One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength.
Master Bond, Inc.
Dual Curing, Thixotropic Adhesive
8000 to 12000 cP
-60 to 350 F (-51 to 177 C)
6000 to 8000 psi (41369 to 55158 KPa)
Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's