Master Bond, Inc. Dual Curing, Thixotropic Adhesive UV22DC80-10F

Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Dual Curing, Thixotropic Adhesive - UV22DC80-10F - Master Bond, Inc.
Hackensack, NJ, USA
Dual Curing, Thixotropic Adhesive UV22DC80-10F
One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength.
Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number UV22DC80-10F
Product Name Dual Curing, Thixotropic Adhesive
Viscosity 8000 to 12000 cP
Composition Filled
Use Temperature -60 to 350 F (-51 to 177 C)
Tensile (Break) 6000 to 8000 psi (41369 to 55158 KPa)
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
Unlock Full Specs
to access all available technical data

Similar Products