Indium Corporation Solder Plated Preforms NanoFoil®

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Solder Plated Preforms - NanoFoil® - Indium Corporation
Clinton, NY, USA
Solder Plated Preforms
NanoFoil®
Solder Plated Preforms NanoFoil®
NanoFoil®, a nanotechnology material, is manufactured in a variety of forms including sheets and preforms. NanoFoil® sheets are available as standard or plated with solder. Common foil thicknesses are 40um, 60um and 80um and range in sizes from 4” x 5” up to 43.5” x 9”. Other thicknesses with higher reaction energy are also available. Users can simply cut the foil sheets to the desired size using various methods. Information about smaller sizes and fabricated shapes are available in our preform page. By varying the composition of the foils and the thickness of the individual layers, we can control the velocities, temperatures and total energies of these reactions. Please contact us to discuss your specific requirements. Standard NanoFoil® - a localized heat source that, when combined with solder performs or a solder-coated surface (<450°C), can be used to join two materials together. Solder-Plated NanoFoil® - standard NanoFoil® coated with 10-20μm of solder on both sides. Solder-plated NanoFoil® only requires solderable surfaces to create a bond.

NanoFoil®, a nanotechnology material, is manufactured in a variety of forms including sheets and preforms. NanoFoil® sheets are available as standard or plated with solder.

Common foil thicknesses are 40um, 60um and 80um and range in sizes from 4” x 5” up to 43.5” x 9”. Other thicknesses with higher reaction energy are also available. Users can simply cut the foil sheets to the desired size using various methods. Information about smaller sizes and fabricated shapes are available in our preform page.

By varying the composition of the foils and the thickness of the individual layers, we can control the velocities, temperatures and total energies of these reactions. Please contact us to discuss your specific requirements.

  • Standard NanoFoil® - a localized heat source that, when combined with solder performs or a solder-coated surface (<450°C), can be used to join two materials together.
  • Solder-Plated NanoFoil® - standard NanoFoil® coated with 10-20μm of solder on both sides. Solder-plated NanoFoil® only requires solderable surfaces to create a bond.
Supplier's Site
Solder Plated Sheets - NanoFoil® - Indium Corporation
Clinton, NY, USA
Solder Plated Sheets
NanoFoil®
Solder Plated Sheets NanoFoil®
NanoFoil®, a nanotechnology material, is manufactured in a variety of forms including sheets and preforms. NanoFoil® sheets are available as standard or plated with solder. Common foil thicknesses are 40um, 60um and 80um and range in sizes from 4” x 5” up to 43.5” x 9”. Other thicknesses with higher reaction energy are also available. Users can simply cut the foil sheets to the desired size using various methods. Information about smaller sizes and fabricated shapes are available in our preform page. By varying the composition of the foils and the thickness of the individual layers, we can control the velocities, temperatures and total energies of these reactions. Please contact us to discuss your specific requirements. Standard NanoFoil® - a localized heat source that, when combined with solder performs or a solder-coated surface (<450°C), can be used to join two materials together. Solder-Plated NanoFoil® - standard NanoFoil® coated with 10-20μm of solder on both sides. Solder-plated NanoFoil® only requires solderable surfaces to create a bond.

NanoFoil®, a nanotechnology material, is manufactured in a variety of forms including sheets and preforms. NanoFoil® sheets are available as standard or plated with solder.

Common foil thicknesses are 40um, 60um and 80um and range in sizes from 4” x 5” up to 43.5” x 9”. Other thicknesses with higher reaction energy are also available. Users can simply cut the foil sheets to the desired size using various methods. Information about smaller sizes and fabricated shapes are available in our preform page.

By varying the composition of the foils and the thickness of the individual layers, we can control the velocities, temperatures and total energies of these reactions. Please contact us to discuss your specific requirements.

  • Standard NanoFoil® - a localized heat source that, when combined with solder performs or a solder-coated surface (<450°C), can be used to join two materials together.
  • Solder-Plated NanoFoil® - standard NanoFoil® coated with 10-20μm of solder on both sides. Solder-plated NanoFoil® only requires solderable surfaces to create a bond.
Supplier's Site
Sputter Target Bonding - NanoFoil® - Indium Corporation
Clinton, NY, USA
Sputter Target Bonding
NanoFoil®
Sputter Target Bonding NanoFoil®
NanoFoil®, a nanotechnology material, is used to simplify the sputtering target bonding process in a process called NanoBonding®. NanoBonding allows target bonders and target manufacturers to make reliable and repeatable bonds while increasing margins and lowering capital expenditures.

NanoFoil®, a nanotechnology material, is used to simplify the sputtering target bonding process in a process called NanoBonding®. NanoBonding allows target bonders and target manufacturers to make reliable and repeatable bonds while increasing margins and lowering capital expenditures.

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Technical Specifications

  Indium Corporation Indium Corporation
Product Category Filler Alloys and Consumables Filler Alloys and Consumables
Product Number NanoFoil® NanoFoil®
Product Name Solder Plated Preforms Solder Plated Sheets
Joining Process / Product Form Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces. Sheets
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