Ball Attach Flux WS-3600 is a thixotropic flux specifically designed for pin transfer applications in ball-attach processes for BGA manufacturing. It features a rheology suitable for all sphere sizes, ensuring uniform pin transfer over extended periods. The flux is effective for both Pb-free and SnPb applications and has a powerful activator system that promotes wetting on demanding substrate metallizations. Its distinctive red color aids in automated level-sensing and visual inspection.
The product exhibits a typical viscosity of 16 kcps and passes SIR testing with results greater than 10^8 ohms after cleaning. It has a typical acid value of 78 mg KOH/g and a tack strength of 275 g. WS-3600 can be cleaned with DI water or water with added cleaner, and it is available in various packaging options, including syringes and jars. For optimal shelf life, it should be stored tip down at temperatures between -20 to +5°C. Recommended reflow profiles suggest a peak temperature of less than 350°C, with adjustments made based on specific process needs.
The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very reactive no-clean materials.
| Indium Corporation | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | WS3600 |
| Product Name | Ball Attach Flux |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
