018 and 023 are tacky fluxes designed for ball mounting onto BGA and BGA sockets.
Description
TACFlux® 007, 018 and 023 are tacky fluxes designed for ball mounting onto BGA and BGA sockets.

Suppliers

Company
Product
Description
Supplier Links
No-Clean RMA-Based Flux - TACFlux® for Ball Attachment - Indium Corporation
Clinton, NY, USA
No-Clean RMA-Based Flux
TACFlux® for Ball Attachment
No-Clean RMA-Based Flux TACFlux® for Ball Attachment
TACFlux® 007, 018 and 023 are tacky fluxes designed for ball mounting onto BGA and BGA sockets.

TACFlux® 007, 018 and 023 are tacky fluxes designed for ball mounting onto BGA and BGA sockets.

Supplier's Site

Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number TACFlux® for Ball Attachment
Product Name No-Clean RMA-Based Flux
Fluxes & Cleaners Soldering Flux / Rosin
Unlock Full Specs
to access all available technical data

Similar Products

Solder Paste Materials for Printed Circuit Boards (PCB) - ALPHA ® CVP-520 Solder Paste - MacDermid Alpha Electronics Solutions
Specs
Joining Process / Product Form Braze or solder in the form of a paste.
Solder Alloy Lead Free
View Details
Solder - 159276 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0319 inch (0.8100 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
View Details
FluxCoat® -  - Esprix Technologies
Esprix Technologies
Specs
Fluxes & Cleaners Brazing Flux
View Details
Non-Precious Brazing Filler Titanium -  - Morgan Advanced Materials
Specs
Joining Process / Product Form Powder (optional feature); Strip, sheet or foil (optional feature); Solid wire or rod (optional feature)
Melting Range 3038 F (1670 C)
View Details