Techsil Limited Datasheets for Thermoset Adhesives
Thermoset adhesives are crosslinked polymeric resins that are cured using heat and/or heat and pressure. They are used for high load assemblies and in severe service conditions.
Thermoset Adhesives: Learn more
Product Name | Notes |
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Devcon 2 Ton Epoxy Clear (20222) 200ml Cartridge -- ITEP14020 | Devcon 2 Ton epoxy is an extremely strong, medium cure, water resistant epoxy adhesive and surface filler for metals, ceramics, woods, concrete, glass etc. 2 Ton Epoxy is a general... |
Devcon 2 Ton Epoxy Clear (14260) 50ml Cartridge -- ITEP14014 | Devcon 2 Ton Epoxy is extremely strong, medium cure, water resistant epoxy adhesive and surface filler for metals, ceramics, wood, concrete, glass etc. General purpose. It dries clear to achieve... |
Devcon 5 Minute Epoxy (14251) 25ml - 28gm Devtube -- ITEP14011 | Devcon 5 minute epoxy is a rapid curing multi purpose adhesive and encapsulating resin. It bonds rigid, durable substrates such as metal, glass, ceramics, concrete, and wood in minutes. The... |
Devcon 5 Minute Epoxy (14270) 50ml Cartridge -- ITEP14012 | Devcon 5 minute epoxy is a rapid curing multi purpose adhesive and encapsulating resin. It bonds rigid, durable substrates such as metal, glass, ceramics, concrete, and wood in minutes. This... |
Devcon Wear Resistant Epoxy Putty (WR-2) 500gm -- ITEP14026 | Devcon Wear Resistant Putty is a smooth, non-rusting ceramic-filled epoxy putty used to repair and rebuild interfacing metallic, low-friction surfaces such as machine ways and flanges. This product will repair... |
LOCTITE® 3513 Underfill Epoxy Adhesive 20ml -- HEEP50004
LOCTITE® 3513 Underfill Epoxy Adhesive 30ml -- HEEP50005 |
LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP (FBGA) or BGA. Product Benefits Cures rapidly on exposure to heat Low... |
MG Chemicals Med Cure Thermal Epoxy Adhesive 6ml -- MGEP00014
MG Chemicals Thermal Conductive Epoxy 50ml -- MGEP00002 |
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade... |
MG Chemicals Slow Cure Thermal Epoxy Adhesive 6ml -- MGEP00003 | MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade... |
MG Chemicals Silver Conductive Epoxy (10 Min) 19gm -- MGEP00004 | MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and... |
MG Chemicals Silver Conductive Epoxy (4 Hour) 21gm -- MGEP00005
MG Chemicals Silver Conductive Epoxy (4 Hour)125gm -- MGEP00008 |
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured... |
MG Chemicals 8331 Silver Conductive Epoxy 115gm -- MGEP00007
MG Chemicals Silver Conductive Epoxy (10 Min) 14gm -- MGEP00006 |
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive... |
Panacol Vitralit UC 1619 UV Curable Epoxy 30gm -- PNVI00023 | Panacol Vitralit® UC 1619 is a uv-curable compound designed for opto-electronic components like LED and VCSEL. This product features excellent transmission (650-1300nm) along with ionic pureness, non-yellowing and extremely good... |
Techsil® EP20860 Clear Rapid Epoxy Adhesive 50ml -- TEEP14131 | Techsil® EP20860 is a two part, rapid curing epoxy adhesive that cures at room temperature with low shrinkage and forms an ultra-clear bond line. Techsil® EP20860 offers a flexible and... |
Techsil® EP21480 Black UL Approved Epoxy 250gm -- TEEP14133 | Techsil® EP21480 is a two part epoxy resin systems that cures at room temperature to a high gloss black finish. It is flame retardant and thermally conductive. This resin system... |