Techsil Limited MG Chemicals Med Cure Thermal Epoxy Adhesive 6ml MGEP00014

MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and thermal. 8329TCM epoxy has many uses, its excellent conductivity improves thermal management for modern high powered devices which in turn increases their long term reliability. Ideal for thermal management applications where superior bonding strength is required alongside good thermal transfer. Strong water and chemical resistance. Product Benefits Thermal conductivity: 1.36 W/(m·K) 1:1 mix ratio Working time: 45 minutes Cure time: 1 hour @ 65°C, or 24 hours at room temperature Good adhesive strength Strong resistance to water, brine, acids, bases, and aliphatic hydrocarbons Room temperature storage