Master Bond, Inc. Dual Curing, Thixotropic Adhesive UV22DC80-10F

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Dual Curing, Thixotropic Adhesive - UV22DC80-10F - Master Bond, Inc.
Hackensack, NJ, USA
Dual Curing, Thixotropic Adhesive UV22DC80-10F
One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength.
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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number UV22DC80-10F
Product Name Dual Curing, Thixotropic Adhesive
Viscosity 8000 to 12000 cP
Composition Filled
Use Temperature -60 to 350 F (-51 to 177 C)
Tensile (Break) 6000 to 8000 psi (41369 to 55158 KPa)
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
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