Henkel Corporation - Electronics Datasheets for Electrical and Electronic Resins

Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Electrical and Electronic Resins: Learn more

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Product Name Notes
LOCTITE ABLESTIK 2035SC (Known as Ablebond 2035SC) -- 8802575024129 (Known as Ablebond 2035SC ) LOCTITE ABLESTIK 2035SC is non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize...
LOCTITE ABLESTIK 2035SC-1B1 (Known as Ablebond 2035SC-1B1) -- 8799581143041 (Known as Ablebond 2035SC-1B1 ) LOCTITE ABLESTIK 2035SC-1B1 non-conductive, one component die attach adhesive was formulated for high throughput die attach applications. It is designed for die attach applications requiring...
LOCTITE ABLESTIK 2053S (Known as Ablebond 2053S) -- 8799471042561 (Known as Ablebond 2053S ) LOCTITE ABLESTIK 2053S is a low stress adhesive for die-to-substrate applications.
LOCTITE ABLESTIK 2300 (Known as Ablebond 2300) -- 8799471697921 (Known as Ablebond 2300 ) LOCTITE ABLESTIK 2300 is an ultra low moisture absorption, low stress adhesive.
LOCTITE ABLESTIK 3230 (Known as Ablebond 3230) -- 8802575319041 (Known as Ablebond 3230 ) LOCTITE ABLESTIK 3230 is an electrically conductive die attach adhesive is designed for high reliability package applications. It can be used in a variety of...
LOCTITE ABLESTIK 3290 (Known as Ablebond 3290) -- 8799580356609 (Known as Ablebond 3290 ) LOCTITE ABLESTIK 3290 is a snap curable, electrically conductive die attach adhesive designed for lead-free applications where high reliability is a key requirement.
LOCTITE ABLESTIK 342-37 (Known as Ablebond 342-37 ) -- 8799555878913 (Known as Ablebond 342-37 ) LOCTITE ABLESTIK 342-37 epoxy adhesive is designed for applications requiring outstanding thermal shock properties.
LOCTITE ABLESTIK 16-1 (Known as ABLESTIK ABLEBOND 16-1) -- 8799555846145 (Known as ABLESTIK ABLEBOND 16-1 ) LOCTITE ABLESTIK 16-1 is a two-component, electrically conductive epoxy adhesive designed for general purpose applications. It cures at room temperature while providing a reasonable...
LOCTITE ABLESTIK 2000 (Known as ABLESTIK ABLEBOND 2000) -- 8799581536257 (Known as ABLESTIK ABLEBOND 2000 ) LOCTITE ABLESTIK 2000 electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the...
LOCTITE ABLESTIK 2000B (Known as Ablestik ABLEBOND 2000B) -- 8799554568193 (Known as Ablestik ABLEBOND 2000B ) LOCTITE ABLESTIK 2000B is an electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to...
LOCTITE ABLESTIK 2025D (Known as Ablestik ABLEBOND 2025D) -- 8799554174977 (Known as Ablestik ABLEBOND 2025D ) LOCTITE ABLESTIK 2025D is a hybrid chemistry die attach adhesive designed for PBGA.
LOCTITE ABLESTIK 2025DSI (Known as ABLESTIK ABLEBOND 2025DSI) -- 8799554240513 (Known as ABLESTIK ABLEBOND 2025DSI ) LOCTITE ABLESTIK 2025DSI is a non-conductive low bleed adhesive.
LOCTITE ABLESTIK 2030SC (Known as ABLESTIK ABLEBOND 2030SC) -- 8802575220737 (Known as ABLESTIK ABLEBOND 2030SC ) Die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage...
LOCTITE ABLESTIK 2100A (Known as Ablestik ABLEBOND 2100A) -- 8799554207745 (Known as Ablestik ABLEBOND 2100A ) LOCTITE ABLESTIK 2100A is an ultra low moisture absorption adhesive with high hot/wet die shear strength. For lead-free packaging.
LOCTITE ABLESTIK 2310 (Known as ABLESTIK ABLEBOND 2310) -- 8802610216961 (Known as ABLESTIK ABLEBOND 2310 ) LOCTITE ABLESTIK 2310 Is a conductive die attach adhesive designed for use on a wide range of BGA die sizes. Its unique conductive filler...
LOCTITE ABLESTIK 3230A (Known as ABLESTIK ABLEBOND 3230A) -- 8799580651521 (Known as ABLESTIK ABLEBOND 3230A ) LOCTITE ABLESTIK 3230A adhesive die attach is designed for semiconductor packaging applications where high electrical conductivity is not required. It can be used in...
LOCTITE ABLESTIK 2600AT (Known as Abletherm 2600AT) -- 8802584788993 (Known as Abletherm 2600AT ) LOCTITE ABLESTIK 2158 adhesive is designed for thermal management applications requiring high heat extraction from the die such as high power and discrete devices. This...
LOCTITE ABLESTIK 2700B (Known as Abletherm 2700B) -- 8799533694977 (Known as Abletherm 2700B ) LOCTITE ABLESTIK 2700B is a very high thermal conductivity adhesive with excellent bleed performance on gold.
LOCTITE ABLESTIK 2700HT (Known as ABLETHERM 2700HT) -- 8799580684289 (Known as ABLETHERM 2700HT ) LOCTITE ABLESTIK 2700HT is a die attach is desgined for Pb-free array packaging. This adhesive is ideal for small needle dispensing in SIP or MCM...
LOCTITE ABLESTIK 2332 (Known as ECCOBOND 2332) -- 8799502499841 (Known as ECCOBOND 2332 ) LOCTITE ABLESTIK 2332 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100°C.
LOCTITE ABLESTIK 282 (Known as ECCOBOND 282) -- 8799502073857 (Known as ECCOBOND 282 ) LOCTITE ABLESTIK 282 is an one component, silk screenable, viscous epoxy with high thermal conductivity.
LOCTITE ABLESTIK 285 (Known as ECCOBOND 285) -- 8799502237697 (Known as ECCOBOND 285 ) LOCTITE ABLESTIK 285 is a highly filled, thermally conductive, thixotropic epoxy paste with low CTE.
LOCTITE 3508NH (Known as HYSOL 3508NH) -- 8799574425601 (Known as HYSOL 3508NH ) LOCTITE 3508NH is a one-component, reflow curable, halogen free epoxy designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. It can...
LOCTITE ABLESTIK 104 (Known as Hysol ECCOBOND 104) -- 8799501680641 (Known as Hysol ECCOBOND 104 ) A two component epoxy adhesive with outstanding physical and dielectric properties and service temperatures up to 230°C.
LOCTITE ABLESTIK 2332-17 (Known as HYSOL ECCOBOND 2332-17) -- 8799574523905 (Known as HYSOL ECCOBOND 2332-17 ) LOCTITE ABLESTIK 2332-17 is a solventless one component epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to...
LOCTITE ABLESTIK 281 (Known as HYSOL ECCOBOND 281 epoxy paste) -- 8802597470209 (Known as HYSOL ECCOBOND 281 epoxy paste ) LOCTITE ABLESTIK 281 is a thermally conductive and electrically insulating, one component filled thixotropic paste. It is suitable for use on a...
Hysol ECCOBOND G500HF (Known as Hysol ECCOBOND G500HF) -- 8799549882369 (Known as Hysol ECCOBOND G500HF ) General purpose one-component non-conductive epoxy adhesive and sealant that cures to a high gloss finish.
LOCTITE ABLESTIK 2106 BIPAX (Known as HYSOL TRA-BOND 2106) -- 8799575048193 (Known as HYSOL TRA-BOND 2106 ) LOCTITE ABLESTIK 2106 BIPAX is a two component epoxy is designed for high strength structural bonding applications. It develops significant properties 1 hour after...
LOCTITE ABLESTIK 2106T BIPAX (Known as HYSOL TRA-BOND 2106T) -- 8799575146497 (Known as HYSOL TRA-BOND 2106T ) LOCTITE ABLESTIK 2106T BIPAX is a two component epoxy designed for high strength structural bonding applications. It develops significant properties one hour after mixing.
LOCTITE ABLESTIK 2115 (Known as Hysol TRA-BOND 2115) -- 8799570493441 (Known as Hysol TRA-BOND 2115 ) LOCTITE ABLESTIK 2115 is a clear, low viscosity epoxy formulation used in the fabrication of lasers. It is capable of withstanding 30 seconds of...
LOCTITE ABLESTIK 2116 BIPAX (Known as HYSOL TRA-BOND 2116) -- 8799571214337 (Known as HYSOL TRA-BOND 2116 ) LOCTITE ABLESTIK 2116 BIPAX is a thixotropic, non-conductive, solvent-free, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It offers chemical resistance...
LOCTITE ABLESTIK 2151 (Known as Hysol TRA-BOND 2151) -- 8802592948225 (Known as Hysol TRA-BOND 2151 ) LOCTITE ABLESTIK 2151 is a thixotropic, two-part adhesive that develops strong, durable high-impact bonds at room temperature which improve heat transfer while maintaining electrical...
LOCTITE ABLESTIK 2902 (Known as Hysol TRA-DUCT 2902) -- 8799572262913 (Known as Hysol TRA-DUCT 2902 ) LOCTITE ABLESTIK 2902 is a silver-filled epoxy recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties.
LOCTITE ABLESTIK 2958 (Known as Hysol TRA-DUCT 2958) -- 8799570395137 (Known as Hysol TRA-DUCT 2958 ) LOCTITE ABLESTIK 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components recommended for electronic, microelectronic and die-attach bonding...
Hysol UF3800 (Known as HYSOL UF3800 reworkable underfill) -- 8799570132993 (Known as HYSOL UF3800 reworkable underfill ) A high reliability, good reworkability, room temperature dispensable underfill compatible with most common solder pastes.
LOCTITE 315 Output (Known as Loctite 315) -- 8799375163393 (Known as Loctite 315 ) LOCTITE 315 is a self-shimming for electrical isolation; room-temperature curing adhesive.
LOCTITE 3323 (Known as LOCTITE 3323UV) -- 8802602188801 (Known as LOCTITE 3323UV ) LOCTITE 3323 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV...
LOCTITE 3327 (Known as LOCTITE 3327UV) -- 8802602352641 (Known as LOCTITE 3327UV ) LOCTITE 3327 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV...
LOCTITE 3515 (Known as Loctite 3515) -- 8799403376641 (Known as Loctite 3515 ) LOCTITE 3515 is a one component epoxy adhesive, designed to allow self-alignment of SMT components during the reflow operation.
LOCTITE 3609 (Known as LOCTITE 3609 10ML EFD US) -- 8799552667649 (Known as LOCTITE 3609 10ML EFD US ) LOCTITE 3609 is used for medium to high speed dispense applications. Excellent green strength for large components.
LOCTITE 3612 (Known as Loctite 3612) -- 8802602385409 (Known as Loctite 3612 ) LOCTITE 3612 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium...
LOCTITE 3616 (Known as Loctite 3616) -- 8799374573569 (Known as Loctite 3616 ) LOCTITE 3616 is a high speed stencil print adhesive compatible with DEK Proflow and MPM Rheopump. Ultra low moisture pick-up. Pin transfer capable as well.
LOCTITE 3621 (Known as LOCTITE 3621 30ML EFD US) -- 8799374540801 (Known as LOCTITE 3621 30ML EFD US ) LOCTITE 3621 is a high performance for ultra high-speed syringe dispense. Recommended product for Dispense Jet. Superior humidity resistance and electrical properties.
LOCTITE 3627 (Known as Loctite 3627) -- 8799374180353 (Known as Loctite 3627 ) LOCTITE 3627 is a high speed stencil print adhesive compatible with DEK Proflow and MPM Rheopump. Recommended product for DEK Proflow Pumprint process.
LOCTITE 384 (Known as Loctite 384 Output) -- 8799578554369 (Known as Loctite 384 Output ) LOCTITE 384 is a repairable, room temperature-curing adhesive utilized for parts subject to disassembly.
LOCTITE ABLESTIK 2158 BIPAX (Known as TRA-BOND 2158) -- 8799575179265 (Known as TRA-BOND 2158 ) LOCTITE ABLESTIK 2158 BIPAX is a two part adhesive that develops strong, durable high impact bonds at room temperature which improve heat transfer while maintaining...
Bond-Ply 100 -- 8806385156097 Your benefits Thermal impedance 0.52°C-in²/W (@50 psi) High bond strength to a variety of surfaces Double-sided, pressure sensitive adhesive tape High performance, thermally conductive acrylic adhesive Can be used instead...
Loctite 3702 -- 8799480479745 3702 is a UV light curable sealant for LCD end-sealing applications. This product is specifically formulated to have excellent humidity resistance.
Loctite 3720 -- 8799578914817 3720 is a single component, UV curable coating resin. This product is specially formulated for moisture protection on terminals of TAB mounts or COG of LCD module. Its high flexibility...
Hysol TRA-BOND FDA16 -- 8802593177601 A medium viscosity epoxy resin paste system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests in vivo and received Class VI...
Hysol STYCAST A312 -- 8802594324481 A one-component, unfilled solventless epoxy underfill encapsulant; fast curing and excellent chemical and heat resistance.
ABLEBOND 8008NC -- 8802604974081 ABLEBOND 8008NC is a non-conductive snap cure adhesive utilizing wafer backside coating technology.
ABLEBOND AAA3300 -- 8802605006849 ABLEBOND AAA3300 is a self-filleting low modulus adhesive for attaching large die on thin organic substrates.
ABLESTIK ABLEBOND 958-8C -- 8799556337665 ABLESTIK ABLEBOND 958-8C is an electrically conductive epoxy designed for solder replacement in microelectronic interconnect applications. It may be used with thick film metalizations or traditional printed circuit board surfaces.
ABLESTIK ABLEFILM ECF563 -- 8799581700097 ABLESTIK ABLEFILM ECF563 unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in...
ABLESTIK ABP-8000 -- 8802606383105 ABLESTIK ABP-8000 conductive die attach is desgined for bonding devices where high heat transfer is required. It is recommended for use in the attachment of integrated circuits and components onto...
Ablestik ATB-F100E -- 8802606350337 ABLESTIK ATB-F100E adhesive film is formulated for use in water lamination processes and preform decal. It is designed for use in both mother/daughter die stack packages.
Ablestik C130 -- 8799555026945 ABLESTIK C100 Series (C115 and C130) die attach adhesive film is suitable for tight geometry (<100μm) leadframe packages where high electrical performance is required. This material was originally sampled as...
ABLESTIK ICP-3513 -- 8799581405185 ABLESTIK ICP-3513 electrically conductive one component adhesive is designed for use in automated assembly and in-line curing operations.
ACHESON ELECTRODAG 5915 -- 8799582519297 ACHESON ELECTRODAG 5915 is a one component, fast cure, electrically conductive isotropic ink designed for bonding surface mount devices to flexible or rigid printed circuits.
Hysol PC62 -- 8799550799873 Acrylic conformal coating non-toluene based, rapid drying, one-component for non-atomized spraying applications.
Ablestik ATB-120US -- 8799555551233 Adhesive film (20 µm) is formulated for use in wafer lamination processess and preform decal. It is designed for use in both mother/daughter die in stack packages.
Ablestik ATB-130US -- 8799555649537 Adhesive film (30 µm) is formulated for use in wafer lamination processess and preform decal. It is designed for use in both mother/daughter die in stack packages.
Hysol E1172A -- 8799536447489 An innovative non-reworkable capillary flow underfill. Hysol E1172A is a fast flow, snap cure underfill. It is a one-component epoxy chemistry that is non-anhydride curing for enhanced moisture resistance.
Bond-Ply 400 -- 8806385123329 Bergquist Bond-Ply 400 is an un-reinforced, thermally conductive, pressure sensitive adhesive tape. The tape is supplied with protective topside tabs and a carrier liner. Bond-Ply 400 is designed to attain...
HPL-03015 -- 8806383386625 Bergquist introduces a new high thermal performance dielectric into its comprehensive Thermal Clad metal core PCB (MCPCB’s) line. HPL is a dielectric specifically formulated for high power lighting LED applications...
Bond-Ply 660P -- 8806385090561 Bond-Ply 660P is a thermally conductive, electrically insulating, double sided pressure sensitive adhesive tape.The tape consists of a high performance, thermally conductive acrylic adhesive coated on both sides of a...
Bond-Ply LMS 500P -- 8806385025025 Bond-Ply LMS 500P is a thermally conductive laminate with a polyimide film substrate.The product consists of a high performance thermally conductive low modulus silicone compound coated both sides of a...
Bond-Ply 800 -- 8806385057793 Bond-Ply® 800 is a thermally conductive, electrically isolation double-sided tape. Bond-Ply® 800 is utilized in lighting applications that require thermal transfer and electric isolation. High bond strengths obtained at ambient...
Bond-Ply LMS-HD -- 8806384992257 Bond-Ply® LMS-HD is a thermally conductive heat curable laminate material. The product consists of a high performance thermally conductive low modulus silicone compound coated on a cured core, and double...
Hysol OTO149-3 -- 8802592260097 Clear glob top material with good adhesion to any substrate.
Ablestik ABLETHERM 3188 -- 8799555158017 Conductive adhesive is designed for thermally enhanced BGA applications. Sensitive to amines. This material needs to be isolated from uncured epoxy-based resins as interaction will inhibit curing. It has a...
Hysol DC0114 -- 8799550013441 DC0114 epoxy underfill is suitable for high reliability applications due to its combination of properties. It can be applied to ceramic or organic substrates, including solder masks and polyimide.
ABLESTIK 2025D-SF -- 8799554732033 Designed to continuously flow and form fillets after die placement is complete. The Self-Filleting feature is ideal for packages requiring narrower and more controlled fillets.
Hysol 3329 -- 8802594848769 Developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol® UV dam encapsulants, such as Hysol 3323. This combination of...
ABLESTIK ABLEBOND 2033SC -- 8802605531137 Die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries.
Hysol ECCOBOND C850-6 -- 8799537594369 Eccobond C850-6 is a fast curing, general conductive, one component, low viscosity, silver filled epoxy die attach adhesive paste. It features high electrical and thermal conductivity and high strength at...
Hysol ECCOBOND CE3103 -- 8802591080449 Eccobond CE3103 is primarily designed for bonding polycarbonate to itself while not inducing stress cracking under typical molded stress levels. Eccobond CE3103 cures rapidly to form flexible, transparent bonds when...
Hysol ECCOBOND DX-20C -- 8802591113217 Eccobond DX-20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be...
Hysol ECCOBOND E3503-1 -- 8799540346881 Eccobond E3503-1 is optimised for SMT dispense and the manufacturing of high volume assemblies. It has high adhesion to the substrate finishes commonly used in microelectronics and will not adversely...
Hysol ECCOSEAL 7200 -- 8799473106945 Eccoseal 7200 adhesive sealant is designed for high throughput display assembly for displays that require protection against humidity and oxygen.
Hysol ECCOBOND CE3516LCL -- 8802594750465 Electrically conductive one-component, non-bleeding epoxy adhesive with low outgassing, eliminating wicking and bridging under small components.
Hysol US5532 -- 8799549587457 Encapsulant potting urethane.
Hysol STYCAST E1847 -- 8799551029249 Encapsulant potting, epoxy, one component.
Hysol STYCAST 2561/CAT 11 -- 8802595307521 Encapsulant potting, epoxy, two component, heat cure.
Hysol ECCOBOND 8177-0 -- 8799537168385 Enhanced thermal conductivity, fast cure, low stress die and component attach adhesive optimized for GaAs MMIC attach.
Ablestik ATB-105A -- 8799554928641 Excellent pick up performance with PSA D/T and controlled flow for die stacking (5 µm).
Hysol STYCAST 50500D -- 8799573770241 For protection of wire bonds consider this high purity material as either a dam or a glob top.
Gap Filler 1000 (Two Part) -- 8806384041985 Gap Filler 1000 is a thermally conductive, liquid gap filling material. It is supplied as a two-component, room or elevated temperature curing system. The material is formulated to provide a...
Gap Filler 1000SR (Two-Part) -- 8806384074753 Gap Filler 1000SR is a two-part, thermally conductive, liquid gap filling material that features superior slump resistance. The mixed system will cure at room temperature and can be accelerated with...
Gap Filler 1100 SF (Two Part) -- 8806383943681 Gap Filler 1100SF is the thermal solution for silicone-sensitive applications. The material is supplied as a two-part component curing at room or elevated temperatures. The material exhibits low modulus properties...
Gap Filler 1500 (Two-Part) -- 8806383910913 Gap Filler 1500 is a two-part, high performance, thermally conductive liquid gap filling material, which features superior slump resistance and high shear thinning characteristics for optimized consistency and control during...
Gap Filler 1500LV -- 8806383812609 Gap Filler 1500LV is a two-part, high performance, thermally conductive, liquid gap filling material. This material offers the high temperature resistance and low modulus of a silicone material with significantly...
Gap Filler 2000 (Two Part) -- 8806383779841 Gap Filler 2000 is a high performance, thermally conductive liquid gap filling material supplied as a two-component, room or elevated temperature curing system.The material provides a balance of cured material...
Gap Filler 3500S35 (Two Part) -- 8806383681537 Gap Filler 3500S35 is the technology leader in thermally conductive, liquid gap filling materials, featuring ultra-high thermal performance and superior softness. The material is a two-component, cured either at room...
Gap Filler 4000 -- 8806383714305 Gap Filler 4000 is a two-part, high performance, thermally conductive, liquid gap filling material. The mixed material will cure at room temparature and can be accelerated with the addition of...
Gap Pad 1500 -- 8806384238593 Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on...
Gap Pad 1500R -- 8806384435201 Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and...
Gap Pad 1500S30 -- 8806384533505 Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads.The material is fiberglass reinforced for improved puncture resistance and handling characteristics. Gap Pad...
Gap Pad 2000S40 -- 8806384697345 Gap Pad 2000S40 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill...
Gap Pad 2200SF -- 8806383845377 Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap...
Gap Pad 5000S35 -- 8806384959489 Gap Pad 5000S35 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability.The fiberglass reinforcement provides easy handling...
Gap Pad A2000 -- 8806384664577 Gap Pad A2000 acts as a thermal interface and electrical insulator between electrical components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is...
Gap Pad A3000 -- 8806384828417 Gap Pad A3000 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. Gap Pad...
Gap Pad EMI 1.0 -- 8807037599745 Gap Pad EMI 1.0 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies...
Gap Pad HC1000 -- 8806383976449 Gap Pad HC 1000 is an extremely conformable, low modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows...
Gap Pad VO -- 8806383550465 Gap Pad VO is a cost effective thermally conductive interface. The material is a filled thermally conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling.
Gap Pad VO Soft -- 8806383484929 Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on...
Gap Pad VO Ultra Soft -- 8806383616001 Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low stress vibration...
Gap Pad VO Ultra Soft Black -- 8806383583233 Gap Pad VO Ultra Soft-B is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening...
Gap Pad 1000HD -- 8806383648769 Gap Pad® 1000HD was designed to with-stand applications requiring high durability. The coated polyimide carrier on one side of the material allows easy rework, excellent handling characteristics and puncture resistance.
Gap Pad 1450 -- 8806384107521 Gap Pad® 1450 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a permanent liner, which facilitates rework and improves puncture resistance...
Gap Pad 2202SF -- 8806383878145 Gap Pad® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to...
Gap Pad 3004SF -- 8806384861185 Gap Pad® 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. Gap Pad® 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap...
Gap Pad 3500ULM -- 8806384893953 Gap Pad® 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due...
Gap Pad HC3.0 -- 8806384009217 Gap Pad® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a...
Hysol FP5500 -- 8799550144513 Heat cure material designed ACP process by thermal compression (RFID, Misc, Assembly).
Hi-Flow 105 -- 8806384631809 Hi-Flow 105 is a phase change material coated on both sides of an aluminum substrate. It is designed specifically to replace grease as a thermal interface, eliminating the mess, contamination...
Hi-Flow 225 -- 8806384599041 Hi-Flow 225F-AC is a high performance, thermal interface material for use between a computer processor and a heat sink. Hi-Flow 225F-AC consists of a soft, thermally conductive 55°C phase change...
Hi-Flow 225U -- 8806384500737 Hi-Flow 225U is designed for use as a thermal interface material between a computer processor and a heat sink. The product consists of a thermally conductive 55°C phase change compound...
Hi-Flow 225UT -- 8806384566273 Hi-Flow 225UT is designed as a pressure sensitive thermal interface material for use between a high performance processor and a heat sink. Hi-Flow 225UT is a thermally conductive 55°C phase...
Hi-Flow 300G -- 8806384402433 Hi-Flow 300G consists of a thermally conductive 55°C phase change compound coated on a fiberglass web. Hi-Flow 300G is designed as a thermal interface material between a computer processor and...
Hi-Flow 300P -- 8806384467969 Hi-Flow 300P consists of a thermally conductive 55°C phase change compound coated on a thermally conductive polyimide film.The polyimide reinforcement makes the material easy to handle, and the 55°C phase...
Hi-Flow 330P -- 8806384336897 Hi-Flow 330P is a thermally conductive phase change material featuring a natural tack on one side and reinforced with a polyimide film.The polyimide film provides a high dielectric strength and...
Hi-Flow 565U -- 8806384369665 Hi-Flow 565U is a thermally conductive phase change material which is applied in tabulated pad form. In the application the easy to use material undergoes a phase change at 52°C.
Hi-Flow 565UT -- 8806384304129 Hi-Flow 565UT is a naturally tacky, thermally conductive phase change material which is supplied in an easy to use tabulated pad form. In the application the material undergoes a phase...
Hi-Flow 625 -- 8806384271361 Hi-Flow 625 is a film-reinforced phase change material. The product consists of a thermally conductive 65°C phase change compound coated on PEN film. Hi-Flow 625 is designed to be used...
Hi-Flow 650P -- 8806384205825 Hi-Flow 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side.The polyimide film provides a high dielectric strength and high...
Hysol QMI536NB-1A3 -- 8799549423617 High JEDEC performance for first die and die-to-die bonding. Non-conductive and non-damaging to the die face. Can be cured as low as 80°c. No bleed.
Hysol FP4585 -- 8799550046209 High purity, flip-chip underfill, high Pb and no-Pb applications
HYSOL E1159 -- 8799576064001 HYSOL E1159 is designed for high volume assembly operations that require and underfill that flows fast at room temperature and fully cures in one reflow oven cycle. It is specifically...
HYSOL ECCOBOND 281 BLK epoxy adhesive -- 8799577702401 HYSOL ECCOBOND 281 BLK one component epoxy adhesive is formualted for use in applications requiring excellent thermal conductivity. It has high thermal conductivity, good chemical resistance and is electrically insulating.
HYSOL ECCOBOND DS7300 -- 8802596847617 HYSOL ECCOBOND DS7300 one component non-conductive epoxy perimeter sealant is designed to be used in display applications.
HYSOL ECCOBOND G500 -- 8799575834625 HYSOL ECCOBOND G500 is a general purpose epoxy adhesive and sealant that cures to a high gloss finish. It is used as insulation of copper and other materials and attaching...
HYSOL ECCOBOND G757HF-D -- 8799575965697 HYSOL ECCOBOND G757HF-D is a low halogen, non-conductive epoxy adhesive for ferrite bonding applications. It is suitable for use with temperature sensitive substrates and components.
HYSOL ECCOSEAL 7100 -- 8802595766273 HYSOL ECCOSEAL 7100 adhesive sealant is designed for high throughput display assembly that require protection against humidity and oxygen.
HYSOL EO1086 -- 8799551094785 HYSOL EO1086 is a one-component heat cure encapsulant designed for use in Chip on Board applications requiring excellent handling properties.
HYSOL ES1904 -- 8799578226689 HYSOL ES1904 is an opaque, medium-viscosity epoxy resin system recommended for small potting and laminating applications where excellent structural, mechanical and electrical properties are required. This two-part adhesive exhibits good...
HYSOL ES4512HF Non-Conductive Potting Compound -- 8799551356929 HYSOL ES4512HF is a two-part non-conductive, room temperature cure, halogen free potting compound. It is used in the consumer and industrial market.
Hysol FP0116 -- 8798616190977 Hysol FP0116
Hysol FP4545FC -- 8799468158977 Hysol FP4545FC is a low viscosity version of FP4548FC
Hysol FP4583 -- 8799544049665 Hysol FP4583 is a high purity, FC underfill, high lead applications
Hysol FP4652 -- 8799373066241 Hysol FP4652 is a fast cure, low stress version of FP4450 for a large array of packages.
Hysol FP6401 -- 8799544246273 Hysol FP6401 is a high purity, liquid flexible damming material.
Hysol GR828DD -- 8799546572801 Hysol GR828DD is a green, semiconductor grade, low stress and high adhesion molding compound. It is especially designed for DPAK/D2PAK packages with Ni and copper/Ag plating lead frames.
Hysol QMI 536UV -- 8799547457537 Hysol QMI 536UV is used for component or die attach where very high electrical and thermal conductivity is required. Suitable for high heat dissipation devices and solder replacement applications.
HYSOL QMI516IE -- 8799575441409 HYSOL QMI516IE electrically conductive hydrophobic adhesive is designed for die attach applications. It is a snap cure adhesive used in high throughput bonding applications.
Hysol QMI516LC -- 8799540969473 Hysol QMI516LC is a low temperature cure, silver-filled adhesive.
HYSOL STYCAST 2651MM/CATALYST 23LV -- 8799575638017 HYSOL STYCAST 2651MM CATALYST 23LV is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining.
HYSOL STYCAST 2651MM/CATALYST 9 -- 8799575605249 HYSOL STYCAST 2651MM Catalyst 9 is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining.
HYSOL STYCAST 2850KT/CATALYST 9 -- 8802596749313 HYSOL STYCAST 2850KT with CATALYST 9 epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications...
HYSOL STYCAST 2850MT-Catalyst 24LV -- 8799577178113 HYSOL STYCAST 2850MT-Catalyst 24LV is a two component, electrically insulating general purpose encapsulant. It is recommended for encapsulation of components that require heat dissipation and thermal shock properties. It is...
HYSOL STYCAST E1070 -- 8802597076993 HYSOL STYCAST E1070 one component epoxy encapsulant is recommended for small mass potting applications, <50 grams, used in automotive electronic applications.
HYSOL STYCAST EFF15 syntactic foam powder -- 8802597339137 HYSOL STYCAST EFF15 is a one component epoxy based free flowing syntactic foam powder designed to infiltrate around densely packed components and fill voids in electronic modules. It exhibits low...
HYSOL UF3810 -- 8799575343105 HYSOL UF3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent...
Hysol US0146 -- 8799549161473 Hysol US0146 is an unfilled, two component clear amber polyurethane casting system formulated for potting. Characteristics of Hysol US0146 include low viscosity, low durometer, long pot life and hydrolytic stability.
HYSOL US1150 -- 8802596782081 HYSOL US1150 is an extended polybutadiene/MDI base, mineral filled, medium hardness, ambient cure urethane encapsulant/sealant. This material can be used for potting electronics or devices for protection against environmental hazards.
HYSOL UV3001 -- 8799574327297 HYSOL UV3001 is a UV cure adhesive designed for high throughput assembly operations. It can withstand exposure to temperatures as high as 200°C. It is the 4 μm glass rod...
HYSOL XUV80260 -- 8802597044225 HYSOL XUV80260 is a UV curable display perimeter sealant for rigid type OLED.
HYSOL XUV80270-1 -- 8802595962881 HYSOL XUV80270-1 is a one-component, non-conductive, UV curable adhesive sealant for high throughput display assembly that require protection against humidity. It is formulated to cure very fast when exposed to...
HYSOL ES1000 -- 8802586656769 HYSOL® ES1000™ is a two-component, long pot life casting system with excellent handling properties. This material has good thermal shock resistance and low exotherm, making it suitable for encapsulation of...
HYSOL ES1301 -- 8802586755073 HYSOL® ES1301™ is a silica filled epoxy casting system recommended for coils, transformers, and general pupose casting.
HYSOL ES1900 -- 8802589736961 HYSOL® ES1900™ is a two-component casting system with excellent handling properties. Transparent, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications where clarity and excellent structural, mechanical and...
HYSOL ES1901 -- 8802586820609 HYSOL® ES1901™ is a fast-setting, toughened, medium viscosity, industrial grade epoxy adhesive. Once mixed, the two-component epoxy cures at room temperature with low shrinkage and forms an ultra clear bondline...
HYSOL ES2202 -- 8802586787841 HYSOL® ES2202™ is an unfilled epoxy system with a high operating temperature and long pot life. Excellent chemical resistance, excellent performance under high moisture and humidity.
HYSOL ES2207 -- 8802586984449 HYSOL® ES2207™ is a filled, resilient, low viscosity, room temperature cure epoxy potting compound. It will meet UL 94 V-0 requirements in 1/8 inch thickness.
HYSOL ES2500 -- 8802587213825 HYSOL® ES2500™ is a resilient, low cost, fast gelling potting compound. Ideal for potting and encapsulating high volume parts. Meets UL 94 HB Flame Retardant to 1.5mm thickness.
Hysol FF2200 -- 8799375425537 Hysol® FluxFill™ FF2200 is a reflow encapsulant designed for the assembly and protection of flip chip semiconductor devices utilizing a single material approach. The material is formulated to provide the...
HYSOL FP5000 -- 8799535988737 Hysol® FP5000™ is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent protection of integrated circuit electrical joints...
Liqui-Bond SA 1000 (One-Part) -- 8806383517697 Liqui-Bond SA 1000 is a thermally conductive, one-part liquid silicone adhesive with a low viscosity for easy screenability. Liqui-Bond SA 1000 features a high thermal performance and maintains it’s structure...
Liqui-Bond SA 1800 (One-Part) -- 8806384762881 Liqui-Bond SA 1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer. The adhesive is supplied as a one-part liquid component, offered in a tube...
Liqui Bond SA 2000 (One-Part) -- 8806384795649 Liqui-Bond SA 2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding elastomer. Liqui-Bond SA 2000 is supplied as a one-part liquid component, in either...
Liqui-Bond EA 1805 -- 8806384926721 Liqui-Bond® EA 1805 is a two-component, epoxy based, liquid-dispensable adhesive. Liqui-Bond® EA 1805 has a thermal conductivity of 1.8 W/mK. Liqui-Bond® EA 1805 will be supplied in a two-component format,...
Liqui Bond SA 3505 -- 8806384730113 Liqui-Bond® SA 3505 is a higher performance, thermally conductive, liquid adhesive. This material is supplied as a two-part material and requires no refrigeration. The mixed material cures at elevated temperatures.
Liqui-Form 2000 -- 8806383419393 Liqui-Form® 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework. Liqui-Form® 2000...
LOCTITE 190024LV -- 8799575998465 LOCTITE 190024LV single component, UV curable adhesive is designed to improve reliability in electronic component BGA edgebonding applications. This flexible material is engineered to enhance the load bearing and shock...
LOCTITE 3118 -- 8799552602113 LOCTITE 3118 is a white image sensor adhesive.
LOCTITE 3119 -- 8799578783745 Loctite 3119™ cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive.
LOCTITE 3128 -- 8802600648705 LOCTITE 3128 is a black image sensor adhesive.
LOCTITE 3128NH -- 8799469469697 LOCTITE 3128NH edgebond material is designed to add reliability to chip scale packages and other electronic components. It is a low temperature cure adhesive ideal for use on heat sensitive...
LOCTITE 3131 -- 8799436898305 LOCTITE 3129 is a one-component UV and heat dual cure adhesive for assembly of temperature sensitive electronic components.
LOCTITE 3129 -- 8802600681473 LOCTITE 3129 is an image sensor adhesive.
LOCTITE 3217 -- 8799553912833 LOCTITE 3217 is a one-component UV and heat dual cure adhesive for assembly of temperature sensitive electronic components.
LOCTITE 3220 -- 8799579013121 LOCTITE 3220 is a one-component low temperature cure, snap cure with excellent ahesion on wide range of materials.
LOCTITE 3220WH -- 8799579209729 LOCTITE 3220WH is a one component designed for use in heat sensitive optoelectronic components and other microelectronic devices. This material offers excellent light reflection characteristics. 3220WH is the white colored...
LOCTITE 3318 -- 8799579373569 LOCTITE 3318 is suitable for a wide variety of coating applications that require strict humidity reliability performance, such as ITO/COG overcoat in LCD module assembly.
LOCTITE 3508 -- 8802600910849 LOCTITE 3508 is a lead-free, one-component epoxy corner bond adhesive. Applied pre-reflow and allows self-alignment of SMT components during reflow operation. Used for lead-free applications.
LOCTITE 3509 -- 8799377817601 LOCTITE 3509 is a one component heat cure epoxy designed for use as board level cornerbond for IC packages such as CSP's and BGA's.
LOCTITE 3513 -- 8802601074689 LOCTITE 3513 is a single-component epoxy used as a reworkable underfill for CSP or BGA's.
LOCTITE 3517 -- 8799403409409 LOCTITE 3517 is a one part, heat curable epoxy. It is designed for use as a reworkable CSP (FBGA) or BGA underfill for protection of solder joint against mechanical stress...
LOCTITE 3517M -- 8799580160001 LOCTITE 3517M one component reworkable underfill is designed for use as a solder joint protection against mechanical stress in handheld electronic device applications. It the low halogen content version of...
LOCTITE 3548 -- 8799371100161 LOCTITE 3548 is a next generation reworkable underfill for thermal and mechanical reliability. Designed to snap cure at low temperature to minimize thermal stress on PCB's. Fast flow for improved...
LOCTITE 3549 -- 8799468486657 LOCTITE 3549 is a next generation reworkable underfill for thermal and mechanical reliability. Designed to snap cure at low temperature to minimize thermal stress on PCB's. Fast flow for improved...
Loctite 3551 -- 8799403081729 Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.
LOCTITE 3563 -- 8799552634881 LOCTITE 3563 is a rapid curing fast flowing liquid epoxy for use as a capillary flow underfill for packaged IC's
LOCTITE 3593 -- 8799468290049 LOCTITE 3593 is a non-reworkable underfill for high mechanical reliability. Fast flow and snap cure for improved process time.
LOCTITE 3611 -- 8799375130625 LOCTITE 3611 is a stencil printable/pin transfer product for the bonding of surface mounted devices to printed circuit boards prior to wave soldering.
LOCTITE 3619 -- 8802601435137 LOCTITE 3619 is used for ultra low temperature cure, high speed syringe dispense.
LOCTITE 3629C -- 8799579242497 LOCTITE 3629C is a one-component, halogen free, fast cure epoxy formulated for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is designed to provide controlled...
LOCTITE 3705 -- 8802601598977 LOCTITE 3705 is a UV-cured adhesive designed for bonding electronics components on PCBs. Thixotropic nature reduces migration of product. Excellent adhesion to a wide range of substrate. Bonds in seconds...
LOCTITE 3719 -- 8802601664513 LOCTITE 3719 is a UV light curable adhesive designed for LCD terminal pin bonding applications.
LOCTITE 3730 -- 8799578980353 LOCTITE 3730 is a UV light curable sealant for LCD end-sealing applications.
LOCTITE 3733 -- 8799553224705 LOCTITE 3733 is a UV light curable sealant for LCD end-sealing applications.
LOCTITE 3736 -- 8802601730049 LOCTITE 3736 is a UV and visible light curable coating resin. This product is specially formulated for moisture protection on COG of LCD module or terminals of TAB mounts. Its...
LOCTITE 3781 -- 8799553257473 LOCTITE 3781 is a single component, UV light curable sealant for LCD end-sealing application.
LOCTITE 383 Output -- 8799553355777 Loctite 383 Output is a thermally conductive adhesive system designed for bonding heat generating components to heat sinks. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components,...
LOCTITE 3873 -- 8799552208897 LOCTITE 3873 is a fast curing, high-conductivity, self-shimming for bonding heat-generated devices to thermal spreader.
LOCTITE 3874 -- 8799552241665 LOCTITE 3874 is a fast-curing, high-conductivity for bonding heat-generated devices to thermal spreader without glass beads.
LOCTITE 3900 -- 8802599141377 LOCTITE 3900 is an air-dry coating designed for small production runs. It may be applied by spray, dip or brush procedures. Aerosol fast cure. Note: Not sold in Europe.
LOCTITE 5210 -- 8802602123265 LOCTITE 5210 is an ultra fast curing, non-corrosive RTV silicone designed for potting, wire tracking, selective sealing, vibration dampening and repair/rework applications on PCB's.
LOCTITE 5290 -- 8799373918209 Loctite 5290 is used for protecting printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is typically used in applications with an...
LOCTITE 5293 -- 8799403245569 LOCTITE 5293 is a repairable, solvent-free, medium viscosity, UV / moisture cure silicone suited to brush, dip and selective coating.
LOCTITE 5296 -- 8802598092801 LOCTITE 5296 is a heat cure silicone that can be applied with brush, dip or spray. High reliability automotive. Clear.
LOCTITE 5404 -- 8799578521601 LOCTITE 5404 Output is a self-shimming, flexible silicone adhesive for demanding parts such as ceramic boards.
LOCTITE 5406M -- 8799579176961 LOCTITE 5406M is a one component flexible RTV silicone engineered to enhance load bearing and shock absorbing properties of the bonded area. It is also used to protect electrical devices...
LOCTITE 5421 -- 8799552176129 LOCTITE 5421 is an RTV silicone that provides EMI / RFI shielding on electronic device enclosures.
LOCTITE ABLELOC 5500SB tape adhesive -- 8802610970625 LOCTITE ABLELOC 5500SB is a tape adhesive for high speed operations where dwell time and pressure must be minimized. The adhesive is coated onto both sides of a polyimide carrier.
LOCTITE ABLESTIK 3880 -- 8799373950977 LOCTITE ABLESTIK 3880 is designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required.
LOCTITE 5089 -- 8802599206913 Loctite® 5089™ Nuva-Sil® Silicone Gasket / Sealant is used for gasketing and sealing applications. Upon exposure to sufficient UV light and/or atmospheric moisture, this product cures to form a durable,...
Loctite 3192 -- 8802602418177
Loctite 3193 -- 8802612412417
Loctite 3195 -- 8802602844161
Loctite 3195DM -- 8802602483713
Loctite 3196 -- 8802602876929
Loctite 5192 -- 8802612379649
Loctite 5192DM -- 8802602942465
Loctite® Liquid Optically Clear Adhesives (LOCAs) for cover lens bonding, touch panel sensor assembly and direct bonding applications in touch panel and display devices including mobile phones, tablets, monitors, televisions...
Hysol EO1088 -- 8799542214657 One component encapsulants potting epoxy.
Hysol ECCOBOND CE3535 -- 8799539298305 One component epoxy adhesive paste providing high mechanical strength and stable contact resistance on Cu and 100% Sn.
Hysol ECCOBOND CE3520-3 -- 8799539167233 One component, general conductive, low stress nickel-filled adhesive for mismatched CTE with good shielding properties.
Hysol ECCOBOND TE3530 -- 8799536054273 One component, low temperature curing thermally conductive epoxy adhesive.
Hysol ECCOBOND G757HF -- 8799549915137 One-component epoxy adhesive providing high mechanical strength; stable contact resistance on Cu and 100% Sn.
Hysol ECCOBOND C990 -- 8799537725441 One-component, silver-filled epoxy adhesive.
Ablestik ABLELUX A4502 -- 8799473565697 Photocurable adhesive is designed for high throughput assembly operations.
Hysol EE1068/HD3404 -- 8799436341249 Potting encapsulant-epoxy two component room temperature cure.
Ablestik ABLELUX LA-1UV -- 8799473631233 Single component, photocurable adhesive is designed for bonding camera module assemblies.
ABLESTIK ATB-100 Series (Film) -- 8799479660545 Single layer adhesive film for mother/daughter die stacking applications. Co-curable with molding process.
Ablestik ATB-105U -- 8799473958913 Single layer format, fast cure die attach film (5 µm).
Hysol ECCOBOND CA3152 -- 8799538544641 Snap curable, low temperature cure, electrically conductive adhesive with excellent adhesion and reliability of Cu and Al substrates.
Hysol STYCAST 2850FT"/CAT 11 -- 8799550930945 STYCAST 2850FT/Catalyst 11 is recommended for encapsulation of components that require heat dissipation and thermal shock properties. Passes NASA outgassing standards.
Hysol STYCAST 2850FT/CAT 23LV -- 8799550963713 STYCAST 2850FT/Catalyst 23LV is recommended for encapsulation of components that require heat dissipation and thermal shock properties.
Hysol STYCAST U2500 -- 8799570460673 Stycast U2500 is an encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings.
Hysol ECCOBOND D125F -- 8799539724289 Surface mount adhesive designed for high speed dispensing.
Gap Pad 1000SF -- 8806383747073 The new Gap Pad 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensative applications. The material is ideal for applications with high standoff and flatness tolerances.
HR-T30.20 -- 8806383353857
HT-04503 -- 8806383288321
HT-07006 -- 8806383255553
Thermal Clad Metal Core PCB’s (MCPCB’s) minimize thermal impedance and conduct heat more effectively than standard printed wiring boards (PWB's).These substrates are more mechanically robust than thick-film ceramic and direct...
Hysol ECCOBOND S-3869 -- 8799474221057 Thermosetting, dielectric adhesive developed for GaN chip bonding for high-brightness LEDs. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
Hysol QMI5030 -- 8799541002241 Unique product resulting from blend of thermoset and thermoplastic resins.
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8660S
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8880S
With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting...

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