Henkel Corporation - Electronics LOCTITE Powerstrate Xtreme 8799553617921

Description
LOCTITE Powerstrate Xtreme (PSX) is a reworkable unsupported film with superior thermal performance even at low pressure. Direct attach to heat sink at room temperature without adhesive. Also available in other versions (PSX-D-LV, PSX-D, PSX-Pm, PSX-PE)
Description
LOCTITE Powerstrate Xtreme (PSX) is a reworkable unsupported film with superior thermal performance even at low pressure. Direct attach to heat sink at room temperature without adhesive. Also available in other versions (PSX-D-LV, PSX-D, PSX-Pm, PSX-PE)

Suppliers

Company
Product
Description
Supplier Links
LOCTITE Powerstrate Xtreme - 8799553617921 - Henkel Corporation - Electronics
Irvine, CA, USA
LOCTITE Powerstrate Xtreme
8799553617921
LOCTITE Powerstrate Xtreme 8799553617921
LOCTITE Powerstrate Xtreme (PSX) is a reworkable unsupported film with superior thermal performance even at low pressure. Direct attach to heat sink at room temperature without adhesive. Also available in other versions (PSX-D-LV, PSX-D, PSX-Pm, PSX-PE)

LOCTITE Powerstrate Xtreme (PSX) is a reworkable unsupported film with superior thermal performance even at low pressure. Direct attach to heat sink at room temperature without adhesive. Also available in other versions (PSX-D-LV, PSX-D, PSX-Pm, PSX-PE)

Supplier's Site

Technical Specifications

  Henkel Corporation - Electronics
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 8799553617921
Product Name LOCTITE Powerstrate Xtreme
Industry Electronics
Unlock Full Specs
to access all available technical data

Similar Products

Highly Thermal Conductive, Electricity Insulative, Low Viscosity Type Silicone Compound - SARCON ® SPG-20B - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Chemical System Silicone
Industry Electronics; Semiconductors, IC's
View Details
Thermally Conductive Epoxy Polysulfide Adhesive - EP21TPFL-1AO - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
View Details
Thermal Pads - 1225182 - RS Components, Ltd.
RS Components, Ltd.
Specs
Thermal Conductivity 240 W/m-K (139 BTU-ft/hr-ft²-F)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details