Indium Corporation No-Clean RMA-Based Flux TACFlux® for Ball Attachment

Name: No-Clean RMA-Based Flux
Brand: Indium Corporation

Description

TACFlux® 007, 018 and 023 are tacky fluxes designed for ball mounting onto BGA and BGA sockets.

Description

TACFlux® 007, 018 and 023 are tacky fluxes designed for ball mounting onto BGA and BGA sockets.

Suppliers

Company

Product

Description

Supplier Links

Clinton, NY, USA

No-Clean RMA-Based Flux
TACFlux® for Ball Attachment

No-Clean RMA-Based Flux TACFlux® for Ball Attachment

TACFlux® 007, 018 and 023 are tacky fluxes designed for ball mounting onto BGA and BGA sockets.

Supplier's Site

	Indium Corporation
Product Category	Filler Alloys and Consumables
Product Number	TACFlux® for Ball Attachment
Product Name	No-Clean RMA-Based Flux
Fluxes & Cleaners	Soldering Flux / Rosin

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MacDermid Alpha Electronics Solutions

Specs

Joining Process / Product Form Powder; Flux Cored Wire

RS Components, Ltd.

Specs

Joining Process / Product Form Solid wire or rod; Wire

Diameter / Thickness 0.0472 inch (1.2 mm)

Solder Alloy Tin-Lead Alloy Solder (SN-Pb)

Sunstone Engineering

Specs

Joining Process / Product Form Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.

Welding Filler Types Nickel Alloy

Washington Alloy Co.