Indium Corporation Semiconductor Flux Flip-Chip Flux NC-26-A

Features Designed for flip-chip dipping applications Tackiness suitable for holding die during assembly Bubble-free airless packaging Ultra-low residue Halogen-free No-clean Introduction Flip-Chip Flux NC-26-A is a halogen-free, no-clean flipchip dipping flux which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing during underfill cure.