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Matexcel Datasheets for Microscopy and Metallography Sample Preparation Equipment

Microscopy sample preparation equipment and metallography sample preparation equipment is used for the preparation of samples for metallographic or microscopic inspection and analysis.
Microscopy and Metallography Sample Preparation Equipment: Learn more

Product Name Notes
Pitch: <1nm-20nm Surface feature: Gold particles Substrate: Carbon Mounting: Carbon Planchet Mounted
Pitch: <1nm-20nm Surface feature: Gold particles Substrate: Carbon Mounting: Hitachi Mounted
Pitch: <1nm-20nm Surface feature: Gold particles Substrate: Carbon Mounting: ISI Mounted
Pitch: <1nm-20nm Surface feature: Gold particles Substrate: Carbon Mounting: JEOL Mounted
Pitch: <1nm-20nm Surface feature: Gold particles Substrate: Carbon Mounting: Pin Mounted
Pitch: 10-40 nm Surface feature: Tin Substrate: Carbon Mounting: Hitachi Mounted
Pitch: 10-40 nm Surface feature: Tin Substrate: Carbon Mounting: ISI Mounted
Pitch: 10-40 nm Surface feature: Tin Substrate: Carbon Mounting: JEOL Mounted
Pitch: 10-40 nm Surface feature: Tin Substrate: Carbon Mounting: Pin Mounted
Pitch: 144nm Surface feature: Aluminum bumps Substrate: Silicon (4x3 mm die. Bump height (about 90 nm) and width (about 75 nm) are not calibrated.) Mounting: Mounted on JEOL 3/8" (9.5...
Pitch: 144nm Surface feature: Aluminum bumps Substrate: Silicon (4x3 mm die. Bump height (about 90 nm) and width (about 75 nm) are not calibrated.) Mounting: Mounted on on 12mm Steel...
Pitch: 144nm Surface feature: Aluminum bumps Substrate: Silicon (4x3 mm die. Bump height (about 90 nm) and width (about 75 nm) are not calibrated.) Mounting: Mounted on Topcon 15 mm...
Pitch: 144nm Surface feature: Aluminum bumps Substrate: Silicon (4x3 mm die. Bump height (about 90 nm) and width (about 75 nm) are not calibrated.) Mounting: Unmounted or unmounted on 12...
Pitch: 144nm Surface feature: Aluminum bumps Substrate: Silicon Mounting: Mounted on AMRAY Pin-Type Mount 12.7 (table)X3.2(pin diameter)X15mm (pin length)
Pitch: 144nm Surface feature: Aluminum bumps Substrate: Silicon Mounting: Mounted on FEI/Leica/LEO/Cambri dge/Philips Pin-Type Mount 25.4 tableX3.2 diameterX7.5mm length
Pitch: 144nm Surface feature: Aluminum bumps Substrate: Silicon Mounting: Mounted on Hitachi Threaded Mount, 26 mm round, 6 mm
Pitch: 144nm Surface feature: Aluminum bumps Substrate: Silicon Mounting: Mounted on Universal 1" (25.4 mm) round x 20 mm high
Pitch: 144nm Surface feature: Aluminum lines Substrate: Glass (4x6 mm. Line height (about 100 nm) and line width (about 75 nm) are not calibrated.) Mounting: Mounted on 12mm Steel Disk...
Pitch: 145nm Surface feature: Aluminum lines Substrate: Glass (4x6 mm. Line height (about 100 nm) and line width (about 75 nm) are not calibrated.) Mounting: Unmounted
Pitch: 145nm Surface feature: Aluminum lines Substrate: Glass (4x6mm dimensions. Line height (about 100nm) and line width (about 75nm)) Mounting: Mounted on 12mm steel disk
Pitch: 145nm Surface feature: Aluminum lines Substrate: Glass Mounting: Unmounted
Pitch: 2-30nm Surface feature: Gold particles Substrate: Graphite Mounting: Carbon Planchet Mounted
Pitch: 2-30nm Surface feature: Gold particles Substrate: Graphite Mounting: Hitachi Mounted
Pitch: 2-30nm Surface feature: Gold particles Substrate: Graphite Mounting: ISI Mounted
Pitch: 2-30nm Surface feature: Gold particles Substrate: Graphite Mounting: JEOL Mounted
Pitch: 2-30nm Surface feature: Gold particles Substrate: Graphite Mounting: Pin Mounted
Pitch: 288nm Surface feature: Photoresist Parallel Ridges Substrate: Silicon Mounting: Mounted on 12 or 15 mm steel disk
Pitch: 292 nm Surface feature: Titanium lines Substrate: Silicon (3 x 4mm. Line height: approximately 30 nm (not calibrated). Line width: Approximately 130 nm (not calibrated).) Mounting: AMRAY Pin-Mounted
Pitch: 292 nm Surface feature: Titanium lines Substrate: Silicon (3 x 4mm. Line height: approximately 30 nm (not calibrated). Line width: Approximately 130 nm (not calibrated).) Mounting: FEI 1506 Pin-Mounted...
Pitch: 292 nm Surface feature: Titanium lines Substrate: Silicon (3 x 4mm. Line height: approximately 30 nm (not calibrated). Line width: Approximately 130 nm (not calibrated).) Mounting: Hitachi Pin-Mounted
Pitch: 292 nm Surface feature: Titanium lines Substrate: Silicon (3 x 4mm. Line height: approximately 30 nm (not calibrated). Line width: Approximately 130 nm (not calibrated).) Mounting: Universal 1510 Mounted...
Pitch: 292 nm Surface feature: Titanium lines Substrate: Silicon (3 x 4mm. Line height: approximately 30 nm (not calibrated). Line width: Approximately 130 nm (not calibrated).) Mounting: Unmounted or mounted...
Pitch: 292 nm Surface feature: Titanium lines Substrate: Silicon (3 x 4mm. Line height: approximately 30 nm (not calibrated). Line width: Approximately 130 nm (not calibrated). Mounting: Unmounted
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon (4x3mm dimensions. Line height (about 30nm) and line width (130nm)) Mounting: Mounted on 12mm steel disk
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon Mounting: Mounted (12.2mm dia. x 10mm Cylinder, JEOL_
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon Mounting: Mounted (15mm dia. x 10mm Cylinder, JEOL, ISI/ABT/TOPCON)
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon Mounting: Mounted (15mm dia. x 15mm Cylinder, JEOL, ISI/ABT/TOPCON)
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon Mounting: Mounted (15mm dia. x 6mm Cylinder, M4 Hitachi, Agilent / Keysight)
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon Mounting: Mounted (25mm dia. x 10mm Cylinder, JEOL)
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon Mounting: Mounted (25mm dia. x 6mm Cylinder, M4 Hitachi, Agilent / Keysight)
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon Mounting: Mounted (31.7mm dia. x 6.47mm, Cambridge S4 Mount)
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon Mounting: Mounted (9.5mm dia. x 9.5mm Cylinder, JEOL)
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon Mounting: Mounted (Customized)
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon Mounting: Mounted (Head dia.=12.7mm; Pin dia.=3.2mm; Pin length=14.3mm, AMRAY)
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon Mounting: Pin Mounted (12.7mm dia. x 15.7mm height, AMRAY special slotted head)
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon Mounting: Pin Mounted (12.7mm x 3.2mm pin. Pin length=6mm, ZEISS/LEO SEMS FESEMs/FIBS)
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon Mounting: Pin Mounted (Head dia.=12.7mm; Pin dia.=3.2mm; Pin length= 7.9mm, FEI/Philips, Cambridge, Leica, TESCAN, CAMSCAN, ASPEX, Phenom
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon Mounting: Pin Mounted (Head dia.=25.4mm; pin=3.2mm, FEI/Philips, Cambridge, Leica, TESCAN, CAMSCAN, ASPEX, Phenom)
Pitch: 292nm Surface feature: Titanium lines Substrate: Silicon Mounting: Unmounted
Pitch: 297 nm Surface feature: Al bumps Substrate: Silicon Mounting: Mounted on 12 or 15 mm steel disk
Pitch: 297 nm Surface feature: Aluminum bumps Substrate: Silicon (4x3 mm die. Bump height (about 100 nm) is not calibrated.) Mounting: Unmounted
Pitch: 297 nm Surface feature: Aluminum bumps Substrate: Silicon Mounting: Mounted 4x3 mm die. Bump height (about 100 nm) is not calibrated.
Pitch: 297 nm Surface feature: Aluminum bumps Substrate: Silicon Mounting: Mounted on 12mm Steel Disk
Pitch: 297 nm Surface feature: Aluminum bumps Substrate: Silicon Mounting: Mounted on AMRAY Pin-Type Mount 12.7 (table)X3.2(pin diameter)X15mm (pin length)
Pitch: 297 nm Surface feature: Aluminum bumps Substrate: Silicon Mounting: Mounted on Hitachi Threaded Mount, 26 mm round, 6 mm
Pitch: 297 nm Surface feature: Aluminum bumps Substrate: Silicon Mounting: Mounted on mounted on FEI/Leica/LEO/Cambri dge/Philips Pin-Type Mount 25.4 tableX3.2 diaX7.5mm
Pitch: 297 nm Surface feature: Aluminum bumps Substrate: Silicon Mounting: Mounted on Universal 1\" (25.4 mm) round x 20 mm high
Pitch: 300nm Surface feature: Ti lines Substrate: Silicon Mounting: Unmounted or mounted samples using standard aluminum pin type stubs.
Pitch: 300nm Surface feature: Tungsten lines Substrate: Silicon (Physical Size 3mm x 4mm x 0.5mm) Mounting: Unmounted or mounted samples using standard aluminum pin type stubs.
Pitch: 5-150nm Surface feature: Gold particle Substrate: Graphite Mounting: JEOL Mounted
Pitch: 5-150nm Surface feature: Gold particle Substrate: Graphite Mounting: Pin Mounted
Pitch: 5-150nm Surface feature: Gold particles Substrate: Graphite Mounting: Carbon Planchet Mounted
Pitch: 5-150nm Surface feature: Gold particles Substrate: Graphite Mounting: Hitachi Mounted
Pitch: 5-150nm Surface feature: Gold particles Substrate: Graphite Mounting: ISI Mounted
Pitch: 70 nm Surface feature: Silicon Oxide ridges Substrate: Silicon (4x3 mm die. Ridge height (about 35 nm) and width (about 35 nm) are not calibrated. ) Mounting: Unmounted
Pitch: 70 nm Surface feature: Silicon Oxide ridges Substrate: Silicon Mounting: Mounted JEOL 3/8\" (9.5 mm) round mounts x 9.5 mm high
Pitch: 70 nm Surface feature: Silicon Oxide ridges Substrate: Silicon Mounting: Mounted mounted FEI/Leica/LEO/Cambri dge/Philips Pin-Type Mount 12.7(table)X3.2(pin) X 8.0mm(length)
Pitch: 70 nm Surface feature: Silicon Oxide ridges Substrate: Silicon Mounting: Mounted on 12 mm Steel Disk
Pitch: 70 nm Surface feature: Silicon Oxide ridges Substrate: Silicon Mounting: Mounted on AMRAY Pin-Type Mount 12.7 (table)X3.2(pin)X 15mm (length)
Pitch: 70 nm Surface feature: Silicon Oxide ridges Substrate: Silicon Mounting: Mounted on Hitachi Threaded Mount, 26 mm round, 6 mm
Pitch: 70 nm Surface feature: Silicon Oxide ridges Substrate: Silicon Mounting: Mounted on Topcon 15 mm round mounts, 10 mm high
Pitch: 70 nm Surface feature: Silicon Oxide ridges Substrate: Silicon Mounting: Mounted on Universal 1\" (25.4 mm) round x 20 mm high
Pitch: 700 nm Surface feature: Array of Posts covered with Tungsten Substrate: Silicon Mounting: Mounted on 12 or 15 mm steel disk
Pitch: 700 nm Surface feature: Hardened photoresist ridges covered with Tungsten Substrate: Silicon (3 x 4mm. Line height: approximately 30 nm (not calibrated). Line width: Approximately 130 nm (not calibrated).)...
Pitch: 700 nm Surface feature: Hardened photoresist ridges covered with Tungsten Substrate: Silicon Mounting: Mounted on 12 or 15 mm steel disk
Pitch: 700nm Surface feature: Alternating lines of Titanium and Silicon. Substrate: Silicon Mounting: Unmounted or mounted samples using standard aluminum pin type stubs.
Pitch: 700nm Surface feature: Tungsten lines Substrate: Silicon Mounting: Unmounted or mounted samples using standard aluminum pin type stubs.