Xoxide Datasheets for Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more
| Product Name | Notes |
|---|---|
| Features: Ultimate Heat Conductivity Non-Electrical Conductive Non-Corrosive & Non-Curring No Bleeding & User Friendly GELID Applicator Net Content of 3.5g Created for Extreme Users on highest level the GC- Extreme... | |
| Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide... | |
| Introducing Arctic Silver 5 - With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. | |
| Introducing Arctic Silver 5 With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Arctic... | |
| Introducing Innovation Cooling's latest offering, the IC Perihelion! This high-performance ceramic thermal compound features a ceramic base with a high bulk loading of over 91% to prevent pump out due... | |
| Offering increased adhesiveness for ridiculously easy application, the Thermalright Chill Factor 2 Thermal Compound is a durable, long-lasting tool that you can apply with no fuss and little mess. The... | |
| The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Features: Tri-Linear Ceramic Content: Like the original Céramique, Céramique 2 uses only ceramic... | |
| The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Made with micronized aluminum oxide, boron nitride and zinc oxide. Ceramique uses a... | |
| The NT-H1 from Noctua is a pro-grade TIM solution for those who crave the right evacuation plan for their CPU heat. The perfect compound for the serious enthusiast who demands... | |
| Tuniq TX-2 High Performance Thermal Compound achieves the best interface between your CPU and the heatsinks by its unique designed molecular size and shape. Without any metal or electric conductive,... | |
| Why settle for silver, when you could have Diamond? The IC Diamond 7 from Innovation Cooling consists of over 92% micronized synthetic diamond, which has over five times the... |