Indium5.7LT is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using eutectic SnBi and SnBiAg alloys. This paste is a moderate residue product with exceptional wetting capabilities. The low activation temperature of Indium5.7LT, in combination with the SnBi alloy, can be especially useful as a low temperature, Pb-free solution.
| Indium Corporation | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | Indium5.7LT Solder Paste |
| Product Name | Solder Paste |
| Joining Process / Product Form | Braze or solder in the form of a paste. |