Henkel Corporation - Electronics Datasheets for Electrical and Electronic Resins

Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Electrical and Electronic Resins: Learn more

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Product Name Notes
(Known as Ablebond 2035SC ) LOCTITE ABLESTIK 2035SC is non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize...
(Known as Ablebond 2053S ) LOCTITE ABLESTIK 2053S is a low stress adhesive for die-to-substrate applications.
(Known as Ablebond 2300 ) LOCTITE ABLESTIK 2300 is an ultra low moisture absorption, low stress adhesive.
(Known as ABLEBOND 8175Q ) LOCTITE ABLESTIK 8175Q is an electrically conductive, paste adhesive designed for solder replacement in microelectronic interconnect applications
(Known as Ablebond 8350R ) LOCTITE ABLESTIK 8350R is a snap curable die attach adhesive designed to provide anti-delamination and package reliability.
(Known as Ablebond 8384 ) LOCTITE ABLESTIK 8384 is a die attach adhesive is designed for smart card applications.
(Known as Ablebond 84-1LMISR3 ) LOCTITE ABLESTIK 84-1LMISR3 electrically conductive adhesive is designed for die attach applications. It is a low viscosity and higher thixotropic index version of ABLEBOND 84-1LMIS.
(Known as Ablebond 84-1LMIT1 ) LOCTITE ABLESTIK 84-1LMIT1 is a fast, low temperature cure electrically & thermally conductive adhesive. Ideally suited for low stress die & component attaching, this adhesive...
(Known as Ablebond 84-3 ) LOCTITE ABLESTIK 84-3 is an exceptionally low thermal resistance. Superior contact resistance and adhesion stability on Sn, SnPb and OSP Cu. Very low weight loss...
(Known as Ablebond 969-1 ) LOCTITE ABLESTIK 969-1 is an electrically conductive preimidized adhesive designed for semiconductor die attach. It is not recommended for use in hermetic packages.
(Known as ABLESTIK ABLEBOND 16-1 ) LOCTITE ABLESTIK 16-1 is a two-component, electrically conductive epoxy adhesive designed for general purpose applications. It cures at room temperature while providing a reasonable...
(Known as ABLESTIK ABLEBOND 2000 ) LOCTITE ABLESTIK 2000 electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the...
(Known as Ablestik ABLEBOND 2000B ) LOCTITE ABLESTIK 2000B is an electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to...
(Known as ABLESTIK ABLEBOND 3005 ) LOCTITE ECCOBOND 3005 adhesive is designed for lid attach in flip chip BGA applications. The combination of product features result in superior flip chip...
(Known as ABLESTIK ABLEBOND 3230A ) LOCTITE ABLESTIK 3230A adhesive die attach is designed for semiconductor packaging applications where high electrical conductivity is not required. It can be used in...
(Known as ABLESTIK ABLEBOND 8350M ) LOCTITE ABLESTIK 8350M electrically conductive one component die attach adhesive has been formulated for use in high throughput die attach applications.
(Known as ABLESTIK ABLEBOND 8387A ) LOCTITE ABLESTIK 8387A is a non-conductive die attach adhesive designed for high throughput smart card bonding applications.
(Known as ABLESTIK ABLEBOND 8387B-1B2 ) LOCTITE ABLESTIK 8387B-1B2 non-conductive die attach adhesive contains 50 μm polymer spacers for bondline control. It contains a black pigmentation for blocking stray light.
(Known as ABLESTIK ABLEBOND 8387BS ) LOCTITE ABLESTIK 8387BS is a single component adhesive is designed for high throughput bonding applications. It contains spacers for improved bondline control.
(Known as ABLESTIK ABLEBOND 85-1 ) Gold-filled, high reliability conductive adhesive for critical applications.
(Known as Ablestik ABLEBOND 8900NC ) LOCTITE ABLESTIK 8900NC is a die attach adhesive has been formulated for use in high throughput die attach applications. Actual performance will depend on...
(Known as ABLESTIK ABLEBOND FS849-TI ) LOCTITE ABLESTIK FS 849-TI is a high thermal conductivity adhesive with low electrical resistanc
(Known as Ablestik ABLECOAT 8008HT ) LOCTITE ABLESTIK 8008HT is a high thermal conductivity snap cure adhesive utilizing wafer backside coating technology.
(Known as ABLESTIK ABLEFILL UF8807 ) One component, high flow liquid underfill encapsulant with superior moisture resistance.
(Known as ABLESTIK ABLEFILM 561 ) LOCTITE ABLESTIK 561 is a thermally conductive epoxy film designed for bonding materials with mismatched coefficients of thermal expansion.
(Known as Ablestik ABLEFILM 561K ) High adhesion strength with excellent flexibility for bonding mismatched CTE materials.
(Known as Ablestik ABLEFILM ECF561E ) LOCTITE ABLESTIK ECF 561E is the most flexible of the fiberglass-supported electrically conductive products.
(Known as Ablestik ABP 8064T ) LOCTITE ABLESTIK ABP 8064T highly filled, conductive die attach paste adhesive is designed to provide high thermal and electrical conductivity in the attachment of...
(Known as ABLESTIK ABP 8611 Die attach adhesive ) LOCTITE ABLESTIK ABP 8611 adhesive is designed for die attach applications as well as component attach. Its high dielectric property helps...
(Known as Ablestik ATB-115US ) LOCTITE ABLESTIK ATB 115US adhesive film (15 µm) is formulated for use in wafer lamination processess and preform decal. It is designed for use in...
(Known as Ablestik ATB-120 ) LOCTITE ABLESTIK ATB 120 is a single layer format die attach film (20 µm).
(Known as ABLESTIK ICP 3601 ) LOCTITE ABLESTIK ICP 3601 electrically conductive epoxy paste is specifically formulated for capacitor component assembly. It has excellent contact resistance and high bond strength.
(Known as ABLESTIK ICP-3535M1 ) LOCTITE ABLESTIK ICP 3535M1 is an electrically conductive adhesive is designed for circuit assembly applications. It is specially recommended for mounting lower cost tin (Sn)...
(Known as Ablestik ICP-4298 ) LOCTITE ABLESTIK ICP 4298 is a one-component, silicone based, electrically conductive adhesive. It is specially designed for applications where both high flexibility and excellent conductivity...
(Known as Ablestik ICP-4298 S39 ) LOCTITE ABLESTIK ICP 4298 is a silicone based electrically conductive adhesive. It is specially designed for applications where both high flexibility and excellent conductivity...
(Known as ABP 8060T(18g) ) LOCTITE ABLESTIK ABP 8060T electrically conductive die attach paste is formulated to provide high heat transfer generated from power devices. This material can also be...
(Known as ABP-2100AC (35g) ) LOCTITE ABLESTIK ABP 2100AC die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures necessary for...
(Known as CAT 15-1 CLEARJ ) LOCTITE CAT 15-1 CLEARJ is designed for use with potting and encapsulating resins.
(Known as E&C STYCAST 5952 A/B thermally conductive silicone encapsulant ) LOCTITE STYCAST 5952 RD PTA is a filled, addition cured, silicone encapsulant. It features good thermal conductivity, excellent electrical...
(Known as EASY STACK ATB-F125E-8 ) LOCTITE ABLESTIK ATB-F125E Adhesive Film Die Attach is formulated for use in wafer lamination processes or as a preform decal.
(Known as ECCOBOND 2332 ) LOCTITE ABLESTIK 2332 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100°C.
(Known as ECCOBOND 282 ) LOCTITE ABLESTIK 282 is an one component, silk screenable, viscous epoxy with high thermal conductivity.
(Known as ECCOBOND 927-10 ) LOCTITE ABLESTIK 927-10 one component epoxy adhesive is designed for medical applications. It is also recommended for bonding, sealing or insulating heat sensitive parts. It...
(Known as ECCOBOND A-164-1 ) LOCTITE ABLESTIK A164-1 is an enhanced thermal conductivity, fast cure, low stress die and component attach adhesive optimized for GaAs MMIC attach.
(Known as ECCOBOND C-850-5A ) LOCTITE ABLESTIK C 850-5A 114 is an electrically conductive adhesive designed for LED die bonding and other die attach applications. KEY BENEFITS: One Component Fast...
(Known as ECCOBOND C-850-6L ) LOCTITE ABLESTIK C850-6L is a low viscosity version of C850-6.
(Known as ECCOBOND DP1000 10cc (10g) Opt ) LOCTITE ECCOBOND DP1000 wirebond encapsulant features good adhesion to low energy plastic and metal substrates. It also has chemical and crack resistance.
(Known as Eccobond DP1005 ) LOCTITE ECCOBOND DP 1005 jet dispensable die attach adhesive is designed for bonding low energy plastic on metal substrates. It is chemical resistant and has...
(Known as ECCOBOND UF 3130 underfill ) LOCTITE ECCOBOND UF 3130 is designed for use in heat sensitive optoelectronic components and other microelectronic devices.
(Known as HYSOL 3508NH ) LOCTITE 3508NH is a one-component, reflow curable, halogen free epoxy designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. It can...
(Known as Hysol CB0260-1 ) LOCTITE ECCOBOND CB0260-1 is a high adhesion version of FP4450 for temperatures up to 260°C after being exposed to L2 JEDEC preconditioning.
(Known as Hysol CB064/FP4653 ) LOCTITE ECCOBOND CB064 is high purity, low stress, liquid, self-leveling encapsulant material. This material is for cavity fill or dam and fill applications. The unique...
(Known as Hysol CF3350 ) LOCTITE ABLESTIK CF 3350 offers an excellent balance of adhesion strength, electrical and thermal conductivity, and processability. It is especially suited for RF applications.
(Known as HYSOL E1216M ) LOCTITE E 1216M is a snap curable capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that cures...
(Known as Hysol ECCOBOND 104 ) A two component epoxy adhesive with outstanding physical and dielectric properties and service temperatures up to 230°C.
(Known as Hysol ECCOBOND 45-Catalyst 15 ) A two component, room temperature curing, variable flexibility epoxy adhesive.
(Known as Hysol ECCOBOND 56C/CAT 11 ) LOCTITE ABLESTIK 56C-CAT 11 KIT ia an adhesive designed to make electrical connections where hot soldering is impractical or to make electrical connections...
(Known as Hysol ECCOBOND CE3104WXL ) LOCTITE ABLESTIK CE 3104WXL is an electrically conductive adhesive with superior contact resistance stability. Viscosity optimized for screen- and/or stencil-printing.
(Known as Hysol ECCOBOND CE3126 ) Snap curable anisotropic adhesive is especially suited in applications where throughtput is critical. This product is typically used for very fine pitch flip chip...
(Known as Hysol ECCOBOND CE8500 ) One component, general conductive, low stress adhesive for mismatched CTE applications. High thermal conductivity.
(Known as HYSOL ECCOBOND CT4042-1 A/B ) LOCTITE ABLESTIK CT4042-1 PTA is a two component silver-filled, easy to apply, conductive epoxy paste adhesive. It is recommended for chip bonding in...
(Known as HYSOL ECCOBOND CT5047-2 A/B ) LOCTITE ABLESTIK CT 5047-2 KIT is a two component electrically conductive adhesive designed to make electrical connections where hot soldering is impractical or...
(Known as HYSOL ECCOBOND E3526-5 ) LOCTITE ABLESTIK E 3526 is especially developed for ferrite core bonding applications. It is formulated to have high bond strength when cured at temperatures...
(Known as Hysol ECCOBOND UV 9000 ) One component, low temperature curing thermally conductive epoxy adhesive.
(Known as Hysol ECCOBOND UV9085 ) Designed as a faster curing, high thixotropic adhesive that gives good flow control and adhesion for a thick bondline.
(Known as Hysol ECCOCOAT SC3613 ) Heat curable, optically clear, high purity, one-component coating to be applied by brush, dip or flow coating.
(Known as HYSOL EO0206 ) LOCTITE ECCOBOND EO 0206 one-component epoxy is designed for use on electronic devices. KEY BENEFITS Low Halogen content Non-Sag
(Known as Hysol EO1058 ) LOCTITE STYCAST EO 10587 is a single component epoxy system that cures at 125°C. Hysol EO1058 provides excellent environmental and thermal protection to encapsulated parts.
(Known as Hysol EO1060 ) LOCTITE ECCOBOND EO1060 is a low glob formulation for lower CTE and lower ionic than EO1016 content for more demanding applications.
(Known as HYSOL EO7021 ) LOCTITE EO7021 is an encapsulant for use in smart card chip module applications. It is also suitable for die attach automated reel-to-reel processing.
(Known as HYSOL EO7029 ) LOCTITE EO7029 is one component encapsulant is formulated for use in smart card applications. The thixotropic property of this material is designed to avoid flow...
(Known as HYSOL EO7039 ) LOCTITE ECCOBOND EO7039 encapsulant is designed for attachment of integrated circuits and components to advanced flexible substrates. It is formulated to produce a void-free bond...
(Known as Hysol FP0114 ) LOCTITE ECCOBOND FP0114 is a low viscosity, fast flow, epoxy based material designed for capillary underfill on flip chip applications. It has excellent wettability and...
(Known as Hysol FP4410HF )
(Known as Hysol FP4450LV ) LOCTITE ECCOBOND FP4450LV is a low viscosity version of FP4450 incorporating cleaner resins.
(Known as Hysol FP4451 ) LOCTITE ECCOBOND FP4451 is an industry standard damming material for BGAs.
(Known as Hysol FP4460 ) LOCTITE ECCOBOND FP4460 is a high purity, low stress glob top semiconductor encapsulant with improved moisture resistance and working life compared to earlier generation products.
(Known as Hysol FP4526 ) LOCTITE ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications.
(Known as Hysol FP4530 ) LOCTITE ECCOBOND FP4530 is a fast flow encapsulant material for flip chip underfill applications with a gap of 1 mil. The material is designed to...
(Known as Hysol FP4549 ) LOCTITE ECCOBOND FP4549 is used for fine-pitch flip chip applications, fast flowing, low stress underfill.
(Known as Hysol FP4549HT ) LOCTITE ECCOBOND FP4549HT is an aluminum nitride-filled version of FP4549 for high thermal applications.
(Known as Hysol FP4651 ) LOCTITE ECCOBOND FP4651 is a low viscosity version of FP4650 for a large array of packages.
(Known as Hysol FP5001 ) LOCTITE ECCOBOND FP5001 is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent...
(Known as Hysol FP5201 ) LOCTITE ECCOBOND FP 5201 is designed for thermal compression bonding processes in flip chip to laminate assembly. Laminate Packages CSP, SCSP, SIP
(Known as Hysol KL-G800H ) LOCTITE HYSOL KL-G 800H CD is a green epoxy molding compound suitable for thin leaded packages. It is designed to achieve JEDEC level 2. It...
(Known as HYSOL LA3032-78 ) LOCTITE ECCOBOND LA 3032-78 encapsulant is designed for high throughput assembly operations. It is formulated to withstand high heat distortion temperatures and bonds well to...
(Known as Hysol PC40-UM ) LOCTITE STYCAST PC 40-UM is a solvent-free, low-viscosity, rapid gel, UV-moisture cure one component conformal coating.
(Known as Hysol QMI519 ) LOCTITE ABLESTIK QMI519 is JEDEC L1 260°C for SOIC, industry standard for QFN packages. Industry standard for preplated finishes. Exceptional performance on clean uncoated silver-plated...
(Known as HYSOL QMI5200-1X adhesive film ) LOCTITE ABLESTIK QMI 5200-1X adhesive film is formulated for use in wafer lamination processes or as a preform decal. It is designed for...
(Known as Hysol QMI529HT-5DLT ) LOCTITE ABLESTIK QMI529HT is used for component or die attach where very high electrical and thermal conductivity are required. Suitable for high heat dissipation devices...
(Known as HYSOL QMI529HT-LV2C1.5 ) LOCTITE ABLESTIK QMI529HT-LV electrically conductive adhesive is designed for die attach applicaitons. It is recommended for use in the attachment integrated circuits and components onto...
(Known as Hysol QMI536HT ) LOCTITE ABLESTIK QMI536HT(BORON) is a high thermal version of QMI536 and is ideal for mixed stacked die applications. Non-die damaging filler.
(Known as Hysol QMI538NB-1A2 ) LOCTITE ABLESTIK QMI538NB-1A2 is a non-conductive paste for leadframe applications. Very low stress QMI538NB°1A2, 1A3, 1A4 for die sizes greater than 500 x 500 mil.
(Known as Hysol QMI547 ) LOCTITE ABLESTIK QMI547 is a non-conductive paste for leadframe applications.
(Known as Hysol STYCAST 1090BLK ) LOCTITE STYCAST 1090 BK is designed for encapsulation and potting of electronic assemblies that require lower weight such as aerospace applications.
(Known as HYSOL STYCAST 2850KT/CATALYST 24LV ) LOCTITE STYCAST 2850KT is a thermally conductive, electrically insulatiive epoxy encapsulant designed for heat sink replacement in non-integrated electrical components and assemblies. it...
(Known as HYSOL STYCAST 2850MT-Catalyst 27-1 ) LOCTITE CAT 27-1 is a two component, electrically insulating general purpose encapsulant. It is recommended for encapsulation of components that require heat dissipation...
(Known as HYSOL STYCAST 3050 Catalyst 11 ) LOCTITE STYCAST 3050 is a two component general purpose encapsulant desgined for potting and encapsulation applications with very small physical spacing between...
(Known as HYSOL STYCAST A316 Series ) LOCTITE ABLESTIK A316 series epoxy adhesive and sealant is designed for high throughput assembly operations.
(Known as Hysol STYCAST E2534FR ) LOCTITE STYCAST E 2534 FR epoxy potting compound complies with recent demands on environmentally friendly products and does not contain brominated flame retardants.
(Known as Hysol STYCAST TC8M ) LOCTITE TC 8M is a thermally conductive, high temperature silicone thermal grease.
(Known as Hysol TRA-BOND 2151 ) LOCTITE ABLESTIK 2151 is a thixotropic, two-part adhesive that develops strong, durable high-impact bonds at room temperature which improve heat transfer while maintaining electrical...
(Known as Hysol TRA-BOND F112 ) LOCTITE ECCOBOND F 112 is a long pot life, impact resistant, fiber-optic adhesive. This two-part, low viscosity epoxy paste adhesive has the distinct advantage...
(Known as Hysol TRA-BOND FDA2T ) LOCTITE ABLESTIK FDA 2T is a thixotropic epoxy resin paste system specifically developed for medical device applications. It has been tested in accordance with...
(Known as Hysol Tra-Cast FS245 ) LOCTITE ECCOBOND FS 245 BIPAX is a thixotropic, two-part adhesive that develops strong, durable, high impact bonds at room temperature which improve heat transfer...
(Known as HYSOL UF3808 ) LOCTITE ECCOBOND UF 3808 is a capillary underfill designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material...
(Known as Hysol UF8830 ) LOCTITE ECCOBOND UF 8830 is a liquid epoxy underfill encapsulant designed for flip chip BGA applications requiring improved crack/fracture resistance and low warpage.
(Known as Hysol US0154 ) Encapsulant potting urethane.
(Known as HYSOL UV3000 ) LOCTITE ECCOBOND UV 3000 is a UV curable adhesive designed for high throughput assembly operations. This adhesive can withstand exposure to temperatures as high as...
(Known as HYSOL UV3000LH ) LOCTITE ECCOBOND UV 3000LH cure adhesive is designed for high throughput assembly operations. A low halide version of UV3000. It is used in CMOS glass...
(Known as HYSOL XCE3104XL ) LOCTITE ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for the stencil and screen print applications. It uses a unique blend of...
(Known as HYSOL XCE3120 ) LOCTITE ABLESTIK XCE 3120 anisotropic epoxy adhesive is designed for high throughput microelectronics assembly applications. It is ideal for use in combination with temperature sensitive...
(Known as HYSOL XCP3302NS ) LOCTITE ABLESTIK XCP3302NS ITAR gold filled, electrically conductive adhesive is designed for automatic dispensing operations. It is the no spacer version of XCP3302 adhesive.
(Known as Loctite 315 ) LOCTITE 315 is a self-shimming for electrical isolation; room-temperature curing adhesive.
(Known as Loctite 3515 ) LOCTITE 3515 is a one component epoxy adhesive, designed to allow self-alignment of SMT components during the reflow operation.
(Known as LOCTITE 3609 10ML EFD US ) LOCTITE 3609 is used for medium to high speed dispense applications. Excellent green strength for large components.
(Known as Loctite 3627 ) LOCTITE 3627 is a high speed stencil print adhesive compatible with DEK Proflow and MPM Rheopump. Recommended product for DEK Proflow Pumprint process.
(Known as Loctite 384 Output ) LOCTITE 384 is a repairable, room temperature-curing adhesive utilized for parts subject to disassembly.
(Known as Loctite Ablestik ICP CB5424 ) LOCTITE ABLESTIK ICP CB5424 is a one component silicone paste. It is an electrically conductive adhesive. designed for applications where a high degree...
(Known as LOCTITE US5533 flame retardant potting compound ) LOCTITE STYCAST US 5533 PTB is a two-component, flexible, flame retardant potting compound. It is formulated with low odor designed to...
(Known as STYCAST 1090SI ) LOCTITE STYCAST 1090SI encapsulant is recommended for applications where high compressive stress is applied to encapsulated circuitry - as in deep ocean work. This product...
(Known as STYCAST 2017M4/A 5kg ) Epoxy encapsulant developed for lamp type, blue LED.
(Known as STYCAST 2651-40 ) LOCTITE STYCAST 2651-40 is a filled, general purpose, dielectric grade epoxy encapsulant. It is a lower viscosity version of STYCAST 2651. It has excellent adhesion...
(Known as STYCAST 2850FT ) LOCTITE STYCAST 2850FT is for high thermal conductivity and low outgassing, consider this encapsulant.
(Known as STYCAST NX-17 ) LOCTITE STYCAST NX17 is a two-component, heat cure, epoxy encapsulant with good adhesion to PPA.
(Known as TRA-BOND 2158 ) LOCTITE ABLESTIK 2158 BIPAX is a two part adhesive that develops strong, durable high impact bonds at room temperature which improve heat transfer while maintaining...
3702 is a UV light curable sealant for LCD end-sealing applications. This product is specifically formulated to have excellent humidity resistance.
A medium viscosity epoxy resin paste system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests in vivo and received Class VI...
A one-component, unfilled solventless epoxy underfill encapsulant; fast curing and excellent chemical and heat resistance.
ABLEBOND 8008NC is a non-conductive snap cure adhesive utilizing wafer backside coating technology.
ABLESTIK C100 Series (C115 and C130) die attach adhesive film is suitable for tight geometry (<100μm) leadframe packages where high electrical performance is required. This material was originally sampled as...
ACHESON ELECTRODAG 5915 is a one component, fast cure, electrically conductive isotropic ink designed for bonding surface mount devices to flexible or rigid printed circuits.
Acrylic conformal coating non-toluene based, rapid drying, one-component for non-atomized spraying applications.
An innovative non-reworkable capillary flow underfill. Hysol E1172A is a fast flow, snap cure underfill. It is a one-component epoxy chemistry that is non-anhydride curing for enhanced moisture resistance.
Bergquist introduces a new high thermal performance dielectric into its comprehensive Thermal Clad metal core PCB (MCPCB’s) line. HPL is a dielectric specifically formulated for high power lighting LED applications...
Bond-Ply 660P is a thermally conductive, electrically insulating, double sided pressure sensitive adhesive tape.The tape consists of a high performance, thermally conductive acrylic adhesive coated on both sides of a...
Bond-Ply® LMS-HD is a thermally conductive heat curable laminate material. The product consists of a high performance thermally conductive low modulus silicone compound coated on a cured core, and double...
Clear glob top material with good adhesion to any substrate.
Conductive adhesive is designed for thermally enhanced BGA applications. Sensitive to amines. This material needs to be isolated from uncured epoxy-based resins as interaction will inhibit curing. It has a...
Eccobond C850-6 is a fast curing, general conductive, one component, low viscosity, silver filled epoxy die attach adhesive paste. It features high electrical and thermal conductivity and high strength at...
Eccobond CE3103 is primarily designed for bonding polycarbonate to itself while not inducing stress cracking under typical molded stress levels. Eccobond CE3103 cures rapidly to form flexible, transparent bonds when...
Eccobond DX-20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be...
Eccoseal 7200 adhesive sealant is designed for high throughput display assembly for displays that require protection against humidity and oxygen.
Electrically conductive one-component, non-bleeding epoxy adhesive with low outgassing, eliminating wicking and bridging under small components.
Encapsulant potting, epoxy, one component.
Encapsulant potting, epoxy, two component, heat cure.
For protection of wire bonds consider this high purity material as either a dam or a glob top.
Gap Filler 1000 is a thermally conductive, liquid gap filling material. It is supplied as a two-component, room or elevated temperature curing system. The material is formulated to provide a...
Gap Filler 1100SF is the thermal solution for silicone-sensitive applications. The material is supplied as a two-part component curing at room or elevated temperatures. The material exhibits low modulus properties...
Gap Filler 3500S35 is the technology leader in thermally conductive, liquid gap filling materials, featuring ultra-high thermal performance and superior softness. The material is a two-component, cured either at room...
Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads.The material is fiberglass reinforced for improved puncture resistance and handling characteristics. Gap Pad...
Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap...
Gap Pad A3000 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. Gap Pad...
Gap Pad HC 1000 is an extremely conformable, low modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows...
Gap Pad® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to...
Heat cure material designed ACP process by thermal compression (RFID, Misc, Assembly).
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT...
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT...
Hi-Flow 225U is designed for use as a thermal interface material between a computer processor and a heat sink. The product consists of a thermally conductive 55°C phase change compound...
Hi-Flow 300G consists of a thermally conductive 55°C phase change compound coated on a fiberglass web. Hi-Flow 300G is designed as a thermal interface material between a computer processor and...
Hi-Flow 565UT is a naturally tacky, thermally conductive phase change material which is supplied in an easy to use tabulated pad form. In the application the material undergoes a phase...
Hi-Flow 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side.The polyimide film provides a high dielectric strength and high...
High purity, flip-chip underfill, high Pb and no-Pb applications
HYSOL E1159 is designed for high volume assembly operations that require and underfill that flows fast at room temperature and fully cures in one reflow oven cycle. It is specifically...
HYSOL ECCOBOND DS7300 one component non-conductive epoxy perimeter sealant is designed to be used in display applications.
HYSOL ECCOBOND G757HF-D is a low halogen, non-conductive epoxy adhesive for ferrite bonding applications. It is suitable for use with temperature sensitive substrates and components.
HYSOL EO1086 is a one-component heat cure encapsulant designed for use in Chip on Board applications requiring excellent handling properties.
Hysol FP4652 is a fast cure, low stress version of FP4450 for a large array of packages.
HYSOL STYCAST 2651MM Catalyst 9 is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining.
HYSOL STYCAST 2850KT with CATALYST 9 epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications...
HYSOL STYCAST E1070 one component epoxy encapsulant is recommended for small mass potting applications, <50 grams, used in automotive electronic applications.
HYSOL STYCAST EFF15 is a one component epoxy based free flowing syntactic foam powder designed to infiltrate around densely packed components and fill voids in electronic modules. It exhibits low...
HYSOL UF3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent...
Hysol US0146 is an unfilled, two component clear amber polyurethane casting system formulated for potting. Characteristics of Hysol US0146 include low viscosity, low durometer, long pot life and hydrolytic stability.
HYSOL XUV80260 is a UV curable display perimeter sealant for rigid type OLED.
HYSOL XUV80270-1 is a one-component, non-conductive, UV curable adhesive sealant for high throughput display assembly that require protection against humidity. It is formulated to cure very fast when exposed to...
HYSOL® ES1301™ is a silica filled epoxy casting system recommended for coils, transformers, and general pupose casting.
HYSOL® ES1900™ is a two-component casting system with excellent handling properties. Transparent, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications where clarity and excellent structural, mechanical and...
HYSOL® ES2202™ is an unfilled epoxy system with a high operating temperature and long pot life. Excellent chemical resistance, excellent performance under high moisture and humidity.
HYSOL® ES2207™ is a filled, resilient, low viscosity, room temperature cure epoxy potting compound. It will meet UL 94 V-0 requirements in 1/8 inch thickness.
Hysol® FP5000™ is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent protection of integrated circuit electrical joints...
In addition to excellent heat transfer and dielectric properties, Sil-Pad 980 is specially formulated for high resistance to crushing and cut-through typically found in high-pressure applications where surface imperfections such...
Isostrate™ is an electrically isolating phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as a...
Liqui-Bond SA 1000 is a thermally conductive, one-part liquid silicone adhesive with a low viscosity for easy screenability. Liqui-Bond SA 1000 features a high thermal performance and maintains it’s structure...
Liqui-Bond SA 2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding elastomer. Liqui-Bond SA 2000 is supplied as a one-part liquid component, in either...
Liqui-Bond® EA 1805 is a two-component, epoxy based, liquid-dispensable adhesive. Liqui-Bond® EA 1805 has a thermal conductivity of 1.8 W/mK. Liqui-Bond® EA 1805 will be supplied in a two-component format,...
Liqui-Form® 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework. Liqui-Form® 2000...
LOCTITE 3118 is a white image sensor adhesive.
Loctite 3119™ cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive.
LOCTITE 3128 is a black image sensor adhesive.
LOCTITE 3128NH edgebond material is designed to add reliability to chip scale packages and other electronic components. It is a low temperature cure adhesive ideal for use on heat sensitive...
LOCTITE 3129 is an image sensor adhesive.
LOCTITE 3220 is a one-component low temperature cure, snap cure with excellent ahesion on wide range of materials.
LOCTITE 3220WH is a one component designed for use in heat sensitive optoelectronic components and other microelectronic devices. This material offers excellent light reflection characteristics. 3220WH is the white colored...
LOCTITE 3318 is suitable for a wide variety of coating applications that require strict humidity reliability performance, such as ITO/COG overcoat in LCD module assembly.
LOCTITE 3509 is a one component heat cure epoxy designed for use as board level cornerbond for IC packages such as CSP's and BGA's.
LOCTITE 3513 is a single-component epoxy used as a reworkable underfill for CSP or BGA's.
LOCTITE 3611 is a stencil printable/pin transfer product for the bonding of surface mounted devices to printed circuit boards prior to wave soldering.
LOCTITE 3629C is a one-component, halogen free, fast cure epoxy formulated for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is designed to provide controlled...
LOCTITE 3705 is a UV-cured adhesive designed for bonding electronics components on PCBs. Thixotropic nature reduces migration of product. Excellent adhesion to a wide range of substrate. Bonds in seconds...
Loctite 383 Output is a thermally conductive adhesive system designed for bonding heat generating components to heat sinks. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components,...
LOCTITE 3873 is a fast curing, high-conductivity, self-shimming for bonding heat-generated devices to thermal spreader.
LOCTITE 5293 is a repairable, solvent-free, medium viscosity, UV / moisture cure silicone suited to brush, dip and selective coating.
LOCTITE ABLELOC 5500SB is a tape adhesive for high speed operations where dwell time and pressure must be minimized. The adhesive is coated onto both sides of a polyimide carrier.
LOCTITE ABLESTIK 3880 is designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required.
LOCTITE ABLESTIK 60L Parts AB is a two component carbon filled epoxy adhesive with low electrical conductivity designed for general pupose bonding. It is designed for applications where precise resistive...
LOCTITE ABLESTIK CDF 200 Series is a highly filled, conductive die attach film adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and...
LOCTITE ABLESTIK SSP 2020 is a sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated...
LOCTITE ECCOBOND DS 3318LVT fast, UV curable material is specially formulated for use in applications requiring lower energy cure. Its excellent moisture resistance is designed to provide protection in COG-LCD...
LOCTITE ECCOBOND DS 8027LV is a non-conductive epoxy perimeter sealant designed to be used in display applications, such as OLED and E-paper.
LOCTITE ECCOBOND EO1072 is a one component high performance epoxy encapsulant with high Tg and low extractable ionics.
LOCTITE ECCOBOND NCP 5208 is a non-conductive paste for thermal compression bonding processes in flip chip to laminate assembly. It is designed for advanced flip chip Cu pillar applications. It...
LOCTITE Powerstrate Xtreme (PSX) is a reworkable unsupported film with superior thermal performance even at low pressure. Direct attach to heat sink at room temperature without adhesive. Also available in...
Loctite Silverstrate is an electrically conductive phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as...
LOCTITE STYCAST ES 4322FC liquid epoxy encapsulant is for protection of semiconductor devices. It is a high flow material which requires a cavity flow control barrier to prevent excessive flow.
LOCTITE TCP 8010 thermal grease is recommended for use in assembly of parts requiring high temperature heat transfer. It is used between heat generating devices and the surfaces to which...
Loctite® 5089™ Nuva-Sil® Silicone Gasket / Sealant is used for gasketing and sealing applications. Upon exposure to sufficient UV light and/or atmospheric moisture, this product cures to form a durable,...
Loctite® Liquid Optically Clear Adhesives (LOCAs) for cover lens bonding, touch panel sensor assembly and direct bonding applications in touch panel and display devices including mobile phones, tablets, monitors, televisions...
One component, general conductive, low stress nickel-filled adhesive for mismatched CTE with good shielding properties.
One component, low temperature curing thermally conductive epoxy adhesive.
Photocurable adhesive is designed for high throughput assembly operations.
Poly-Pad 1000 is a fiberglass-based insulator coated with a filled polyester resin. The mterial offers superior thermal resistance for high performance applications. Polyester-based, thermally conductive insulators from Bergquist provide a...
Poly-Pad 400 is a fiberglass-reinforce d insulator coated with a filled polyester resin. Poly-Pad 400 is economical and designed for most standard applications. Polyester-based, thermally conductive insulators from Bergquist provide...
Poly-Pad K-10 is a composite of film coated with a polyester resin. The material offers superior thermal performance for your most critical applications with a thermal resistance of 0.2°C-in2/W as...
Poly-Pad K-4 is a composite of film coated with a polyester resin. The material is an economical insulator and the film carrier provides excellent dielectric and physical strength. Polyester-based, thermally...
Q-Pad II is a composite of aluminum foil coated on both sides with thermally / electrically conductive Sil-Pad rubber. The material is designed for those applications in which maximum heat...
Recommended for high-temperature heat transfer in normal applications. It is used between heat generating devices and the surfaces to which they are mounted or other heat dissipating surfaces. This product...
Sil-Pad 1200 is a silicone based, fiberglass-reinforce d thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use,...
Sil-Pad A2000 is a conformable elastomer with very high thermal conductivity that acts as a thermal interface between electrical components and heat sinks. Sil-Pad A2000 is for applications where optimal...
Sil-Pad K-4 uses a specially developed film which has high thermal conductivity, high dielectric strength and is very durable. Sil-Pad K-4 combines the thermal transfer properties of well-known Sil-Pad rubber...
Sil-Pad K-6 is a medium performance, film-based thermally conductive insulator. The film is coated with a silicone elastomer to deliver high performance and provide a continuous, physically strong dielectric barrier...
Snap curable, low temperature cure, electrically conductive adhesive with excellent adhesion and reliability of Cu and Al substrates.
SPT 1000 (Sil-Pad Tube) provides thermally conductive insulation for clip mounted plastic power packages. Sil-Pad Tubes are made of silicone rubber with high thermal conductivity. Sil-Pad Tube 1000 is best...
SPT 400 (Sil-Pad Tube) provides thermally conductive insulation for clip mounted plastic power packages. Sil-Pad Tubes are made of silicone rubber with high thermal conductivity. Sil-Pad Tube 400 is ideal...
SPT 400 and SPT 1000 (Sil-Pad Tubes) provide thermally conductive insulation for clip mounted plastic power packages. Sil-Pad Tubes are made of silicone rubber with high thermal conductivity. Sil-Pad Tube...
STYCAST EO2000HV one-component, oxide filled epoxy adhesive is designed to bond heat resistant plastics in applications requiring heat and chemical resistance. It is especially suited for use in harsh environments...
Surface mount adhesive designed for high speed dispensing.
The true workhorse of the Sil-Pad product family, Sil-Pad 900S thermally conductive insulation material, is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These...
Thermosetting, dielectric adhesive developed for GaN chip bonding for high-brightness LEDs. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting...

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