Master Bond, Inc. Dual Curing, Thixotropic Adhesive UV22DC80-10F

Description
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength.
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Description
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Dual Curing, Thixotropic Adhesive - UV22DC80-10F - Master Bond, Inc.
Hackensack, NJ, USA
Dual Curing, Thixotropic Adhesive
UV22DC80-10F
Dual Curing, Thixotropic Adhesive UV22DC80-10F
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength.

One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number UV22DC80-10F
Product Name Dual Curing, Thixotropic Adhesive
Cure / Technology UV or Radiation Cured; Single Component; Dual Curing
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Composition Filled
Features High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill; Leveling Filling; Non-corrosive; Phase Change; Thermally Conductive
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