Henkel Corporation - Electronics Datasheets for Electrical and Electronic Resins
Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Electrical and Electronic Resins: Learn more
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| Product Name | Notes |
|---|---|
| (Known as Ablebond 2035SC ) LOCTITE ABLESTIK 2035SC is non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize... | |
| (Known as Ablebond 2035SC-1B1 ) LOCTITE ABLESTIK 2035SC-1B1 non-conductive, one component die attach adhesive was formulated for high throughput die attach applications. It is designed for die attach applications requiring... | |
| (Known as Ablebond 2053S ) LOCTITE ABLESTIK 2053S is a low stress adhesive for die-to-substrate applications. | |
| (Known as Ablebond 2300 ) LOCTITE ABLESTIK 2300 is an ultra low moisture absorption, low stress adhesive. | |
| (Known as Ablebond 3230 ) LOCTITE ABLESTIK 3230 is an electrically conductive die attach adhesive is designed for high reliability package applications. It can be used in a variety of... | |
| (Known as Ablebond 3290 ) LOCTITE ABLESTIK 3290 is a snap curable, electrically conductive die attach adhesive designed for lead-free applications where high reliability is a key requirement. | |
| (Known as Ablebond 342-37 ) LOCTITE ABLESTIK 342-37 epoxy adhesive is designed for applications requiring outstanding thermal shock properties. | |
| (Known as Ablebond 8175 ) LOCTITE ABLESTIK 8175 is an electrically conductive adhesive for solder replacement and microelectronic interconnect applications. | |
| (Known as ABLEBOND 8175Q ) LOCTITE ABLESTIK 8175Q is an electrically conductive, paste adhesive designed for solder replacement in microelectronic interconnect applications | |
| (Known as Ablebond 8290 ) LOCTITE ABLESTIK 8290 is a low stress die attach adhesive suitable for die size <200 mil. | |
| (Known as Ablebond 8350R ) LOCTITE ABLESTIK 8350R is a snap curable die attach adhesive designed to provide anti-delamination and package reliability. | |
| (Known as Ablebond 8352L ) LOCTITE ABLESTIK 8352L is a high electrical and thermal conductivity die attach adhesive. | |
| (Known as Ablebond 8384 ) LOCTITE ABLESTIK 8384 is a die attach adhesive is designed for smart card applications. | |
| (Known as Ablebond 8387B ) LOCTITE ABLESTIK 8387B is a non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast... | |
| (Known as ABLEBOND 84-1LMI ) LOCTITE ABLESTIK 84-1LMI enhanced thermal conductivity, fast cure, low stress die & component attach adhesive optimized for GaAs MMIC attach. | |
| (Known as Ablebond 84-1LMISR3 ) LOCTITE ABLESTIK 84-1LMISR3 electrically conductive adhesive is designed for die attach applications. It is a low viscosity and higher thixotropic index version of ABLEBOND 84-1LMIS. | |
| (Known as Ablebond 84-1LMISR4 ) LOCTITE ABLESTIK 84-1LMISR4 is an industry standard die attach adhesive. | |
| (Known as Ablebond 84-1LMIT1 ) LOCTITE ABLESTIK 84-1LMIT1 is a fast, low temperature cure electrically & thermally conductive adhesive. Ideally suited for low stress die & component attaching, this adhesive... | |
| (Known as Ablebond 84-3 ) LOCTITE ABLESTIK 84-3 is an exceptionally low thermal resistance. Superior contact resistance and adhesion stability on Sn, SnPb and OSP Cu. Very low weight loss... | |
| (Known as Ablebond 8700K (5.4g) ) LOCTITE ABLESTIK 8700K is a high thermal conductivity, low temperature curing, microelectronics grade adhesive. | |
| (Known as Ablebond 965-1L ) LOCTITE ABLESTIK 965-1L is an electrically conductive epoxy die attach designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion. It is... | |
| (Known as Ablebond 967-1 ) LOCTITE ABLESTIK 967-1 adhesive is designed for applications which require lower-than-normal cure temperatures. It is ideal for application by automatic dispenser, screen printing or hand... | |
| (Known as Ablebond 967-3 ) LOCTITE ABLESTIK 967-3 is a two component, solvent-free adhesive designed for applications that require lower-than-normal cure temperatures. | |
| (Known as Ablebond 969-1 ) LOCTITE ABLESTIK 969-1 is an electrically conductive preimidized adhesive designed for semiconductor die attach. It is not recommended for use in hermetic packages. | |
| (Known as Ablebond GA-2W ) LOCTITE ABLESTIK GA2W is a single component adhesive is designed for CCD/CMOS die attach bonding applications. This adhesive can be cured using directed heat energy... | |
| (Known as Ablebond MC723 ) LOCTITE ECCOBOND MC 723 is for bondline control achieved with 75 micron spacers. Compatible with silicone TIM. | |
| (Known as Ablestik 8008MD ) LOCTITE ABLESTIK 8008MD is an adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing... | |
| (Known as ABLESTIK 84-1LMISR4-S25 ) LOCTITE ABLESTIK 84-1LMISR4-S25 is an electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. This material is... | |
| (Known as ABLESTIK ABLEBOND 16-1 ) LOCTITE ABLESTIK 16-1 is a two-component, electrically conductive epoxy adhesive designed for general purpose applications. It cures at room temperature while providing a reasonable... | |
| (Known as ABLESTIK ABLEBOND 2000 ) LOCTITE ABLESTIK 2000 electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the... | |
| (Known as Ablestik ABLEBOND 2000B ) LOCTITE ABLESTIK 2000B is an electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to... | |
| (Known as Ablestik ABLEBOND 2025D ) LOCTITE ABLESTIK 2025D is a hybrid chemistry die attach adhesive designed for PBGA. | |
| (Known as ABLESTIK ABLEBOND 2025DSI ) LOCTITE ABLESTIK 2025DSI is a non-conductive low bleed adhesive. | |
| (Known as ABLESTIK ABLEBOND 2030SC ) Die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage... | |
| (Known as Ablestik ABLEBOND 2100A ) LOCTITE ABLESTIK 2100A is an ultra low moisture absorption adhesive with high hot/wet die shear strength. For lead-free packaging. | |
| (Known as ABLESTIK ABLEBOND 2310 ) LOCTITE ABLESTIK 2310 Is a conductive die attach adhesive designed for use on a wide range of BGA die sizes. Its unique conductive filler... | |
| (Known as ABLESTIK ABLEBOND 3003 ) LOCTITE ECCOBOND 3003 adhesive is designed for lid attach in flip chip BGA applications. The combination of product features result in superior flip chip... | |
| (Known as ABLESTIK ABLEBOND 3005 ) LOCTITE ECCOBOND 3005 adhesive is designed for lid attach in flip chip BGA applications. The combination of product features result in superior flip chip... | |
| (Known as ABLESTIK ABLEBOND 3230A ) LOCTITE ABLESTIK 3230A adhesive die attach is designed for semiconductor packaging applications where high electrical conductivity is not required. It can be used in... | |
| (Known as Ablestik ABLEBOND 8177 ) LOCTITE ABLESTIK 8177 is a fast, general conductive, low temperature cure, electrically & thermally conductive adhesive. Ideally suited for low stress die & component... | |
| (Known as ABLESTIK ABLEBOND 8200C ) LOCTITE ABLESTIK 8200C is an electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This... | |
| (Known as Ablestik ABLEBOND 8200TI ) LOCTITE ABLESTIK 8200TI is LOCTITE ABLESTIK 8200C with higher thermal conductivity and optimized adhesion on NiPdAu leadframe. | |
| (Known as ABLESTIK ABLEBOND 8340-O ) LOCTITE ABLESTIK 8340-O is an electrically conductive die attach adhesive designed for high reliability lead frame packaging applications. | |
| (Known as ABLESTIK ABLEBOND 8350M ) LOCTITE ABLESTIK 8350M electrically conductive one component die attach adhesive has been formulated for use in high throughput die attach applications. | |
| (Known as ABLESTIK ABLEBOND 8387A ) LOCTITE ABLESTIK 8387A is a non-conductive die attach adhesive designed for high throughput smart card bonding applications. | |
| (Known as ABLESTIK ABLEBOND 8387B-1B2 ) LOCTITE ABLESTIK 8387B-1B2 non-conductive die attach adhesive contains 50 μm polymer spacers for bondline control. It contains a black pigmentation for blocking stray light. | |
| (Known as ABLESTIK ABLEBOND 8387BS ) LOCTITE ABLESTIK 8387BS is a single component adhesive is designed for high throughput bonding applications. It contains spacers for improved bondline control. | |
| (Known as ABLESTIK ABLEBOND 8387BSW ) LOCTITE ABLESTIK 8387BSW is a single component, non-conductive adhesive designed for high throughput bonding applications. Used for image sensor bonding on camera modules. It... | |
| (Known as ABLESTIK ABLEBOND 84-1A ) LOCTITE ABLESTIK 84-1A is an adhesive for high volume semiconductor applications. This paste adhesive is ideal for application by printing, dispensing or stamping. | |
| (Known as Ablestik ABLEBOND 84-1LMISR8 ) LOCTITE ABLESTIK 84-1LMISR8 is an electrically conductive adhesive is designed for power applications that use Cu leadframes. It can be used in a variety... | |
| (Known as ABLESTIK ABLEBOND 85-1 ) Gold-filled, high reliability conductive adhesive for critical applications. | |
| (Known as ABLESTIK ABLEBOND 8700E ) LOCTITE ABLESTIK 8700E is an electrically conductive epoxy adhesive with high shear strength after thermal cycling. | |
| (Known as Ablestik ABLEBOND 8900NC ) LOCTITE ABLESTIK 8900NC is a die attach adhesive has been formulated for use in high throughput die attach applications. Actual performance will depend on... | |
| (Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant ) LOCTITE ECCOBOND 933 one component epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimized... | |
| (Known as ABLESTIK ABLEBOND 958-11 ) An electrically insulating adhesive designed to absorb stress produced when bonding large ICs. | |
| (Known as ABLESTIK ABLEBOND AAA3131A ) LOCTITE ABLESTIK AAA 3131A die attach is electrically and thermally conductive recommended for package types which require very low electrical resistivity. It is snap... | |
| (Known as ABLESTIK ABLEBOND FS849-TI ) LOCTITE ABLESTIK FS 849-TI is a high thermal conductivity adhesive with low electrical resistanc | |
| (Known as Ablestik ABLECOAT 8006NS ) LOCTITE ABLESTIK 8006NS is a non-conductive oven cure adhesive utilizing wafer backside coating technology. | |
| (Known as Ablestik ABLECOAT 8008HT ) LOCTITE ABLESTIK 8008HT is a high thermal conductivity snap cure adhesive utilizing wafer backside coating technology. | |
| (Known as Ablestik ABLEFILL UF8806G ) LOCTITE ECCOBOND UF 8806G is moisture resistant. For die sizes <25mm. Ultra low alpha emissions. | |
| (Known as ABLESTIK ABLEFILL UF8807 ) One component, high flow liquid underfill encapsulant with superior moisture resistance. | |
| (Known as ABLESTIK ABLEFILL UF8826 ) LOCTITE ECCOBOND UF 8826 is for eutectic high lead low k applications. Medium modulus, low CTE. | |
| (Known as ABLESTIK ABLEFILL UF8828 ) LOCTITE ECCOBOND UF 8828 is for eutectic, high lead or lead-free packaging. Higher modulus. | |
| (Known as ABLESTIK ABLEFILL UF8829 ) LOCTITE ECCOBOND UF 8829 is for small die in lead-free and low k applications. Higher modulus, lowest CTE. | |
| (Known as Ablestik ABLEFILM 5020K ) LOCTITE ABLESTIK 5020K is a high purity adhesive with excellent adhesion to gold-plated surfaces, particularly suited for use in hermetic packages. It is certified... | |
| (Known as Ablestik ABLEFILM 5025E ) LOCTITE ABLESTIK 5025E is an unsupported epoxy adhesive film ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not... | |
| (Known as Ablestik ABLEFILM 506 ) LOCTITE ABLESTIK ECF 506 is a flexible film adhesive designed for bonding TCE mismatched materials. Slight tack can simplify assembly. | |
| (Known as Ablestik ABLEFILM 550 ) LOCTITE ABLESTIK 550 is a high strength adhesive that bonds well to gold and other difficult bonding surfaces. | |
| (Known as Ablestik ABLEFILM 550K ) LOCTITE ABLESTIK 550K combines high adhesion strength with very good thermal conductivity in a fiberglass supported film adhesive available in a wide range of... | |
| (Known as ABLESTIK ABLEFILM 551 ) LOCTITE ABLESTIK 551 is a flexible unsupported adhesive film is designed to produce tough, resilient bonds between materials with differing coefficients of thermal expansion. | |
| (Known as ABLESTIK ABLEFILM 561 ) LOCTITE ABLESTIK 561 is a thermally conductive epoxy film designed for bonding materials with mismatched coefficients of thermal expansion. | |
| (Known as Ablestik ABLEFILM 561K ) High adhesion strength with excellent flexibility for bonding mismatched CTE materials. | |
| (Known as Ablestik ABLEFILM 563K ) LOCTITE ABLESTIK 563K is an electrically insulating film with high thermal conductivity and adhesion strength. Available either unsupported or with a fiberglass carrier. | |
| (Known as Ablestik ABLEFILM 566K ) LOCTITE ABLESTIK 566K offers low temperature cure in a thermally conductive adhesive with excellent flexibility and adhesion. | |
| (Known as Ablestik ABLEFILM 566KAPTON ) LOCTITE ABLESTIK 566KAP contains a polyamide carrier providing high insulation resistance. With a low temperature cure and excellent flexibility it is particularly suitable for... | |
| (Known as ABLESTIK ABLEFILM ECF550 ) ABLESTIK ABLEFILM ECF550 adhesive is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, this adhesive film acts as an... | |
| (Known as Ablestik ABLEFILM ECF561E ) LOCTITE ABLESTIK ECF 561E is the most flexible of the fiberglass-supported electrically conductive products. | |
| (Known as Ablestik ABLEFILM ECF564A ) LOCTITE ABLESTIK ECF 564A is an ionically clean, fiberglass supported adhesive with very good thermal conductivity. It is certified to MIL-STD-883, Method 5011. | |
| (Known as ABLESTIK ABLEFILM ECF564AHF ) LOCTITE ABLESTIK ECF 564AHF1004 is a heat cure, electrically conductive epoxy film designed for use in hybrid packages where outgassing and ionic contamination must... | |
| (Known as Ablestik ABLEFILM ECF568 ) LOCTITE ABLESTIK ECF 568 was designed for low temperature cure applications. It has superior adhesion to most surfaces. | |
| (Known as Ablestik ABLEFLEX 6200 ) LOCTITE ABLESTIK 6200 is a B-stageable printable paste with low moisture uptake and bleed. | |
| (Known as Ablestik ABLEFLEX 6202C-X ) LOCTITE ABLESTIK 6202C-X is a B-stageable adhesive is ideal for laminate-based packages where tolerance and bleed need to be minimized. This low modulus adhesive... | |
| (Known as ABLESTIK ABLELUX A4035T ) LOCTITE ECCOBOND LUX A4035T photocurable adhesive is formulated to enhance productivity in the assembly of optical, fiber optic, and optoelectronic devices. In addition to... | |
| (Known as ABLESTIK ABLELUX A4083T ) LOCTITE ECCOBOND LUX A4083T photocurable adhesive is formulated to enhance productivity in the assembly of optical, fiber optic and optoelectronic devices. | |
| (Known as ABLESTIK ABLELUX LHA-2 ) LOCTITE ABLESTIK LHA 2 is an adhesive paste is designed for lens holder attach for camera module applications. It can be cured at low... | |
| (Known as Ablestik ABLELUX OGR150THTG ) Photocurable adhesive is designed for high throughput optoelectronic assembly operations. This product also contains a secondary thermal cure mechanism for applications that contain shadowed... | |
| (Known as Ablestik ABP 8064T ) LOCTITE ABLESTIK ABP 8064T highly filled, conductive die attach paste adhesive is designed to provide high thermal and electrical conductivity in the attachment of... | |
| (Known as ABLESTIK ABP 8611 Die attach adhesive ) LOCTITE ABLESTIK ABP 8611 adhesive is designed for die attach applications as well as component attach. Its high dielectric property helps... | |
| (Known as Ablestik ABP-2501 ) LOCTITE ABLESTIK ABP 2501 die attach adhesive has been formulated for use in high throughput die bonding applications. This material is designed to minimize stress... | |
| (Known as ABLESTIK ABP-8910T ) LOCTITE ABLESTIK ABP 8910T die attach adhesive is formulated with a medium modulus using hybrid chemistry and is targeted for use on medium to large... | |
| (Known as ABLESTIK ACP-3122 ) LOCTITE ABLESTIK ACP 3122 is an anisotropic epoxy adhesive is designed for high throughput microelectronics assembly applications. This adhesive conducts in only one direction, making... | |
| (Known as Ablestik ATB-105 ) LOCTITE ABLESTIK ATB 105US is a single layer format die attach film (5 µm). | |
| (Known as Ablestik ATB-115US ) LOCTITE ABLESTIK ATB 115US adhesive film (15 µm) is formulated for use in wafer lamination processess and preform decal. It is designed for use in... | |
| (Known as Ablestik ATB-120 ) LOCTITE ABLESTIK ATB 120 is a single layer format die attach film (20 µm). | |
| (Known as Ablestik ATB-125US ) LOCTITE ABLESTIK ATB 125US is an adhesive film (25 µm) is formulated for use in wafer lamination processess and preform decal. It is designed for... | |
| (Known as Ablestik ATB-130 ) LOCTITE ABLESTIK ATB 130 is a single layer format die attach film (30 µm). | |
| (Known as Ablestik C115 ) LOCTITE ABLESTIK C100 Series (C115 and C130) die attach adhesive film is suitable for tight geometry (<100μm) leadframe packages where high electrical performance is required. | |
| (Known as ABLESTIK CA3556HF ) Loctite Ablestik CA3556HF is an electrically conductive adhesive designed for applications that require a very fast cure at low temperatures. It is ideally suited for... | |
| (Known as ABLESTIK ICP 3556M1 Electrically conductive adhesive ) LOCTITE ABLESTIK ICP 3556M1 is a one component, snap curable electrically conductive adhesive designed for applications that require a very fast... | |
| (Known as ABLESTIK ICP 3601 ) LOCTITE ABLESTIK ICP 3601 electrically conductive epoxy paste is specifically formulated for capacitor component assembly. It has excellent contact resistance and high bond strength. | |
| (Known as ABLESTIK ICP-3535M1 ) LOCTITE ABLESTIK ICP 3535M1 is an electrically conductive adhesive is designed for circuit assembly applications. It is specially recommended for mounting lower cost tin (Sn)... | |
| (Known as ABLESTIK ICP-3801 conductive adhesive ) LOCTITE ABLESTIK ICP 3801 is a one component electically conductive epoxy designed to provide lower and more stable costs compared to materials relying... | |
| (Known as ABLESTIK ICP-4000 ) LOCTITE ABLESTIK ICP 4000 is a silicone based, electronically conductive adhesive recommended in mounting small components to a variety of interconnect substrates. It can be... | |
| (Known as Ablestik ICP-4298 ) LOCTITE ABLESTIK ICP 4298 is a one-component, silicone based, electrically conductive adhesive. It is specially designed for applications where both high flexibility and excellent conductivity... | |
| (Known as Ablestik ICP-4298 S39 ) LOCTITE ABLESTIK ICP 4298 is a silicone based electrically conductive adhesive. It is specially designed for applications where both high flexibility and excellent conductivity... | |
| (Known as ABLESTIK ICP4001 ) LOCTITE ABLESTIK ICP 4001 is an isotropic, one component, conductive, solvent-free silicone paste specifically designed for applications where a high degree of flexibility is required. | |
| (Known as Abletherm 2600AT ) LOCTITE ABLESTIK 2158 adhesive is designed for thermal management applications requiring high heat extraction from the die such as high power and discrete devices. This... | |
| (Known as Abletherm 2700B ) LOCTITE ABLESTIK 2700B is a very high thermal conductivity adhesive with excellent bleed performance on gold. | |
| (Known as ABLETHERM 2700HT ) LOCTITE ABLESTIK 2700HT is a die attach is desgined for Pb-free array packaging. This adhesive is ideal for small needle dispensing in SIP or MCM... | |
| (Known as ABP 8060T(18g) ) LOCTITE ABLESTIK ABP 8060T electrically conductive die attach paste is formulated to provide high heat transfer generated from power devices. This material can also be... | |
| (Known as ABP-2100AC (35g) ) LOCTITE ABLESTIK ABP 2100AC die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures necessary for... | |
| (Known as ABP-8062T (17.5g) ) LOCTITE ABLESTIK ABP 8062T electrically conductive die attach paste is formulated to provide high heat transfer generated from power devices. This material can also be... | |
| (Known as CAT 15-1 CLEARJ ) LOCTITE CAT 15-1 CLEARJ is designed for use with potting and encapsulating resins. | |
| (Known as CAT 15-1 LV ) LOCTITE CAT 15-1 LV is designed for use with potting and encapsulating resins. | |
| (Known as CE-3850 ) LOCTITE ABLESTIK CE3850 one component electrically conductive adhesive is desgined for circuit assembly applications It is specifically recommended for mounting low cost tin (Sn) and nickel... | |
| (Known as CE-3920 ) LOCTITE ABLESTIK CE3920 is an electrically conductive adhesive for thin film PV assembly with superior contact resistance stability. Viscosity optimized for dispensing. | |
| (Known as E&C STYCAST 5952 A/B thermally conductive silicone encapsulant ) LOCTITE STYCAST 5952 RD PTA is a filled, addition cured, silicone encapsulant. It features good thermal conductivity, excellent electrical... | |
| (Known as EASY STACK ATB-F125E-8 ) LOCTITE ABLESTIK ATB-F125E Adhesive Film Die Attach is formulated for use in wafer lamination processes or as a preform decal. | |
| (Known as ECCOBOND 2332 ) LOCTITE ABLESTIK 2332 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100°C. | |
| (Known as ECCOBOND 276 1kg ) LOCTITE STYCAST 276 epoxy is formulated not to sag or run during cure when applied on loose fitting parts set on vertical or overhead... | |
| (Known as ECCOBOND 282 ) LOCTITE ABLESTIK 282 is an one component, silk screenable, viscous epoxy with high thermal conductivity. | |
| (Known as ECCOBOND 285 ) LOCTITE ABLESTIK 285 is a highly filled, thermally conductive, thixotropic epoxy paste with low CTE. | |
| (Known as ECCOBOND 927-10 ) LOCTITE ABLESTIK 927-10 one component epoxy adhesive is designed for medical applications. It is also recommended for bonding, sealing or insulating heat sensitive parts. It... | |
| (Known as ECCOBOND A-164-1 ) LOCTITE ABLESTIK A164-1 is an enhanced thermal conductivity, fast cure, low stress die and component attach adhesive optimized for GaAs MMIC attach. | |
| (Known as ECCOBOND A-401 ) LOCTITE ABLESTIK A401 has good thermal conductivity; good high temperature resistance; bonds well to metal, glass, plastics and ceramics. | |
| (Known as ECCOBOND C-850-6L ) LOCTITE ABLESTIK C850-6L is a low viscosity version of C850-6. | |
| (Known as ECCOBOND C-860-1J ) LOCTITE ABLESTIK C860-1J is an one component silver filled epoxy adhesive. | |
| (Known as ECCOBOND DP1000 10cc (10g) Opt ) LOCTITE ECCOBOND DP1000 wirebond encapsulant features good adhesion to low energy plastic and metal substrates. It also has chemical and crack resistance. | |
| (Known as Eccobond DP1005 ) LOCTITE ECCOBOND DP 1005 jet dispensable die attach adhesive is designed for bonding low energy plastic on metal substrates. It is chemical resistant and has... | |
| (Known as ECCOBOND DS7400UV ) LOCTITE ECCOBOND DS 7400UV is a laminating adhesive and perimeter sealant is desgined for high throughput display assembly that require protection against humidity. It is... | |
| (Known as ECCOBOND DX-10C ) LOCTITE ABLESTIK DX10 is epoxy base clear type. Low viscosity. | |
| (Known as ECCOBOND UF 3130 underfill ) LOCTITE ECCOBOND UF 3130 is designed for use in heat sensitive optoelectronic components and other microelectronic devices. | |
| (Known as Eccobond UV9001 ) LOCTITE ECCOBOND UV 9001 is a dual cure sealant and adhesive that can be syringe dispensed. It is a UV liqht and heat cure material... | |
| (Known as Electrodag PF-021 UV Curable Encapsulant ) LOCTITE EDAG PF-021 E&C is a dot dispensable, UV curable encapsulating photopolymer designed to secure low profile surface mount devices to rigid... | |
| (Known as HYSOL 3508NH ) LOCTITE 3508NH is a one-component, reflow curable, halogen free epoxy designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. It can... | |
| (Known as Hysol CB0260 ) LOCTITE ECCOBOND CB0260 is a high adhesion version of FP4450 for temperatures up to 260°C after being exposed to L2 JEDEC preconditioning. | |
| (Known as Hysol CB0260-1 ) LOCTITE ECCOBOND CB0260-1 is a high adhesion version of FP4450 for temperatures up to 260°C after being exposed to L2 JEDEC preconditioning. | |
| (Known as Hysol CB064/FP4653 ) LOCTITE ECCOBOND CB064 is high purity, low stress, liquid, self-leveling encapsulant material. This material is for cavity fill or dam and fill applications. The unique... | |
| (Known as Hysol CF3350 ) LOCTITE ABLESTIK CF 3350 offers an excellent balance of adhesion strength, electrical and thermal conductivity, and processability. It is especially suited for RF applications. | |
| (Known as HYSOL DP1004 ) LOCTITE ECCOBOND DP 1004 is designed for bonding dissimilar substrates commonly used in ink jet applications and other MEMS devices. | |
| (Known as HYSOL DS6000 ) LOCTITE ECCOBOND DS 6000 is a one component adhesive sealant designed for display assembly applications. It exhibits high compatibility with liquid crystal materials. | |
| (Known as HYSOL DS7301 ) LOCTITE ECCOBOND DS 7301 is a one component non-conductive adhesive sealant is designed for display assembly applications that require protection against humidity and oxygen. | |
| (Known as Hysol E-3239 ) LOCTITE ECCOBOND E 3239 was designed as a chemically resistant fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates commonly used in... | |
| (Known as Hysol E1216 ) An innovative, non-reworkable, capillary flow underfill for CSP, BGA or flip chip devices. Designed for high volume assembly operations that require an underfill that flows... | |
| (Known as HYSOL E1216M ) LOCTITE E 1216M is a snap curable capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that cures... | |
| (Known as Hysol E1926 ) LOCTITE ECCOBOND E 1926 is an non-reworkable, wafer-level underfill that provides excellent thermal reliability and cures relatively fast compared to standard first level underfills. | |
| (Known as Hysol ECCOBOND 104 ) A two component epoxy adhesive with outstanding physical and dielectric properties and service temperatures up to 230°C. | |
| (Known as HYSOL ECCOBOND 2332-17 ) LOCTITE ABLESTIK 2332-17 is a solventless one component epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to... | |
| (Known as HYSOL ECCOBOND 281 epoxy paste ) LOCTITE ABLESTIK 281 is a thermally conductive and electrically insulating, one component filled thixotropic paste. It is suitable for use on a... | |
| (Known as Hysol ECCOBOND 45-Catalyst 15 ) A two component, room temperature curing, variable flexibility epoxy adhesive. | |
| (Known as Hysol ECCOBOND 56C/CAT 11 ) LOCTITE ABLESTIK 56C-CAT 11 KIT ia an adhesive designed to make electrical connections where hot soldering is impractical or to make electrical connections... | |
| (Known as Hysol ECCOBOND 57C ) LOCTITE ABLESTIK 57C is a convenient 1:1 mix ratio. High electrical and thermally conductive two component adhesive. | |
| (Known as Hysol ECCOBOND 59C ) LOCTITE ABLESTIK 59C is a two component, flexible, low temperature cure. | |
| (Known as Hysol ECCOBOND A312-20 ) LOCTITE ABLESTIK A 312-20 is a one component, encapsulants potting epoxy. | |
| (Known as Hysol ECCOBOND A316-48 ) A one component, oxide-filled, pourable epoxy adhesive with exceptional thermal stability. | |
| (Known as Hysol ECCOBOND CA3150 ) Snap curable, low temperature cure, electrically conductive adhesive with excellent adhesion and reliability of Cu and Al substrates. | |
| (Known as Hysol ECCOBOND CE3103WLV ) LOCTITE ABLESTIK CE 3103WLV is electrically conductive adhesive for thin film PV assembly with superior contact resistance stability. Low viscosity for fine line dispensing. | |
| (Known as Hysol ECCOBOND CE3104WXL ) LOCTITE ABLESTIK CE 3104WXL is an electrically conductive adhesive with superior contact resistance stability. Viscosity optimized for screen- and/or stencil-printing. | |
| (Known as Hysol ECCOBOND CE3126 ) Snap curable anisotropic adhesive is especially suited in applications where throughtput is critical. This product is typically used for very fine pitch flip chip... | |
| (Known as Hysol ECCOBOND CE3513 ) LOCTITE ABLESTIK CE 3513 is a one component, silver-filled, non-bleeding, electrically conductive epoxy adhesive with long shelf life at room temperature. | |
| (Known as Hysol ECCOBOND CE3804 A/B ) LOCTITE ABLESTIK CE3804 is an electrically conductive epoxy adhesive for microelectronics. | |
| (Known as Hysol ECCOBOND CE8500 ) One component, general conductive, low stress adhesive for mismatched CTE applications. High thermal conductivity. | |
| (Known as HYSOL ECCOBOND CT4042-1 A/B ) LOCTITE ABLESTIK CT4042-1 PTA is a two component silver-filled, easy to apply, conductive epoxy paste adhesive. It is recommended for chip bonding in... | |
| (Known as HYSOL ECCOBOND CT5047-2 A/B ) LOCTITE ABLESTIK CT 5047-2 KIT is a two component electrically conductive adhesive designed to make electrical connections where hot soldering is impractical or... | |
| (Known as Hysol ECCOBOND E1470 ) B-stage capable adhesive designed for component and lid attach applications. Bonds well to engineering plastics such as LCP, as well as silicon and metals... | |
| (Known as Hysol ECCOBOND E3200 ) LOCTITE ECCOBOND E 3200 is a very fast and low temperature curing one component adhesive with good flexibility, chemical and humidity resistance. | |
| (Known as HYSOL ECCOBOND E3526-5 ) LOCTITE ABLESTIK E 3526 is especially developed for ferrite core bonding applications. It is formulated to have high bond strength when cured at temperatures... | |
| (Known as Hysol ECCOBOND E6752 ) LOCTITE E 6752 is a one component, low temperature cure, surface mount adhesive that can be applied easily without stringing. | |
| (Known as Hysol ECCOBOND E8502-1 ) LOCTITE ABLESTIK E 8502-1 is a low modulus, thermally conductive, modified epoxy adhesive is ideally suited for management of large CTE mismatch & bonding... | |
| (Known as Hysol ECCOBOND G500HF ) General purpose one-component non-conductive epoxy adhesive and sealant that cures to a high gloss finish. | |
| (Known as Hysol ECCOBOND G909 ) LOCTITE ABLESTIK G 909 is a one component snap curable electrically conductive adhesive. | |
| (Known as Hysol ECCOBOND UV 9000 ) One component, low temperature curing thermally conductive epoxy adhesive. | |
| (Known as Hysol ECCOBOND UV9085 ) Designed as a faster curing, high thixotropic adhesive that gives good flow control and adhesion for a thick bondline. | |
| (Known as Hysol ECCOBOND XCE3111 ) One component, snap curable, electrically conductive adhesive. | |
| (Known as Hysol ECCOCOAT PC355-1 ) LOCTITE STYCAST PC 355-1 is a lead-free, transparent, one-component protective varnish system that is dry to the touch in under 30 minutes. | |
| (Known as HYSOL ECCOCOAT PC355-1FL conformal coating ) LOCTITE STYCAST PC 355-1FL flexible thermoplastic varnish is formulated to protect and insulate printed wiring boards both on the component and the... | |
| (Known as Hysol ECCOCOAT SC3613 ) Heat curable, optically clear, high purity, one-component coating to be applied by brush, dip or flow coating. | |
| (Known as Hysol ECCOCOAT U7510-1 ) LOCTITE STYCAST U 7510-1 is a lead-free, transparent, one component protective varnish system that is dry to the touch in under 30 minutes. | |
| (Known as Hysol ECCOCOAT UV7993 ) Solvent-free, one component dual cure conformal coating. | |
| (Known as Hysol EE1068 ) LOCTITE STYCAST EE 1068 is a general purpose flame retardant casting compound formulated to have a glass transition temperature above 100°C. | |
| (Known as HYSOL EE1117-HD3561 epoxy system ) LOCTITE STYCAST HD 3561 epoxy system is designed for use as a sealant or for potting electronic devices. It is specially formulated for... | |
| (Known as HYSOL EO0206 ) LOCTITE ECCOBOND EO 0206 one-component epoxy is designed for use on electronic devices. KEY BENEFITS Low Halogen content Non-Sag | |
| (Known as Hysol EO1016 ) LOCTITE ECCOBOND EO1016 is a UL94V-0 encapsulant for Smartcards and watch IC's. Nonabrasive filler allows for grinding if necessary. | |
| (Known as Hysol EO1058 ) LOCTITE STYCAST EO 10587 is a single component epoxy system that cures at 125°C. Hysol EO1058 provides excellent environmental and thermal protection to encapsulated parts. | |
| (Known as Hysol EO1060 ) LOCTITE ECCOBOND EO1060 is a low glob formulation for lower CTE and lower ionic than EO1016 content for more demanding applications. | |
| (Known as Hysol EO1061 ) LOCTITE ECCOBOND EO1061 is a medium glob formulation for lower CTE and lower ionic than EO1016 content for more demanding applications. | |
| (Known as Hysol EO1062 ) LOCTITE ECCOBOND EO1062 is a high glob version of EO1061. | |
| (Known as Hysol EO1080 ) LOCTITE ECCOBOND EO1080 is a low CTE version of EO1016. | |
| (Known as HYSOL EO7021 ) LOCTITE EO7021 is an encapsulant for use in smart card chip module applications. It is also suitable for die attach automated reel-to-reel processing. | |
| (Known as HYSOL EO7029 ) LOCTITE EO7029 is one component encapsulant is formulated for use in smart card applications. The thixotropic property of this material is designed to avoid flow... | |
| (Known as Hysol EO7038 ) LOCTITE EO7038 is a one-component epoxy potting system, formulated to protect sensors used in harsh environments, such as automotive applications. | |
| (Known as HYSOL EO7039 ) LOCTITE ECCOBOND EO7039 encapsulant is designed for attachment of integrated circuits and components to advanced flexible substrates. It is formulated to produce a void-free bond... | |
| (Known as Hysol ES1002 ) Black, low cost, flexible, capable of UL94V-0, non-abrasive filled, long pot life. | |
| (Known as HYSOL ES1004 ) LOCTITE STYCAST ES 1004 DQ is capable of UL94V-0, stable to 155°C. | |
| (Known as Hysol ES1902 ) LOCTITE STYCAST ES 1902 DQ is a clear, transparent, very fast UV gel with thermal co-cure, excellent dimensional stability and low viscosity; easy to handle. | |
| (Known as Hysol FF2300 ) LOCTITE ECCOBOND FF 2300 is a no-flow underfill for eutectic and lead-free applications. | |
| (Known as Hysol FP0114 ) LOCTITE ECCOBOND FP0114 is a low viscosity, fast flow, epoxy based material designed for capillary underfill on flip chip applications. It has excellent wettability and... | |
| (Known as Hysol FP4323 ) LOCTITE ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications. | |
| (Known as Hysol FP4410HF ) | |
| (Known as Hysol FP4450 ) LOCTITE ECCOBOND FP4450 is an industry standard fill material for fill or cavity down BGAs. | |
| (Known as Hysol FP4450HF ) LOCTITE ECCOBOND FP4450HF is a high flow version of FP4450LV using synthetic filler for use in fine wire and low alpha applications. | |
| (Known as Hysol FP4450LV ) LOCTITE ECCOBOND FP4450LV is a low viscosity version of FP4450 incorporating cleaner resins. | |
| (Known as Hysol FP4451 ) LOCTITE ECCOBOND FP4451 is an industry standard damming material for BGAs. | |
| (Known as Hysol FP4451TD ) LOCTITE ECCOBOND FP4451TD is a tall dam version of FP4451 for applications requiring a taller, narrower dam. Ionically cleaner also. | |
| (Known as Hysol FP4460 ) LOCTITE ECCOBOND FP4460 is a high purity, low stress glob top semiconductor encapsulant with improved moisture resistance and working life compared to earlier generation products. | |
| (Known as Hysol FP4470 ) LOCTITE ECCOBOND FP4470 is a high adhesion version of FP4450 for 260°C L3 JEDEC performance. | |
| (Known as Hysol FP4526 ) LOCTITE ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications. | |
| (Known as Hysol FP4530 ) LOCTITE ECCOBOND FP4530 is a fast flow encapsulant material for flip chip underfill applications with a gap of 1 mil. The material is designed to... | |
| (Known as Hysol FP4549 ) LOCTITE ECCOBOND FP4549 is used for fine-pitch flip chip applications, fast flowing, low stress underfill. | |
| (Known as Hysol FP4549HT ) LOCTITE ECCOBOND FP4549HT is an aluminum nitride-filled version of FP4549 for high thermal applications. | |
| (Known as Hysol FP4651 ) LOCTITE ECCOBOND FP4651 is a low viscosity version of FP4650 for a large array of packages. | |
| (Known as Hysol FP4654 ) LOCTITE ECCOBOND FP4654 is a low viscosity, high adhesion, version of FP4653 for large array packages. | |
| (Known as HYSOL FP4655 ) LOCTITE ECCOBOND FP4655 is a high performance encapsulant which can be used alone or as a cavity fill material, or in combination with FP4451 material... | |
| (Known as Hysol FP5001 ) LOCTITE ECCOBOND FP5001 is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent... | |
| (Known as Hysol FP5201 ) LOCTITE ECCOBOND FP 5201 is designed for thermal compression bonding processes in flip chip to laminate assembly. Laminate Packages CSP, SCSP, SIP | |
| (Known as Hysol FP5300 ) LOCTITE ECCOBOND FP5300 has excellent adhesion strength to 2- and 3-layer flex and Iaminates. Low temp cure ACP. For use on RFID, Misc, Assembly. | |
| (Known as Hysol FP6101 ) LOCTITE ECCOBOND FP6101 is a reworkable underfill for improvement of mechanical reliability. Fast flow and snap cure for improved process time. | |
| (Known as Hysol GR838LC ) LOCTITE HYSOL GR 838LC is low stress, excellent gate leakage performance. | |
| (Known as Hysol KL-G800H ) LOCTITE HYSOL KL-G 800H CD is a green epoxy molding compound suitable for thin leaded packages. It is designed to achieve JEDEC level 2. It... | |
| (Known as HYSOL LA3032-78 ) LOCTITE ECCOBOND LA 3032-78 encapsulant is designed for high throughput assembly operations. It is formulated to withstand high heat distortion temperatures and bonds well to... | |
| (Known as Hysol PC18M ) LOCTITE STYCAST PC 18M is a flexible solvent-based, one-component coating. Provides good thermal shock resistance. | |
| (Known as Hysol PC28STD ) LOCTITE STYCAST PC 28-STD is a convenient aerosol packaging, oxygen-cure, printed circuit board coating system. | |
| (Known as Hysol PC29M ) LOCTITE STYCAST PC 29M PTB is a thin-film printed circuit board coating with good toughness and high flexibility. Note: Not sold in Europe. | |
| (Known as Hysol PC40-UM ) LOCTITE STYCAST PC 40-UM is a solvent-free, low-viscosity, rapid gel, UV-moisture cure one component conformal coating. | |
| (Known as HYSOL PC40-UMF ) LOCTITE STYCAST PC 40-UMF conformal coating is specifically formulated to rapidly gel and immobolise when exposed to UV light and then fully cure when exposed... | |
| (Known as Hysol QMI 3555R ) LOCTITE ABLESTIK QMI3555R is a no-dry Ag/glass die attach for glass, solder and seamed sealed packages. Very high thermal conductivity with a 450°C temperature... | |
| (Known as Hysol QMI519 ) LOCTITE ABLESTIK QMI519 is JEDEC L1 260°C for SOIC, industry standard for QFN packages. Industry standard for preplated finishes. Exceptional performance on clean uncoated silver-plated... | |
| (Known as HYSOL QMI5200-1X adhesive film ) LOCTITE ABLESTIK QMI 5200-1X adhesive film is formulated for use in wafer lamination processes or as a preform decal. It is designed for... | |
| (Known as Hysol QMI529HT-5DLT ) LOCTITE ABLESTIK QMI529HT is used for component or die attach where very high electrical and thermal conductivity are required. Suitable for high heat dissipation devices... | |
| (Known as HYSOL QMI529HT-LV2C1.5 ) LOCTITE ABLESTIK QMI529HT-LV electrically conductive adhesive is designed for die attach applicaitons. It is recommended for use in the attachment integrated circuits and components onto... | |
| (Known as Hysol QMI536HT ) LOCTITE ABLESTIK QMI536HT(BORON) is a high thermal version of QMI536 and is ideal for mixed stacked die applications. Non-die damaging filler. | |
| (Known as Hysol QMI536NB ) LOCTITE ABLESTIK QMI536NB has high JEDEC performance for first die and die-to-die bonding. Non-conductive and non-damaging to the die face. Can be cured as low... | |
| (Known as HYSOL QMI536NB-1A5 ) LOCTITE ABLESTIK QMI536NB-1A5 is a non-conductive die attach paste deisgned for applications requiring good dielectric strength. | |
| (Known as Hysol QMI538NB ) | |
| (Known as Hysol QMI538NB-1A2 ) LOCTITE ABLESTIK QMI538NB-1A2 is a non-conductive paste for leadframe applications. Very low stress QMI538NB°1A2, 1A3, 1A4 for die sizes greater than 500 x 500 mil. | |
| (Known as Hysol QMI547 ) LOCTITE ABLESTIK QMI547 is a non-conductive paste for leadframe applications. | |
| (Known as Hysol SB-50 ) LOCTITE ECCOBOND SB 50 underfill material is ideal for high volume assembly processes. As the product does not flow under the solder array, it is... | |
| (Known as Hysol STYCAST 1090BLK ) LOCTITE STYCAST 1090 BK is designed for encapsulation and potting of electronic assemblies that require lower weight such as aerospace applications. | |
| (Known as Hysol STYCAST 2651 ) Two component, low viscosity, general purpose epoxy encapsulant. | |
| (Known as HYSOL STYCAST 2651-40FR/Catalyst 11 ) LOCTITE CAT 11 epoxy encapsulant is designed for general potting applications. It is the flame retardant version of STYCAST 2651-40. It meets UL94V0... | |
| (Known as HYSOL STYCAST 2651-40FR/Catalyst 24LV ) LOCTITE CAT 24LV is a two component encapsulant is designed for general potting applications. It is the flame retardant version of STYCAST 2651-40. | |
| (Known as HYSOL STYCAST 2651-40FR/Catalyst 9 ) LOCTITE CAT 9 is a two component epoxy encapsulant designed for general potting applications. It is a flame retardant version of STYCAST 2651-40. | |
| (Known as HYSOL STYCAST 2651MM ) LOCTITE STYCAST 2651MM is a filled, low viscosity, general purpose, epoxy encapsulant. It contains a soft filler that both reduces abrasion in meter/mix equipment... | |
| (Known as HYSOL STYCAST 2762 Catalyst 17M-1 ) LOCTITE STYCAST 2762 is a two component epoxy encapsulant designed for electronic components exposed to harsh environments. This material is also ideal... | |
| (Known as HYSOL STYCAST 2762-Catalyst 14 ) LOCTITE CAT 14 is a two component high thermal conductivity epoxy encapsulant for electronic components exposed to harsh environments. This material is also... | |
| (Known as HYSOL STYCAST 2850KT/CATALYST 24LV ) LOCTITE STYCAST 2850KT is a thermally conductive, electrically insulatiive epoxy encapsulant designed for heat sink replacement in non-integrated electrical components and assemblies. it... | |
| (Known as HYSOL STYCAST 2850MT-Catalyst 27-1 ) LOCTITE CAT 27-1 is a two component, electrically insulating general purpose encapsulant. It is recommended for encapsulation of components that require heat dissipation... | |
| (Known as HYSOL STYCAST 2850MT-Catalyst 9 ) LOCTITE STYCAST 2850 MT is a two component, electrically insulating general purpose encapsulant. It is recommended for encapsulation of components that require heat... | |
| (Known as HYSOL STYCAST 3050 Catalyst 11 ) LOCTITE STYCAST 3050 is a two component general purpose encapsulant desgined for potting and encapsulation applications with very small physical spacing between... | |
| (Known as Hysol STYCAST 50500-1 ) LOCTITE ECCOBOND 50500-1 is for protection of wire-bonded ICS, consider this flowable material for a fill. | |
| (Known as HYSOL STYCAST A316 Series ) LOCTITE ABLESTIK A316 series epoxy adhesive and sealant is designed for high throughput assembly operations. | |
| (Known as Hysol STYCAST E2534FR ) LOCTITE STYCAST E 2534 FR epoxy potting compound complies with recent demands on environmentally friendly products and does not contain brominated flame retardants. | |
| (Known as Hysol STYCAST TC4 ) LOCTITE TC 4 is a thermally conductive, high temperature silicone thermal grease. | |
| (Known as Hysol STYCAST TC8M ) LOCTITE TC 8M is a thermally conductive, high temperature silicone thermal grease. | |
| (Known as HYSOL STYCAST U2535 Polyurethane Encapsulant ) LOCTITE STYCAST U 2535 PTB two component flexible polyurethane encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation... | |
| (Known as HYSOL TRA-BOND 2106 ) LOCTITE ABLESTIK 2106 BIPAX is a two component epoxy is designed for high strength structural bonding applications. It develops significant properties 1 hour after... | |
| (Known as HYSOL TRA-BOND 2106T ) LOCTITE ABLESTIK 2106T BIPAX is a two component epoxy designed for high strength structural bonding applications. It develops significant properties one hour after mixing. | |
| (Known as Hysol TRA-BOND 2115 ) LOCTITE ABLESTIK 2115 is a clear, low viscosity epoxy formulation used in the fabrication of lasers. It is capable of withstanding 30 seconds of... | |
| (Known as HYSOL TRA-BOND 2116 ) LOCTITE ABLESTIK 2116 BIPAX is a thixotropic, non-conductive, solvent-free, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It offers chemical resistance... | |
| (Known as Hysol TRA-BOND 2151 ) LOCTITE ABLESTIK 2151 is a thixotropic, two-part adhesive that develops strong, durable high-impact bonds at room temperature which improve heat transfer while maintaining electrical... | |
| (Known as Hysol TRA-BOND F112 ) LOCTITE ECCOBOND F 112 is a long pot life, impact resistant, fiber-optic adhesive. This two-part, low viscosity epoxy paste adhesive has the distinct advantage... | |
| (Known as Hysol TRA-BOND F114 ) LOCTITE ECCOBOND F 114 BIPAX is an optically clear, blush-free, low viscosity, room temperature cure, epoxy system with good optical properties that contains no... | |
| (Known as Hysol TRA-BOND F123 ) LOCTITE ECCOBOND F 123 TRAPAX is a low viscosity formulation that signals both proper mixing and curing when bonding fiber-optic bundles, potting glass fibers... | |
| (Known as Hysol TRA-BOND F253 ) LOCTITE ECCOBOND F 253 BIPAX is a low viscosity, high temperature, two-part epoxy formulation that changes color during the curing process to indicate cure... | |
| (Known as Hysol TRA-BOND FDA2 ) A thixotropic epoxy resin paste system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests in... | |
| (Known as Hysol TRA-BOND FDA2T ) LOCTITE ABLESTIK FDA 2T is a thixotropic epoxy resin paste system specifically developed for medical device applications. It has been tested in accordance with... | |
| (Known as Hysol Tra-Cast FS245 ) LOCTITE ECCOBOND FS 245 BIPAX is a thixotropic, two-part adhesive that develops strong, durable, high impact bonds at room temperature which improve heat transfer... | |
| (Known as Hysol TRA-DUCT 2902 ) LOCTITE ABLESTIK 2902 is a silver-filled epoxy recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. | |
| (Known as Hysol TRA-DUCT 2958 ) LOCTITE ABLESTIK 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components recommended for electronic, microelectronic and die-attach bonding... | |
| (Known as HYSOL UF3037 ) LOCTITE ECCOBOND UF 3037 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at low temperatures to minimize stress to other... | |
| (Known as HYSOL UF3537 ) LOCTITE ECCOBOND UF 3537 underfill is designed to improve board level assembly reliability. | |
| (Known as HYSOL UF3800 reworkable underfill ) A high reliability, good reworkability, room temperature dispensable underfill compatible with most common solder pastes. | |
| (Known as HYSOL UF3808 ) LOCTITE ECCOBOND UF 3808 is a capillary underfill designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material... | |
| (Known as Hysol UF8830 ) LOCTITE ECCOBOND UF 8830 is a liquid epoxy underfill encapsulant designed for flip chip BGA applications requiring improved crack/fracture resistance and low warpage. | |
| (Known as Hysol US0154 ) Encapsulant potting urethane. | |
| (Known as HYSOL US1151 ) LOCTITE STYCAST US 1151 is a low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties. Introduction of this material on a... | |
| (Known as HYSOL US1750 ) LOCTITE STYCAST US 1750 elastomeric polyurethane, is a waterwhite, clear, medical grade, fast gel potting material. It is ideal for blood heat exchanger, dialyzer and... | |
| (Known as Hysol US2050 ) LOCTITE STYCAST US 2050 is a quick set, optically clear polyurethane compound that exhibits excellent ultraviolet resistance. The excellent electrical properties also suggest its use... | |
| (Known as Hysol US2350 ) LOCTITE STYCAST US 2350 is a flexible, flame retardant, mineral filled, polyurethane compound. This potting compound has long pot life and is low viscosity so... | |
| (Known as HYSOL UV3000 ) LOCTITE ECCOBOND UV 3000 is a UV curable adhesive designed for high throughput assembly operations. This adhesive can withstand exposure to temperatures as high as... | |
| (Known as HYSOL UV3000LH ) LOCTITE ECCOBOND UV 3000LH cure adhesive is designed for high throughput assembly operations. A low halide version of UV3000. It is used in CMOS glass... | |
| (Known as HYSOL UV9060 ) LOCTITE ECCOBOND UV 9060 is a no-flow UV/moisture cure encapsulant designed for local circuit board protection. It is fluorescent when viewed with ultraviolet (black) light. | |
| (Known as HYSOL XCE3104XL ) LOCTITE ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for the stencil and screen print applications. It uses a unique blend of... | |
| (Known as HYSOL XCE3120 ) LOCTITE ABLESTIK XCE 3120 anisotropic epoxy adhesive is designed for high throughput microelectronics assembly applications. It is ideal for use in combination with temperature sensitive... | |
| (Known as HYSOL XCP3302NS ) LOCTITE ABLESTIK XCP3302NS ITAR gold filled, electrically conductive adhesive is designed for automatic dispensing operations. It is the no spacer version of XCP3302 adhesive. | |
| (Known as Hysol XE1218 ) LOCTITE ECCOBOND XE 1218 is a reworkable, snap cure, void-free, fast flowing underfill that also provides excellent adhesion and reliability benefits. | |
| (Known as HYSOL XE80100 ) LOCTITE ABLESTIK XE 80100 is a solventless modified epoxy adhesive that combines low stress with good adhesion on nearly all surfaces and is flexible for... | |
| (Known as HYSOL XUV 9086 ) LOCTITE ECCOBOND XUV 9086 is a one component UV cure encapsulant used in ink jet applications. It is formulated to dispense easily without stringing. | |
| (Known as Hysol XUV-9052 ) LOCTITE ECCOBOND UV 9052 is a one component, dual cure (UV & moisture) adhesive designed as a lead encapsulant used in ink jet applications. | |
| (Known as Loctite 315 ) LOCTITE 315 is a self-shimming for electrical isolation; room-temperature curing adhesive. | |
| (Known as LOCTITE 3323UV ) LOCTITE 3323 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV... | |
| (Known as LOCTITE 3327UV ) LOCTITE 3327 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV... | |
| (Known as Loctite 3515 ) LOCTITE 3515 is a one component epoxy adhesive, designed to allow self-alignment of SMT components during the reflow operation. | |
| (Known as LOCTITE 3609 10ML EFD US ) LOCTITE 3609 is used for medium to high speed dispense applications. Excellent green strength for large components. | |
| (Known as Loctite 3612 ) LOCTITE 3612 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium... | |
| (Known as Loctite 3616 ) LOCTITE 3616 is a high speed stencil print adhesive compatible with DEK Proflow and MPM Rheopump. Ultra low moisture pick-up. Pin transfer capable as well. | |
| (Known as LOCTITE 3621 30ML EFD US ) LOCTITE 3621 is a high performance for ultra high-speed syringe dispense. Recommended product for Dispense Jet. Superior humidity resistance and electrical properties. | |
| (Known as Loctite 3627 ) LOCTITE 3627 is a high speed stencil print adhesive compatible with DEK Proflow and MPM Rheopump. Recommended product for DEK Proflow Pumprint process. | |
| (Known as Loctite 384 Output ) LOCTITE 384 is a repairable, room temperature-curing adhesive utilized for parts subject to disassembly. | |
| (Known as LOCTITE D 125F-DR ) LOCTITE D 125 F DR surface mound adhesive is designed for use in high-speed pneumatic and positive displacement dispensers. This one component adhesive is... | |
| (Known as LOCTITE ECCOBOND UF 8840 ) LOCTITE ECCOBOND UF 8840 liquid epoxy underfill encapsulant is designed for flip chip BGA applications requiring improved crack/fracture resistance and low warpage. It... | |
| (Known as LOCTITE Thermstrate 2000 Phase Change ) LOCTITE TCF 1000 AL is a phase change thermal interface material suitable for use between a heat sink and a variety of... | |
| (Known as LOCTITE US5533 flame retardant potting compound ) LOCTITE STYCAST US 5533 PTB is a two-component, flexible, flame retardant potting compound. It is formulated with low odor designed to... | |
| (Known as MACROMELT 6211 ) Macromelt® 6211™ is a polyamide hot melt adhesive that exhibits excellent low temperature flexibility. This product is suitable for bonding plastics, metal, flexible vinyl, and... | |
| (Known as SC8001 5Gal ) LOCTITE STYCAST SC 8001 one component B-stageable epoxy coating is designed to provide electrical insulation between conductive layers in thin-film photovoltaics. | |
| (Known as STYCAST 1090SI ) LOCTITE STYCAST 1090SI encapsulant is recommended for applications where high compressive stress is applied to encapsulated circuitry - as in deep ocean work. This product... | |
| (Known as STYCAST 2017M4/A 5kg ) Epoxy encapsulant developed for lamp type, blue LED. | |
| (Known as STYCAST 2651-40 ) LOCTITE STYCAST 2651-40 is a filled, general purpose, dielectric grade epoxy encapsulant. It is a lower viscosity version of STYCAST 2651. It has excellent adhesion... | |
| (Known as STYCAST 2850FT ) LOCTITE STYCAST 2850FT is for high thermal conductivity and low outgassing, consider this encapsulant. | |
| (Known as STYCAST NX-17 ) LOCTITE STYCAST NX17 is a two-component, heat cure, epoxy encapsulant with good adhesion to PPA. | |
| (Known as STYCAST NX-76 ) LOCTITE STYCAST NX76 is an one-component epoxy encapsulant designed for SMD LED. Low CTE and good light dispersion by adding a small amount of filler. | |
| (Known as TRA-BOND 2158 ) LOCTITE ABLESTIK 2158 BIPAX is a two part adhesive that develops strong, durable high impact bonds at room temperature which improve heat transfer while maintaining... | |
| (Known as TRA-BOND 724-14C ) LOCTITE ABLESTIK 724-14C is designed to provide strong, resilient bonds even in cryogenic conditions. It can also be used for tacking wires and as a... | |
| (Known as UV9060F (180g) Black ) LOCTITE ECCOBOND UV9060F no flow, one component, UV cure encapsulant is designed for local circuit board protection. This product is fluorescent when viewed with... | |
| 3702 is a UV light curable sealant for LCD end-sealing applications. This product is specifically formulated to have excellent humidity resistance. | |
| 3720 is a single component, UV curable coating resin. This product is specially formulated for moisture protection on terminals of TAB mounts or COG of LCD module. Its high flexibility... | |
| A medium viscosity epoxy resin paste system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests in vivo and received Class VI... | |
| A one-component, unfilled solventless epoxy underfill encapsulant; fast curing and excellent chemical and heat resistance. | |
| ABLEBOND 8008NC is a non-conductive snap cure adhesive utilizing wafer backside coating technology. | |
| ABLEBOND AAA3300 is a self-filleting low modulus adhesive for attaching large die on thin organic substrates. | |
| ABLESTIK ABLEBOND 958-8C is an electrically conductive epoxy designed for solder replacement in microelectronic interconnect applications. It may be used with thick film metalizations or traditional printed circuit board surfaces. | |
| ABLESTIK ABLEFILM ECF563 unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in... | |
| ABLESTIK ABP-8000 conductive die attach is desgined for bonding devices where high heat transfer is required. It is recommended for use in the attachment of integrated circuits and components onto... | |
| ABLESTIK ATB-F100E adhesive film is formulated for use in water lamination processes and preform decal. It is designed for use in both mother/daughter die stack packages. | |
| ABLESTIK C100 Series (C115 and C130) die attach adhesive film is suitable for tight geometry (<100μm) leadframe packages where high electrical performance is required. This material was originally sampled as... | |
| ABLESTIK ICP-3513 electrically conductive one component adhesive is designed for use in automated assembly and in-line curing operations. | |
| ACHESON ELECTRODAG 5915 is a one component, fast cure, electrically conductive isotropic ink designed for bonding surface mount devices to flexible or rigid printed circuits. | |
| Acrylic conformal coating non-toluene based, rapid drying, one-component for non-atomized spraying applications. | |
| Adhesive film (20 µm) is formulated for use in wafer lamination processess and preform decal. It is designed for use in both mother/daughter die in stack packages. | |
| Adhesive film (30 µm) is formulated for use in wafer lamination processess and preform decal. It is designed for use in both mother/daughter die in stack packages. | |
| An innovative non-reworkable capillary flow underfill. Hysol E1172A is a fast flow, snap cure underfill. It is a one-component epoxy chemistry that is non-anhydride curing for enhanced moisture resistance. | |
| Clear glob top material with good adhesion to any substrate. | |
| Conductive adhesive is designed for thermally enhanced BGA applications. Sensitive to amines. This material needs to be isolated from uncured epoxy-based resins as interaction will inhibit curing. It has a... | |
| DC0114 epoxy underfill is suitable for high reliability applications due to its combination of properties. It can be applied to ceramic or organic substrates, including solder masks and polyimide. | |
| Delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. Meets UL 94 V-0 Flammability at 3.175mm thickness. (SOT/SMX)... | |
| Designed to continuously flow and form fillets after die placement is complete. The Self-Filleting feature is ideal for packages requiring narrower and more controlled fillets. | |
| Developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol® UV dam encapsulants, such as Hysol 3323. This combination of... | |
| Die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries. | |
| Eccobond C850-6 is a fast curing, general conductive, one component, low viscosity, silver filled epoxy die attach adhesive paste. It features high electrical and thermal conductivity and high strength at... | |
| Eccobond CE3103 is primarily designed for bonding polycarbonate to itself while not inducing stress cracking under typical molded stress levels. Eccobond CE3103 cures rapidly to form flexible, transparent bonds when... | |
| Eccobond DX-20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be... | |
| Eccobond E3503-1 is optimised for SMT dispense and the manufacturing of high volume assemblies. It has high adhesion to the substrate finishes commonly used in microelectronics and will not adversely... | |
| Eccoseal 7200 adhesive sealant is designed for high throughput display assembly for displays that require protection against humidity and oxygen. | |
| Electrically conductive one-component, non-bleeding epoxy adhesive with low outgassing, eliminating wicking and bridging under small components. | |
| Encapsulant potting urethane. | |
| Encapsulant potting, epoxy, one component. | |
| Encapsulant potting, epoxy, two component, heat cure. | |
| Enhanced thermal conductivity, fast cure, low stress die and component attach adhesive optimized for GaAs MMIC attach. | |
| Excellent pick up performance with PSA D/T and controlled flow for die stacking (5 µm). | |
| For protection of wire bonds consider this high purity material as either a dam or a glob top. | |
| Heat cure material designed ACP process by thermal compression (RFID, Misc, Assembly). | |
| Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT... | |
| High JEDEC performance for first die and die-to-die bonding. Non-conductive and non-damaging to the die face. Can be cured as low as 80°c. No bleed. | |
| High purity, flip-chip underfill, high Pb and no-Pb applications | |
| HYSOL E1159 is designed for high volume assembly operations that require and underfill that flows fast at room temperature and fully cures in one reflow oven cycle. It is specifically... | |
| HYSOL ECCOBOND 281 BLK one component epoxy adhesive is formualted for use in applications requiring excellent thermal conductivity. It has high thermal conductivity, good chemical resistance and is electrically insulating. | |
| HYSOL ECCOBOND DS7300 one component non-conductive epoxy perimeter sealant is designed to be used in display applications. | |
| HYSOL ECCOBOND G500 is a general purpose epoxy adhesive and sealant that cures to a high gloss finish. It is used as insulation of copper and other materials and attaching... | |
| HYSOL ECCOBOND G757HF-D is a low halogen, non-conductive epoxy adhesive for ferrite bonding applications. It is suitable for use with temperature sensitive substrates and components. | |
| HYSOL ECCOSEAL 7100 adhesive sealant is designed for high throughput display assembly that require protection against humidity and oxygen. | |
| HYSOL EO1086 is a one-component heat cure encapsulant designed for use in Chip on Board applications requiring excellent handling properties. | |
| HYSOL ES1904 is an opaque, medium-viscosity epoxy resin system recommended for small potting and laminating applications where excellent structural, mechanical and electrical properties are required. This two-part adhesive exhibits good... | |
| HYSOL ES4512HF is a two-part non-conductive, room temperature cure, halogen free potting compound. It is used in the consumer and industrial market. | |
| Hysol FP0116 | |
| Hysol FP4545FC is a low viscosity version of FP4548FC | |
| Hysol FP4583 is a high purity, FC underfill, high lead applications | |
| Hysol FP4652 is a fast cure, low stress version of FP4450 for a large array of packages. | |
| Hysol FP6401 is a high purity, liquid flexible damming material. | |
| Hysol GR828DD is a green, semiconductor grade, low stress and high adhesion molding compound. It is especially designed for DPAK/D2PAK packages with Ni and copper/Ag plating lead frames. | |
| Hysol QMI 536UV is used for component or die attach where very high electrical and thermal conductivity is required. Suitable for high heat dissipation devices and solder replacement applications. | |
| HYSOL QMI516IE electrically conductive hydrophobic adhesive is designed for die attach applications. It is a snap cure adhesive used in high throughput bonding applications. | |
| Hysol QMI516LC is a low temperature cure, silver-filled adhesive. | |
| HYSOL STYCAST 2651MM CATALYST 23LV is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining. | |
| HYSOL STYCAST 2651MM Catalyst 9 is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining. | |
| HYSOL STYCAST 2850KT with CATALYST 9 epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications... | |
| HYSOL STYCAST 2850MT-Catalyst 24LV is a two component, electrically insulating general purpose encapsulant. It is recommended for encapsulation of components that require heat dissipation and thermal shock properties. It is... | |
| HYSOL STYCAST E1070 one component epoxy encapsulant is recommended for small mass potting applications, <50 grams, used in automotive electronic applications. | |
| HYSOL STYCAST EFF15 is a one component epoxy based free flowing syntactic foam powder designed to infiltrate around densely packed components and fill voids in electronic modules. It exhibits low... | |
| HYSOL UF3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent... | |
| Hysol US0146 is an unfilled, two component clear amber polyurethane casting system formulated for potting. Characteristics of Hysol US0146 include low viscosity, low durometer, long pot life and hydrolytic stability. | |
| HYSOL US1150 is an extended polybutadiene/MDI base, mineral filled, medium hardness, ambient cure urethane encapsulant/sealant. This material can be used for potting electronics or devices for protection against environmental hazards. | |
| HYSOL UV3001 is a UV cure adhesive designed for high throughput assembly operations. It can withstand exposure to temperatures as high as 200°C. It is the 4 μm glass rod... | |
| HYSOL XUV80260 is a UV curable display perimeter sealant for rigid type OLED. | |
| HYSOL XUV80270-1 is a one-component, non-conductive, UV curable adhesive sealant for high throughput display assembly that require protection against humidity. It is formulated to cure very fast when exposed to... | |
| HYSOL® ES1000™ is a two-component, long pot life casting system with excellent handling properties. This material has good thermal shock resistance and low exotherm, making it suitable for encapsulation of... | |
| HYSOL® ES1301™ is a silica filled epoxy casting system recommended for coils, transformers, and general pupose casting. | |
| HYSOL® ES1900™ is a two-component casting system with excellent handling properties. Transparent, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications where clarity and excellent structural, mechanical and... | |
| HYSOL® ES1901™ is a fast-setting, toughened, medium viscosity, industrial grade epoxy adhesive. Once mixed, the two-component epoxy cures at room temperature with low shrinkage and forms an ultra clear bondline... | |
| HYSOL® ES2202™ is an unfilled epoxy system with a high operating temperature and long pot life. Excellent chemical resistance, excellent performance under high moisture and humidity. | |
| HYSOL® ES2207™ is a filled, resilient, low viscosity, room temperature cure epoxy potting compound. It will meet UL 94 V-0 requirements in 1/8 inch thickness. | |
| HYSOL® ES2500™ is a resilient, low cost, fast gelling potting compound. Ideal for potting and encapsulating high volume parts. Meets UL 94 HB Flame Retardant to 1.5mm thickness. | |
| Hysol® FluxFill™ FF2200 is a reflow encapsulant designed for the assembly and protection of flip chip semiconductor devices utilizing a single material approach. The material is formulated to provide the... | |
| Hysol® FP5000™ is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent protection of integrated circuit electrical joints... | |
| Isostrate™ is an electrically isolating phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as a... | |
| LOCTITE 190024LV single component, UV curable adhesive is designed to improve reliability in electronic component BGA edgebonding applications. This flexible material is engineered to enhance the load bearing and shock... | |
| LOCTITE 3118 is a white image sensor adhesive. | |
| Loctite 3119™ cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive. | |
| LOCTITE 3128 is a black image sensor adhesive. | |
| LOCTITE 3128NH edgebond material is designed to add reliability to chip scale packages and other electronic components. It is a low temperature cure adhesive ideal for use on heat sensitive... | |
| LOCTITE 3129 is a one-component UV and heat dual cure adhesive for assembly of temperature sensitive electronic components. | |
| LOCTITE 3129 is an image sensor adhesive. | |
| LOCTITE 3217 is a one-component UV and heat dual cure adhesive for assembly of temperature sensitive electronic components. | |
| LOCTITE 3220 is a one-component low temperature cure, snap cure with excellent ahesion on wide range of materials. | |
| LOCTITE 3220WH is a one component designed for use in heat sensitive optoelectronic components and other microelectronic devices. This material offers excellent light reflection characteristics. 3220WH is the white colored... | |
| LOCTITE 3318 is suitable for a wide variety of coating applications that require strict humidity reliability performance, such as ITO/COG overcoat in LCD module assembly. | |
| LOCTITE 3508 is a lead-free, one-component epoxy corner bond adhesive. Applied pre-reflow and allows self-alignment of SMT components during reflow operation. Used for lead-free applications. | |
| LOCTITE 3509 is a one component heat cure epoxy designed for use as board level cornerbond for IC packages such as CSP's and BGA's. | |
| LOCTITE 3513 is a single-component epoxy used as a reworkable underfill for CSP or BGA's. | |
| LOCTITE 3517 is a one part, heat curable epoxy. It is designed for use as a reworkable CSP (FBGA) or BGA underfill for protection of solder joint against mechanical stress... | |
| LOCTITE 3517M one component reworkable underfill is designed for use as a solder joint protection against mechanical stress in handheld electronic device applications. It the low halogen content version of... | |
| LOCTITE 3548 is a next generation reworkable underfill for thermal and mechanical reliability. Designed to snap cure at low temperature to minimize thermal stress on PCB's. Fast flow for improved... | |
| LOCTITE 3549 is a next generation reworkable underfill for thermal and mechanical reliability. Designed to snap cure at low temperature to minimize thermal stress on PCB's. Fast flow for improved... | |
| Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's. | |
| LOCTITE 3563 is a rapid curing fast flowing liquid epoxy for use as a capillary flow underfill for packaged IC's | |
| LOCTITE 3593 is a non-reworkable underfill for high mechanical reliability. Fast flow and snap cure for improved process time. | |
| LOCTITE 3611 is a stencil printable/pin transfer product for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. | |
| LOCTITE 3619 is used for ultra low temperature cure, high speed syringe dispense. | |
| LOCTITE 3629C is a one-component, halogen free, fast cure epoxy formulated for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is designed to provide controlled... | |
| LOCTITE 3705 is a UV-cured adhesive designed for bonding electronics components on PCBs. Thixotropic nature reduces migration of product. Excellent adhesion to a wide range of substrate. Bonds in seconds... | |
| LOCTITE 3719 is a UV light curable adhesive designed for LCD terminal pin bonding applications. | |
| LOCTITE 3730 is a UV light curable sealant for LCD end-sealing applications. | |
| LOCTITE 3733 is a UV light curable sealant for LCD end-sealing applications. | |
| LOCTITE 3736 is a UV and visible light curable coating resin. This product is specially formulated for moisture protection on COG of LCD module or terminals of TAB mounts. Its... | |
| LOCTITE 3781 is a single component, UV light curable sealant for LCD end-sealing application. | |
| Loctite 383 Output is a thermally conductive adhesive system designed for bonding heat generating components to heat sinks. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components,... | |
| LOCTITE 3873 is a fast curing, high-conductivity, self-shimming for bonding heat-generated devices to thermal spreader. | |
| LOCTITE 3874 is a fast-curing, high-conductivity for bonding heat-generated devices to thermal spreader without glass beads. | |
| LOCTITE 3900 is an air-dry coating designed for small production runs. It may be applied by spray, dip or brush procedures. Aerosol fast cure. Note: Not sold in Europe. | |
| LOCTITE 5210 is an ultra fast curing, non-corrosive RTV silicone designed for potting, wire tracking, selective sealing, vibration dampening and repair/rework applications on PCB's. | |
| Loctite 5290 is used for protecting printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is typically used in applications with an... | |
| LOCTITE 5293 is a repairable, solvent-free, medium viscosity, UV / moisture cure silicone suited to brush, dip and selective coating. | |
| LOCTITE 5296 is a heat cure silicone that can be applied with brush, dip or spray. High reliability automotive. Clear. | |
| LOCTITE 5404 Output is a self-shimming, flexible silicone adhesive for demanding parts such as ceramic boards. | |
| LOCTITE 5406M is a one component flexible RTV silicone engineered to enhance load bearing and shock absorbing properties of the bonded area. It is also used to protect electrical devices... | |
| LOCTITE 5421 is an RTV silicone that provides EMI / RFI shielding on electronic device enclosures. | |
| LOCTITE ABLELOC 5500SB is a tape adhesive for high speed operations where dwell time and pressure must be minimized. The adhesive is coated onto both sides of a polyimide carrier. | |
| LOCTITE ABLESTIK 3880 is designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required. | |
| LOCTITE ABLESTIK 3888 is a room temperature cure adhesive for applications requiring a combination of good mechanical and electrical properties. | |
| LOCTITE ABLESTIK 60L Parts AB is a two component carbon filled epoxy adhesive with low electrical conductivity designed for general pupose bonding. It is designed for applications where precise resistive... | |
| LOCTITE ABLESTIK CDF 200 Series is a highly filled, conductive die attach film adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and... | |
| LOCTITE ABLESTIK SSP 2020 is a sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated... | |
| LOCTITE ABLESTIK SSP-2000 printable low temperature silver sintering paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated... | |
| LOCTITE ECCOBOND COB UV8801 one component epoxy encapsulant is developed to meet high temperature thermal cycling specifications. It cures to form a hard translucent coating when exposed to UV light... | |
| LOCTITE ECCOBOND DP 1002UV one component material is designed for use as a wire and tab bond lead encapsulant, damming or edgebond material. It can be applied by using non-contact... | |
| LOCTITE ECCOBOND DP 1003UV one component material is designed for use as a wire and tab bond lead encapsulant, and gap fillng adhesive. It can be applied by using non-contact... | |
| LOCTITE ECCOBOND DP 1012UV is a one component material designed for use as a wire and tab bond lead encapsulant or damming material. This adhesive cures in seconds when exposed... | |
| LOCTITE ECCOBOND DS 3318LV is a fast, UV curable material specially formulated for use in applications requiring lower energy cure. It is designed for protection of COG (Chip-on-glass) in LCD... | |
| LOCTITE ECCOBOND DS 3318LVT fast, UV curable material is specially formulated for use in applications requiring lower energy cure. Its excellent moisture resistance is designed to provide protection in COG-LCD... | |
| LOCTITE ECCOBOND EN 3707F is a one component, no-flow encapsulant designed for local circuit board protection. It cures in seconds when exposed to the appropriate intensity of UV light. It... | |
| LOCTITE ECCOBOND EO1072 is a one component high performance epoxy encapsulant with high Tg and low extractable ionics. | |
| LOCTITE ECCOBOND UF 2800A reworkable underfill is designed to provide protection for solder joints against induced stress, increasing both drop test and cycle performance of the device. This material is... | |
| LOCTITE ECCOBOND UF 2800B reworkable underfill is designed to provide protection for solder joints against induced stress, increasing both drop test and cycle performance of the device. This material is... | |
| LOCTITE HYSOL EE0182 EB6025 is a two part, white epoxy casting system having low abrasion and rapid gel features. | |
| LOCTITE ISOSTRATE 2000 electrically conductive isolating phase change thermal interface material is suitable for use between a heat sink and a variety of heat dissipating components. It is supplied as... | |
| LOCTITE NSWC100 is a non-silicone, water cleanable thermal compound. | |
| LOCTITE Powerstrate Xtreme (PSX) is a reworkable unsupported film with superior thermal performance even at low pressure. Direct attach to heat sink at room temperature without adhesive. Also available in... | |
| LOCTITE PSX-D (Powerstrate Xtreme) is a repeatable phase change thermal interface material. Supplied as a paste that can be stenciled, needle dispensed, screen printed or applied manually onto a heat... | |
| LOCTITE PSX-D-LV (Powerstrate Xtreme) is a reworkable and repeatable phase change thermal interface material. It offers the enhanced performance and reliability of a phase change thermal interface material with the... | |
| LOCTITE PSX-Pm (Medium Dry) (Powerstrate Xtreme) is a reworkable and repeatable phase change material. It offers enhanced performance and reliability with the application ease of thermal grease. Also available other... | |
| Loctite Silverstrate is an electrically conductive phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as... | |
| LOCTITE STYCAST ES 4322FC liquid epoxy encapsulant is for protection of semiconductor devices. It is a high flow material which requires a cavity flow control barrier to prevent excessive flow. | |
| LOCTITE TAF 8800 is a heat absorbing material designed to reduce the skin temperature of mobile electronic devices. It can effectively absorb, spread, insulate and slowly dissipate thermal energy generated... | |
| LOCTITE UV8800M is a UV cure encapsulant for smart card and other COB applications. | |
| Loctite® 5089™ Nuva-Sil® Silicone Gasket / Sealant is used for gasketing and sealing applications. Upon exposure to sufficient UV light and/or atmospheric moisture, this product cures to form a durable,... | |
| Loctite® Liquid Optically Clear Adhesives (LOCAs) for cover lens bonding, touch panel sensor assembly and direct bonding applications in touch panel and display devices including mobile phones, tablets, monitors, televisions... | |
| One component encapsulants potting epoxy. | |
| One component epoxy adhesive paste providing high mechanical strength and stable contact resistance on Cu and 100% Sn. | |
| One component, general conductive, low stress nickel-filled adhesive for mismatched CTE with good shielding properties. | |
| One component, low temperature curing thermally conductive epoxy adhesive. | |
| One-component epoxy adhesive providing high mechanical strength; stable contact resistance on Cu and 100% Sn. | |
| One-component, silver-filled epoxy adhesive. | |
| Photocurable adhesive is designed for high throughput assembly operations. | |
| Potting encapsulant-epoxy two component room temperature cure. | |
| Recommended for high-temperature heat transfer in normal applications. It is used between heat generating devices and the surfaces to which they are mounted or other heat dissipating surfaces. This product... | |
| Single component, photocurable adhesive is designed for bonding camera module assemblies. | |
| Single layer adhesive film for mother/daughter die stacking applications. Co-curable with molding process. | |
| Single layer format, fast cure die attach film (5 µm). | |
| Snap curable, low temperature cure, electrically conductive adhesive with excellent adhesion and reliability of Cu and Al substrates. | |
| STYCAST 2850FT/Catalyst 11 is recommended for encapsulation of components that require heat dissipation and thermal shock properties. Passes NASA outgassing standards. | |
| STYCAST 2850FT/Catalyst 23LV is recommended for encapsulation of components that require heat dissipation and thermal shock properties. | |
| STYCAST EO2000HV one-component, oxide filled epoxy adhesive is designed to bond heat resistant plastics in applications requiring heat and chemical resistance. It is especially suited for use in harsh environments... | |
| Stycast U2500 is an encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings. | |
| Surface mount adhesive designed for high speed dispensing. | |
| Thermosetting, dielectric adhesive developed for GaN chip bonding for high-brightness LEDs. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing. | |
| Unique product resulting from blend of thermoset and thermoplastic resins. | |
| UV-curable cationic epoxy adhesive. Designed for use in sealing glass lid of packages of area image sensors such as CCD and CMOS. | |
| XCS80091-2 is a one-component, highly flexible conductive adhesive for applications with large CTE mismatches between substrates. |
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