Features
Halogen-free, no-clean residue
Suitable for pin-grid array and standard ball-grid array applications
Airless packaging
Excellent solderability to all common surface metallizations
Can be used for printing, dipping, pin transfer deposition
Offers high yields and PGA bumping process
Suitable for both Pb-Free or Sn/Pb applications
Introduction
Ball Attach Flux NC-585 is a low viscosity thixotropic no-clean flux designed for use in ball attachment to substrates (BGA and PGA manufacturing). It is especially useful in applications requiring soldering to surface finishes with tenacious oxides, such as nickel. It can also be used wherever a no-clean ball attach flux is needed, and is suitable for a variety of different deposition methods.
Features
- Halogen-free, no-clean residue
- Suitable for pin-grid array and standard ball-grid array applications
- Airless packaging
- Excellent solderability to all common surface metallizations
- Can be used for printing, dipping, pin transfer deposition
- Offers high yields and PGA bumping process
- Suitable for both Pb-Free or Sn/Pb applications
Introduction
Ball Attach Flux NC-585 is a low viscosity thixotropic no-clean flux designed for use in ball attachment to substrates (BGA and PGA manufacturing). It is especially useful in applications requiring soldering to surface finishes with tenacious oxides, such as nickel. It can also be used wherever a no-clean ball attach flux is needed, and is suitable for a variety of different deposition methods.
