- Trained on our vast library of engineering resources.

Techsil Limited MG Chemicals Thermal Conductive Epoxy 50ml MGEP00002

Description
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and thermal. 8329TCM epoxy has many uses, its excellent conductivity improves thermal management for modern high powered devices which in turn increases their long term reliability. Ideal for thermal management applications where superior bonding strength is required alongside good thermal transfer. Strong water and chemical resistance. Product Benefits Thermal conductivity: 1.36 W/(m·K) 1:1 mix ratio Working time: 45 minutes Cure time: 1 hour at 65°C, or 24 hours at room temperature Good adhesive strength Strong resistance to water, brine, acids, bases, and aliphatic hydrocarbons Room temperature storage
Datasheet

Suppliers

Company
Product
Description
Supplier Links
MG Chemicals Thermal Conductive Epoxy 50ml - MGEP00002 - Techsil Limited
Bidford on Avon, United Kingdom
MG Chemicals Thermal Conductive Epoxy 50ml
MGEP00002
MG Chemicals Thermal Conductive Epoxy 50ml MGEP00002
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and thermal. 8329TCM epoxy has many uses, its excellent conductivity improves thermal management for modern high powered devices which in turn increases their long term reliability. Ideal for thermal management applications where superior bonding strength is required alongside good thermal transfer. Strong water and chemical resistance. Product Benefits Thermal conductivity: 1.36 W/(m·K) 1:1 mix ratio Working time: 45 minutes Cure time: 1 hour at 65°C, or 24 hours at room temperature Good adhesive strength Strong resistance to water, brine, acids, bases, and aliphatic hydrocarbons Room temperature storage

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and thermal.

8329TCM epoxy has many uses, its excellent conductivity improves thermal management for modern high powered devices which in turn increases their long term reliability. Ideal for thermal management applications where superior bonding strength is required alongside good thermal transfer. Strong water and chemical resistance.

Product Benefits

  • Thermal conductivity: 1.36 W/(m·K)
  • 1:1 mix ratio
  • Working time: 45 minutes
  • Cure time: 1 hour at 65°C, or 24 hours at room temperature
  • Good adhesive strength
  • Strong resistance to water, brine, acids, bases, and aliphatic hydrocarbons
  • Room temperature storage
Supplier's Site Datasheet

Technical Specifications

  Techsil Limited
Product Category Industrial Adhesives
Product Number MGEP00002
Product Name MG Chemicals Thermal Conductive Epoxy 50ml
Cure / Technology Thermoset
Unlock Full Specs
to access all available technical data

Similar Products

Low Thermal Resistance Carbon Fiber Thermal Gap Pad for Semiconductor Heat Sinks - CSF45 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details
High Temperature Resistant, Two Component Epoxy - EP30HT - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Heat Transfer Compound - NH Nonhardening - Thermon, Inc
Specs
Cure / Technology Single Component
Type / Form Liquid
Features Gap Filler, Foam in Place Gasket; Thermally Conductive
View Details