Indium Corporation Solder Plated Preforms NanoFoil®

NanoFoil®, a nanotechnology material, is manufactured in a variety of forms including sheets and preforms. NanoFoil® sheets are available as standard or plated with solder.

Common foil thicknesses are 40um, 60um and 80um and range in sizes from 4” x 5” up to 43.5” x 9”. Other thicknesses with higher reaction energy are also available. Users can simply cut the foil sheets to the desired size using various methods. Information about smaller sizes and fabricated shapes are available in our preform page.

By varying the composition of the foils and the thickness of the individual layers, we can control the velocities, temperatures and total energies of these reactions. Please contact us to discuss your specific requirements.

• Standard NanoFoil® - a localized heat source that, when combined with solder performs or a solder-coated surface (<450°C), can be used to join two materials together.
• Solder-Plated NanoFoil® - standard NanoFoil® coated with 10-20μm of solder on both sides. Solder-plated NanoFoil® only requires solderable surfaces to create a bond.

NanoFoil®, a nanotechnology material, is manufactured in a variety of forms including sheets and preforms. NanoFoil® sheets are available as standard or plated with solder.

Common foil thicknesses are 40um, 60um and 80um and range in sizes from 4” x 5” up to 43.5” x 9”. Other thicknesses with higher reaction energy are also available. Users can simply cut the foil sheets to the desired size using various methods. Information about smaller sizes and fabricated shapes are available in our preform page.

By varying the composition of the foils and the thickness of the individual layers, we can control the velocities, temperatures and total energies of these reactions. Please contact us to discuss your specific requirements.

• Standard NanoFoil® - a localized heat source that, when combined with solder performs or a solder-coated surface (<450°C), can be used to join two materials together.
• Solder-Plated NanoFoil® - standard NanoFoil® coated with 10-20μm of solder on both sides. Solder-plated NanoFoil® only requires solderable surfaces to create a bond.

NanoFoil®, a nanotechnology material, is used to simplify the sputtering target bonding process in a process called NanoBonding®. NanoBonding allows target bonders and target manufacturers to make reliable and repeatable bonds while increasing margins and lowering capital expenditures.