Henkel Corporation - Electronics Datasheets for Resins and Compounds
Resins and compounds are used for shape fabrication or bond formation. Types include adhesive, casting, and leveling resins; caulk and grout; and sealants and thread lockers.
Resins and Compounds: Learn more
| Product Name | Notes |
|---|---|
| (Known as HYSOL GR 15F-1 ) LOCTITE HYSOL GR15F-1 is an anhydride cured molding compound containing spherical filler designed for those applications requiring high voltage, high power and/or high temperature... | |
| (Known as Hysol GR 2811 ) LOCTITE HYSOL GR2811 is an epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1... | |
| (Known as Hysol GR 640HV ) LOCTITE HYSOL GR640HV is a low stress, green molding compound suitable for SOT packages. Hysol GR640HV provides superior moldability and reliability with lowest cost... | |
| (Known as Hysol GR15F-1P ) LOCTITE HYSOL GR15F-1P is a green, anhydride-cured molding compound contains spherical filler and is designed for high voltage applications. This product has excellent moldability performance... | |
| (Known as HYSOL GR15F-A ) LOCTITE HYSOL GR15F-A is an anhydride cured molding compound is formulated to contain spherical fillers. It is designed to achieve JEDEC level 1 requirements. It... | |
| (Known as Hysol GR2220 ) GR2220 epoxy molding compound delivers outstanding performance and ease of use. Meets UL 94 V-0 Flammability at 6.35mm thickness. | |
| (Known as Hysol GR2310 14.3X5.7 ) LOCTITE HYSOL GR 2310 is a gold, non-halogenated molding powder, for tantalum and ceramic capacitors, leaded or surface-mounted sensors. | |
| (Known as Hysol GR2320 ) LOCTITE HYSOL GR 2320 is a black/non-halogenate d molding powder, tantalum and ceramic capacitors, leaded or surface-mounted sensors. | |
| (Known as Hysol GR2340 ) LOCTITE HYSOL GR 2340 is a specially formulated molding compound designed for use in high volume molding of tantalum capacitors. It meets UL94 V-0 at... | |
| (Known as Hysol GR360A-F8 ) LOCTITE HYSOL GR 360A is a green mold compound with 1/8" flammability rating suitable for bridge, axial and TO packages. GR360A-F8 offers good moldability with... | |
| (Known as Hysol GR360A-FC2A ) LOCTITE HYSOL GR360A-FC2A epoxy molding compound delivers outstanding performance and ease of use. It is a low stresss green product with high adhesion and moldability. | |
| (Known as Hysol GR646 ) LOCTITE HYSOL MG40 BIM 74A BULK is only recommended for automatic molding operations. This material has been formulated to be molded at temperatures as low... | |
| (Known as Hysol GR725LV-2 ) LOCTITE HYSOL GR725LV is a green, semiconductor grade, low stress and high adhesion molding compound. Its patented sigma technology enables extremely high performance for power... | |
| (Known as Hysol GR735 ) LOCTITE HYSOL CG0645 GR735 is a high productivity molding compound designed specifically for the encapsulation of discrete semiconductor devices. This material is formulated to have... | |
| (Known as HYSOL GR828FC1 ) LOCTITE HYSOL GR828FC1(IMP) BULK is an environmentally friendly "green" molding compound containing no bromine, antimony or phosphorus flame retardant. | |
| (Known as Hysol GR9810-1P ) LOCTITE HYSOL GR9810-1P is a state-of-the-art epoxy molding compound developed to meet the stringent encapsulation requirements of package-on-package (POP) devices. This compound exhibits advanced warpage... | |
| (Known as Hysol KL-1000-3LX ) LOCTITE HYSOL KL-1000-3LX HRHJ provides the lowest cost of ownership with superior moldability and reliability. LOCTITE HYSOL KL-1000-3LX HRHJ is extremely suitable for bridge, axial... | |
| (Known as Hysol KL-1000-3LX ) LOCTITE HYSOL KL-1000-3LX P provides the lowest cost of ownership with superior moldability and reliability. Bridge Package, Axial Package and TO are typical package applications. | |
| (Known as Hysol KL-3000-FF(H) ) LOCTITE HYSOL KL-3000-FF(H) epoxy molding compound delivers outstanding performance and ease of use. It is designed to provide improved stress performance. | |
| (Known as Hysol KL-4500-1NT ) LOCTITE Hysol KL-4500-1NT is a low stress and high reliability molding compound suitable for SOIC packages. Its low viscosity properties enable low wire sweep molding... | |
| (Known as Hysol KL-5000-HT ) LOCTITE HYSOL KL 5000-HT has alumina fillers and delivers a high thermal conductive solution for TO-220F/3PF's thermal requirements. KL5000-HT's low moisture absorption and low thermal... | |
| (Known as Hysol KL-6500S ) LOCTITE Hysol KL-6500S is a low stress molding compound suitable for SOT/SMX and SOD packages. Hysol Huawei KL6500S provides good workability and high reliability. | |
| (Known as Hysol KL-7000HA ) LOCTITE HYSOL KL 7000HA is suitable for SOT, SSOP and QFP packages. Provides ultra low stress, low moisture absorption, high purity and high reliability. Its... | |
| (Known as Hysol KL-G100 ) LOCTITE Hysol KL-G 100 is a green mold compound with 1/4" flammability rating suitable for bridge, axial and TO packages. It offers superior moldability with... | |
| (Known as Hysol KL-G100L ) LOCTITE HYSOL KL-G 100L is an environmentally friendly, "green" molding compound, containing no bromine, antimony or phosphorous flame retardant. It meets UL 94 V-0 flammability... | |
| (Known as Hysol KL-G200 ) LOCTITE Hysol KL-G200 is a green mold compound with 1/4" flammability rating suitable for bridge, axial and TO packages. It offers superior moldability with lowest... | |
| (Known as Hysol KL-G800H ) LOCTITE Hysol® KL-G 800H™ is a high adhesion, ultra low stress, green mold compound suitable for TSOP, D/D2PAK and L/TQFP and contains no bromine, antimony... | |
| (Known as HYSOL KL1000-4TX(NT) ) LOCTITE HYSOL KL 1000-4TX(NT) epoxy molding compound delivers outstanding performance and ease of use. It meets UL 94 V-) flammability at 3.175 mm thickness. | |
| (Known as HYSOL MG15F ) LOCTITE HYSOL MG15F BULK is a white epoxy molding compound specifically formulated for use as an overmold for opto coupler devices. | |
| (Known as HYSOL MG15F 16MM X 8.3G PL ) LOCTITE HYSOL MG 15F is an anhydride-cured Molding Compound designed specifically for use in high voltage power applications requiring good electrical... | |
| (Known as Hysol MG15F-35A ) LOCTITE HYSOL MG 15F-35A is a anhydride cured molding compound designed for use in high voltage power applications requiring good electrical stability at high temperatures. | |
| (Known as HYSOL MG33F-0520 ) LOCTITE HYSOL MG33F-0520 is a specially formulated green product desigmed for use in high volume molding of tantalum capacitors. It has low moisture absorption, excellent... | |
| (Known as HYSOL MG33F-0593 ) LOCTITE HYSOL CF0593 MG33F-0593 BK is a green specially formulated product for use in high volume molding of tantalum capacitors. It was developed to provide... | |
| (Known as Hysol MG40F-4023 ) LOCTITE HYSOL MG40F-4023 / conventional molding of SMD and SIP networks; gold version MG40F-0526 available | |
| (Known as Hysol MG40FS-AM ) LOCTITE HYSOL MG40FS-AM epoxy molding compound delivers outstanding performance and ease of use. It is used in PDIP, SOIC and power discrete applications. | |
| (Known as Hysol MG52F-99B NXP ) LOCTITE HYSOL MG52F-99B NXP high productivity modling compound, designed for high volume encapsulation of surface mount devices. It is designed to provide much improved... | |
| (Known as LOCTITE HYSOL GR 360A(ON) ) LOCTITE HYSOL GR360A(ON)-TSHT epoxy molding compound delivers outstanding performance and ease of use. It is a green product with good electrical stability. It... | |
| (Known as LOCTITE HYSOL GR 646HV-L1 Epoxy molding compound ) LOCTITE HYSOL GR 646HV-L1 is recommended for automatic molding operations. It is a green product, low stress, fast cure and... | |
| (Known as Loctite Hysol GR2310-Gold ) LOCTITE HYSOL CF0671 GR2310 Gold is a gold / non-halogenated molding powder, tantalum and ceramic capacitors, leaded or surface-mounted sensors. | |
| (Known as Loctite Hysol GR2720 ) Black/low stess/non-flammable retarded molding powder, Ta and ceramic capacitors, leaded or surface-mounted sensors. | |
| (Known as Loctite Hysol Huawei KL1000-4T ) LOCTITE HYSOL KL 1000-4T provides the lowest cost of ownership with superior moldability and reliability. Extremely suitable for DIP packages. | |
| (Known as Macromelt 6206 ) Macromelt 6206 is a moldable polyamide with excellent adhesion to tough substrates. Great flexibility with incredible strain relief on cables and wires. Ideal for encapsulation... | |
| (Known as Macromelt OM648 ) TECHNOMELT PA 648 is designed for bonding of cylindrical fitting parts. Cures when confined in the absence of air between close fitting. | |
| (Known as MG15F-0140R ) LOCTITE Hysol MG 15F-0140 is a anhydride cured molding compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperatures. | |
| A high thermal conductivity molding compound using fully rounded spherical crystalling fillers designed to improve thermal management for semiconductor devices. It exhibits high adhesion to Cu and Cu alloys. This... | |
| Anhydride-cured Molding Compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperature. This material is specifically recommended for power discrete, high voltage rectifier... | |
| Black environmentally-frie ndly green molding compound designed especially for the encapsulation of tantalum capacitors. Low moisture absorption, excellent moldability with fast cycle times, especially auto-mold applications. | |
| Black/low stess/non-flammable retarded molding powder, Ta and ceramic capacitors, leaded or surface-mounted sensors. | |
| General purpose, good moldability, high Tg. | |
| Green, ultra low stress and high adhesion molding compound designed for QFP packages with Pb-free finishing. Provides wide molding process window and robust reliability performance. | |
| Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT... | |
| Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT... | |
| High performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of... | |
| High thermal conductivity, for TO-220F/3PF packages. | |
| Hysol GR2710 is a gold, low stress/non-flame retarded molding powder, for tantalum and ceramic capacitors, leaded or surface-mounted sensors. | |
| HYSOL GR360A-ST-1 is an environmentally friendly "green" molding compound containing no bromine, antimony or phosphorus flame retardant. It meets UL 94 V-0 flammability at 6.35 mm. | |
| Hysol GR725LS is a semiconductor grade molding compound designed for power package applications. This material is designed to achieve high JEDEC MSL requirements, at 260°C reflow temperature. | |
| Hysol GR750HT-25 is a high thermal conductivity molding compound using fully alumina fillers designed to improve thermal management for semiconductor devices. It exhibits high adhesion to copper and copper alloys. | |
| Hysol HuaweiKLG750 has superior adhesion technology to ensure zero delamination performance for SOT and SOIC packages. Offers enhanced reliability performance for T/LQFP packages. | |
| HYSOL KL-G730 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. Hysol KL-G730 offers enhanced... | |
| Hysol MG15F-R is a anhydride cured molding compound designed for use in high voltage power applications requiring good electrical stability at high temperatures. The material is specifically recommended for power... | |
| Hysol MG40FSBlack / conventional molding of SMD and SIP networks; gold version MG40F-0526 available | |
| Hysol® GR750™ are high thermal conductivity-isolate d packages, green, designed to improve thermal management for semiconductor devices. High adhesion to copper and copper alloys. | |
| Hysol® GR828D™ is a green, ultra low stress, high adhesion molding compound designed for SOIC, TSOP, and QFP packages with lead free finishes. | |
| Hysol® GR9810-1™ is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages including SIP and flip-chip array... | |
| Hysol® GR9851™ is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages. | |
| Hysol® Huawei KL-G900H™ is a high adhesion, ultra low stress, green mold compound suitable for BGA and contains no bromine, antimony or phosphorus flame retardant. It’s low viscosity properties enables... | |
| Hysol® KL-G45OH™ is a low stress, green mold compound suitable for SOP, SOJ and QFP and contains no bromine, antimony or phosphorus flame retardant. KL-G450H has a low stress flexible... | |
| LOCTITE HYSOL GR 640HV-L1 B18 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature. LOCTITE... | |
| LOCTITE HYSOL KL 4500-1 is a low stress and high reliability molding compound suitable for TO, SOIC ,SSOP and QFP packages, providing high purity and low uranium content. It’s low... | |
| LOCTITE Hysol MG15F-0140R is a anhydride cured molding compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperatures. This material is specifically recommended... | |
| LOCTITE Hysol MG35F is suitable for discrete semiconductors requiring improvement in heat dissipation. Provides high productivity for power transistors. | |
| Loctite Hysol® KL-4500-1N™ is a low stress and high reliability molding compound suitable for TO, SOP and SSOP packages. KL-4500- 1N meets JEDEC Level 2/260C for DIP and SOP. It’s... | |
| Macromelt MM Q-5375 is a moldable polyolefin for demanding moisture and solvent resistance. Excellent adhesion to the most difficult substrates. | |
| Moldable polyamide with excellent adhesion to tough substrates. Great flexibility with incredible strain relief on cables and wires. Ideal for encapsulation of heat producing components in appliance and consumer electronics. | |
| TECHNOMELT PA 7808 BLACK is a moldable polyamide with excellent adhesion to tough substrates. Great flexibility with incredible strain relief on cables and wires. Ideal for encapsulation of heat producing... | |
| TECHNOMELT PA 7833 is a high performance thermoplastic polyamide designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low... | |
| TECHNOMELT PA 7838 BLACK is a moldable polyamide with service temperature up to 125°C such as in an automotive firewall. |