Xoxide Datasheets for Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more
| Product Name | Notes |
|---|---|
| Gelid GC Extreme Thermal Compound -- 70711 | Features: Ultimate Heat Conductivity Non-Electrical Conductive Non-Corrosive & Non-Curring No Bleeding & User Friendly GELID Applicator Net Content of 3.5g Created for Extreme Users on highest level the GC- Extreme... |
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Arctic Alumina Thermal Compound (1.75 gram) -- 407
Arctic Alumina Thermal Compound (14 gram) -- 408 |
Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide... |
| Arctic Silver 5 Thermal Compound (3.5 gram) -- 402 | Introducing Arctic Silver 5 - With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. |
| Arctic Silver 5 Thermal Compound (12 gram) -- 405 | Introducing Arctic Silver 5 With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Arctic... |
| IC Perihelion High-Performance Ceramic Thermal Compound -- 70256 | Introducing Innovation Cooling's latest offering, the IC Perihelion! This high-performance ceramic thermal compound features a ceramic base with a high bulk loading of over 91% to prevent pump out due... |
| Thermalright Chill Factor 2 Thermal Compound -- 130981 | Offering increased adhesiveness for ridiculously easy application, the Thermalright Chill Factor 2 Thermal Compound is a durable, long-lasting tool that you can apply with no fuss and little mess. The... |
| Arctic Silver Ceramique 2 Thermal Compound (2.7 gram) -- 70953 | The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Features: Tri-Linear Ceramic Content: Like the original Céramique, Céramique 2 uses only ceramic... |
| Arctic Silver Ceramique Thermal Compound (2.5 gram) -- 400 | The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. Made with micronized aluminum oxide, boron nitride and zinc oxide. Ceramique uses a... |
| Noctua NT-H1 Thermal Compound -- 80315 | The NT-H1 from Noctua is a pro-grade TIM solution for those who crave the right evacuation plan for their CPU heat. The perfect compound for the serious enthusiast who demands... |
| Tuniq TX-2 High Performance Thermal Compound -- 24103 | Tuniq TX-2 High Performance Thermal Compound achieves the best interface between your CPU and the heatsinks by its unique designed molecular size and shape. Without any metal or electric conductive,... |
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IC Diamond 24 High- Performance Thermal Compound 4.8g -- 70258
IC Diamond 7 High-Performance Thermal Compound 1.5g -- 70257 |
Why settle for silver, when you could have Diamond? The IC Diamond 7 from Innovation Cooling consists of over 92% micronized synthetic diamond, which has over five times the... |