The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very reactive no-clean materials.
| Indium Corporation | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | NC-506 |
| Product Name | Ball Attach Flux |
| Joining Process / Product Form | Braze or solder in the form of a paste. |
