20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2121 will cushion and protect sensitive electronic components. It will impart very little stress on components during cure or thermal cycling.
The 20-2121 Polyurethane meets the Food and Drug Administration (FDA) regulations permitting use in food contact applications. The raw materials used in this product comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300.
The base Natural Oil Polyol (NOP) used in 20-2121 is obtained directly from a plant source without chemical modifications. Due to the raw materials selected, this product is low in toxicity and considered a GREEN potting compound. Using renewable resources such as NOPs will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide.
| Epoxies Etc... | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | 20-2121 |
| Product Name | Elastomeric potting & encapsulating compound |
| Type | High Dielectric; Thermally Conductive |
| Cure / Technology | Thermoset; Two Component ; Room Temperature Vulcanizing or Curing |
| Chemical System | Polyurethane |
| Industry | Sanitary; OEM or Industrial |
| Use Temperature | -22 to 257 F (-30 to 125 C) |
