Henkel Corporation - Electronics Datasheets for Resins and Compounds
Resins and compounds are used for shape fabrication or bond formation. Types include adhesive, casting, and leveling resins; caulk and grout; and sealants and thread lockers.
Resins and Compounds: Learn more
| Product Name | Notes |
|---|---|
| LOCTITE HYSOL GR15F-1 (Known as HYSOL GR 15F-1 ) -- 8799544475649 | (Known as HYSOL GR 15F-1 ) LOCTITE HYSOL GR15F-1 is an anhydride cured molding compound containing spherical filler designed for those applications requiring high voltage, high power and/or high temperature... |
| LOCTITE HYSOL GR2811 (Known as Hysol GR 2811) -- 8799547031553 | (Known as Hysol GR 2811 ) LOCTITE HYSOL GR2811 is an epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1... |
| LOCTITE HYSOL GR640HV (Known as Hysol GR 640HV) -- 8799547097089 | (Known as Hysol GR 640HV ) LOCTITE HYSOL GR640HV is a low stress, green molding compound suitable for SOT packages. Hysol GR640HV provides superior moldability and reliability with lowest cost... |
| LOCTITE HYSOL GR15F-1P (Known as Hysol GR15F-1P) -- 8799436570625 | (Known as Hysol GR15F-1P ) LOCTITE HYSOL GR15F-1P is a green, anhydride-cured molding compound contains spherical filler and is designed for high voltage applications. This product has excellent moldability performance... |
| LOCTITE HYSOL GR15F-A (Known as HYSOL GR15F-A) -- 8799574163457 | (Known as HYSOL GR15F-A ) LOCTITE HYSOL GR15F-A is an anhydride cured molding compound is formulated to contain spherical fillers. It is designed to achieve JEDEC level 1 requirements. It... |
| Hysol GR2220 (Known as Hysol GR2220) -- 8799544410113 | (Known as Hysol GR2220 ) GR2220 epoxy molding compound delivers outstanding performance and ease of use. Meets UL 94 V-0 Flammability at 6.35mm thickness. |
| LOCTITE HYSOL GR 2310 (Known as Hysol GR2310 14.3X5.7) -- 8799373557761 | (Known as Hysol GR2310 14.3X5.7 ) LOCTITE HYSOL GR 2310 is a gold, non-halogenated molding powder, for tantalum and ceramic capacitors, leaded or surface-mounted sensors. |
| LOCTITE HYSOL GR2320 (Known as Hysol GR2320) -- 8799373524993 | (Known as Hysol GR2320 ) LOCTITE HYSOL GR 2320 is a black/non-halogenated molding powder, tantalum and ceramic capacitors, leaded or surface-mounted sensors. |
| LOCTITE HYSOL GR 2340 (Known as Hysol GR2340) -- 8799551979521 | (Known as Hysol GR2340 ) LOCTITE HYSOL GR 2340 is a specially formulated molding compound designed for use in high volume molding of tantalum capacitors. It meets UL94 V-0 at... |
| LOCTITE HYSOL GR 360A (Known as Hysol GR360A-F8) -- 8799570067457 | (Known as Hysol GR360A-F8 ) LOCTITE HYSOL GR 360A is a green mold compound with 1/8" flammability rating suitable for bridge, axial and TO packages. GR360A-F8 offers good moldability with... |
| LOCTITE HYSOL GR360A-FC2A (Known as Hysol GR360A-FC2A) -- 8802609364993 | (Known as Hysol GR360A-FC2A ) LOCTITE HYSOL GR360A-FC2A epoxy molding compound delivers outstanding performance and ease of use. It is a low stresss green product with high adhesion and moldability. |
| LOCTITE HYSOL MG40 BIM 74A BULK (Known as Hysol GR646) -- 8802595602433 | (Known as Hysol GR646 ) LOCTITE HYSOL MG40 BIM 74A BULK is only recommended for automatic molding operations. This material has been formulated to be molded at temperatures as low... |
| LOCTITE HYSOL GR725LV (Known as Hysol GR725LV-2) -- 8799549685761 | (Known as Hysol GR725LV-2 ) LOCTITE HYSOL GR725LV is a green, semiconductor grade, low stress and high adhesion molding compound. Its patented sigma technology enables extremely high performance for power... |
| LOCTITE HYSOL CG0645 GR735 (Known as Hysol GR735) -- 8799578324993 | (Known as Hysol GR735 ) LOCTITE HYSOL CG0645 GR735 is a high productivity molding compound designed specifically for the encapsulation of discrete semiconductor devices. This material is formulated to have... |
| LOCTITE HYSOL GR828FC1(IMP) BULK (Known as HYSOL GR828FC1) -- 8799574949889 | (Known as HYSOL GR828FC1 ) LOCTITE HYSOL GR828FC1(IMP) BULK is an environmentally friendly "green" molding compound containing no bromine, antimony or phosphorus flame retardant. |
| LOCTITE HYSOL GR9810-1P (Known as Hysol GR9810-1P) -- 8799544705025 | (Known as Hysol GR9810-1P ) LOCTITE HYSOL GR9810-1P is a state-of-the-art epoxy molding compound developed to meet the stringent encapsulation requirements of package-on-package (POP) devices. This compound exhibits advanced warpage... |
| LOCTITE HYSOL KL-1000-3LX HRHJ (Known as Hysol KL-1000-3LX) -- 8799547228161 | (Known as Hysol KL-1000-3LX ) LOCTITE HYSOL KL-1000-3LX HRHJ provides the lowest cost of ownership with superior moldability and reliability. LOCTITE HYSOL KL-1000-3LX HRHJ is extremely suitable for bridge, axial... |
| LOCTITE HYSOL KL-1000-3LX P (Known as Hysol KL-1000-3LX) -- 8799574982657 | (Known as Hysol KL-1000-3LX ) LOCTITE HYSOL KL-1000-3LX P provides the lowest cost of ownership with superior moldability and reliability. Bridge Package, Axial Package and TO are typical package applications. |
| LOCTITE HYSOL KL-3000-FF(H) (Known as Hysol KL-3000-FF(H)) -- 8799577931777 | (Known as Hysol KL-3000-FF(H) ) LOCTITE HYSOL KL-3000-FF(H) epoxy molding compound delivers outstanding performance and ease of use. It is designed to provide improved stress performance. |
| LOCTITE HYSOL KL 4500-1NT (Known as Hysol KL-4500-1NT) -- 8799545950209 | (Known as Hysol KL-4500-1NT ) LOCTITE Hysol KL-4500-1NT is a low stress and high reliability molding compound suitable for SOIC packages. Its low viscosity properties enable low wire sweep molding... |
| LOCTITE HYSOL KL-5000-HT (Known as Hysol KL-5000-HT) -- 8799544541185 | (Known as Hysol KL-5000-HT ) LOCTITE HYSOL KL 5000-HT has alumina fillers and delivers a high thermal conductive solution for TO-220F/3PF's thermal requirements. KL5000-HT's low moisture absorption and low thermal... |
| LOCTITE HYSOL KL 6500S (Known as Hysol KL-6500S) -- 8799544836097 | (Known as Hysol KL-6500S ) LOCTITE Hysol KL-6500S is a low stress molding compound suitable for SOT/SMX and SOD packages. Hysol Huawei KL6500S provides good workability and high reliability. |
| LOCTITE HYSOL KL 7000HA (Known as Hysol KL-7000HA) -- 8799545786369 | (Known as Hysol KL-7000HA ) LOCTITE HYSOL KL 7000HA is suitable for SOT, SSOP and QFP packages. Provides ultra low stress, low moisture absorption, high purity and high reliability. Its... |
| LOCTITE HYSOL KL-G 100 (Known as Hysol KL-G100) -- 8799545425921 | (Known as Hysol KL-G100 ) LOCTITE Hysol KL-G 100 is a green mold compound with 1/4" flammability rating suitable for bridge, axial and TO packages. It offers superior moldability with... |
| LOCTITE HYSOL KL-G100L CQPW (Known as Hysol KL-G100L) -- 8799576522753 | (Known as Hysol KL-G100L ) LOCTITE HYSOL KL-G 100L is an environmentally friendly, "green" molding compound, containing no bromine, antimony or phosphorous flame retardant. It meets UL 94 V-0 flammability... |
| LOCTITE HYSOL KL-G200 (Known as Hysol KL-G200) -- 8802592227329 | (Known as Hysol KL-G200 ) LOCTITE Hysol KL-G200 is a green mold compound with 1/4" flammability rating suitable for bridge, axial and TO packages. It offers superior moldability with lowest... |
| LOCTITE HYSOL KL-G 800H (Known as Hysol KL-G800H) -- 8802565783553 | (Known as Hysol KL-G800H ) LOCTITE Hysol® KL-G 800H™ is a high adhesion, ultra low stress, green mold compound suitable for TSOP, D/D2PAK and L/TQFP and contains no bromine, antimony... |
| LOCTITE HYSOL KL-1000-4TX(NT) (Known as HYSOL KL1000-4TX(NT)) -- 8799574261761 | (Known as HYSOL KL1000-4TX(NT) ) LOCTITE HYSOL KL 1000-4TX(NT) epoxy molding compound delivers outstanding performance and ease of use. It meets UL 94 V-) flammability at 3.175 mm thickness. |
| LOCTITE HYSOL MG15F BULK (Known as HYSOL MG15F) -- 8799544999937 | (Known as HYSOL MG15F ) LOCTITE HYSOL MG15F BULK is a white epoxy molding compound specifically formulated for use as an overmold for opto coupler devices. |
| LOCTITE HYSOL MG 15F (Known as HYSOL MG15F 16MM X 8.3G PL) -- 8802592161793 | (Known as HYSOL MG15F 16MM X 8.3G PL ) LOCTITE HYSOL MG 15F is an anhydride-cured Molding Compound designed specifically for use in high voltage power applications requiring good electrical... |
| LOCTITE HYSOL MG 15F-35A (Known as Hysol MG15F-35A) -- 8799371198465 | (Known as Hysol MG15F-35A ) LOCTITE HYSOL MG 15F-35A is a anhydride cured molding compound designed for use in high voltage power applications requiring good electrical stability at high temperatures. |
| LOCTITE HYSOL MG33F-0520 (Known as HYSOL MG33F-0520) -- 8802563686401 | (Known as HYSOL MG33F-0520 ) LOCTITE HYSOL MG33F-0520 is a specially formulated green product desigmed for use in high volume molding of tantalum capacitors. It has low moisture absorption, excellent... |
| LOCTITE HYSOL CF0593 MG33F-0593 BK (Known as HYSOL MG33F-0593) -- 8802611396609 | (Known as HYSOL MG33F-0593 ) LOCTITE HYSOL CF0593 MG33F-0593 BK is a green specially formulated product for use in high volume molding of tantalum capacitors. It was developed to provide... |
| LOCTITE HYSOL MG40F-4023 (Known as Hysol MG40F-4023) -- 8799547785217 | (Known as Hysol MG40F-4023 ) LOCTITE HYSOL MG40F-4023 / conventional molding of SMD and SIP networks; gold version MG40F-0526 available |
| LOCTITE HYSOL MG40FS-AM (Known as Hysol MG40FS-AM) -- 8799575015425 | (Known as Hysol MG40FS-AM ) LOCTITE HYSOL MG40FS-AM epoxy molding compound delivers outstanding performance and ease of use. It is used in PDIP, SOIC and power discrete applications. |
| LOCTITE HYSOL MG52F-99B NXP (Known as Hysol MG52F-99B NXP) -- 8799576719361 | (Known as Hysol MG52F-99B NXP ) LOCTITE HYSOL MG52F-99B NXP high productivity modling compound, designed for high volume encapsulation of surface mount devices. It is designed to provide much improved... |
| LOCTITE HYSOL GR360A(ON)-TSHT (Known as LOCTITE HYSOL GR 360A(ON)) -- 8802609528833 | (Known as LOCTITE HYSOL GR 360A(ON) ) LOCTITE HYSOL GR360A(ON)-TSHT epoxy molding compound delivers outstanding performance and ease of use. It is a green product with good electrical stability. It... |
| LOCTITE HYSOL GR 646HV-L1 (Known as LOCTITE HYSOL GR 646HV-L1 Epoxy molding compound) -- 8802609496065 | (Known as LOCTITE HYSOL GR 646HV-L1 Epoxy molding compound ) LOCTITE HYSOL GR 646HV-L1 is recommended for automatic molding operations. It is a green product, low stress, fast cure and... |
| LOCTITE HYSOL CF0671 GR2310 Gold (Known as Loctite Hysol GR2310-Gold) -- 8799547162625 | (Known as Loctite Hysol GR2310-Gold ) LOCTITE HYSOL CF0671 GR2310 Gold is a gold / non-halogenated molding powder, tantalum and ceramic capacitors, leaded or surface-mounted sensors. |
| LOCTITE HYSOL GR2720 A (Known as Loctite Hysol GR2720) -- 8802575876097 | (Known as Loctite Hysol GR2720 ) Black/low stess/non-flammable retarded molding powder, Ta and ceramic capacitors, leaded or surface-mounted sensors. |
| LOCTITE HYSOL KL 1000-4T (Known as Loctite Hysol Huawei KL1000-4T) -- 8799546507265 | (Known as Loctite Hysol Huawei KL1000-4T ) LOCTITE HYSOL KL 1000-4T provides the lowest cost of ownership with superior moldability and reliability. Extremely suitable for DIP packages. |
| TECHNOMELT PA 6206 (Known as Macromelt 6206) -- 8802588295169 | (Known as Macromelt 6206 ) Macromelt 6206 is a moldable polyamide with excellent adhesion to tough substrates. Great flexibility with incredible strain relief on cables and wires. Ideal for encapsulation... |
| TECHNOMELT PA 648 (Known as Macromelt OM648) -- 8802588524545 | (Known as Macromelt OM648 ) TECHNOMELT PA 648 is designed for bonding of cylindrical fitting parts. Cures when confined in the absence of air between close fitting. |
| LOCTITE HYSOL MG 15F-0140 (Known as MG15F-0140R) -- 8799468650497 | (Known as MG15F-0140R ) LOCTITE Hysol MG 15F-0140 is a anhydride cured molding compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperatures. |
| Hysol GR750-SC -- 8799436636161 | A high thermal conductivity molding compound using fully rounded spherical crystalling fillers designed to improve thermal management for semiconductor devices. It exhibits high adhesion to Cu and Cu alloys. This... |
| Hysol MG15F -- 8799468617729 | Anhydride-cured Molding Compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperature. This material is specifically recommended for power discrete, high voltage rectifier... |
| Hysol MG33F -- 8799403147265 | Black environmentally-friendly green molding compound designed especially for the encapsulation of tantalum capacitors. Low moisture absorption, excellent moldability with fast cycle times, especially auto-mold applications. |
| Hysol GR2720 -- 8799436603393 | Black/low stess/non-flammable retarded molding powder, Ta and ceramic capacitors, leaded or surface-mounted sensors. |
| Hysol GR2620 -- 8799550177281 | General purpose, good moldability, high Tg. |
| Hysol GR869 -- 8799550439425 | Green, ultra low stress and high adhesion molding compound designed for QFP packages with Pb-free finishing. Provides wide molding process window and robust reliability performance. |
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TECHNOMELT AS 8998 -- AS 8998
TECHNOMELT PA 2384 -- 8807299842049 TECHNOMELT PA 341 -- 8802588327937 TECHNOMELT PA 5375 -- 8807332478977 TECHNOMELT PA 6208 -- 8807692926977 TECHNOMELT PA 6208 Black -- 8799566462977 TECHNOMELT PA 633 -- 8802586427393 TECHNOMELT PA 6344 -- 8807299973121 TECHNOMELT PA 638 -- 8802586492929 TECHNOMELT PA 641 -- 8802586558465 TECHNOMELT PA 646 -- 8802586591233 TECHNOMELT PA 652 -- 8799377391617 TECHNOMELT PA 653 TECHNOMELT PA 657 -- 8799377358849 TECHNOMELT PA 658 TECHNOMELT PA 668 -- 8805825445889 TECHNOMELT PA 668 Clear TECHNOMELT PA 673 (Known as Macromelt OM 673) -- 8802614804481 TECHNOMELT PA 678 -- 8802588065793 TECHNOMELT PA 682 -- 8799377424385 TECHNOMELT PA 687 -- 8807299710977 |
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT... |
| TECHNOMELT PA 2692 | Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT... |
| Macromelt MM6208 -- 8802576007169 | High performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of... |
| LOCTITE HYSOL KL-G 500HT -- 8799550668801 | High thermal conductivity, for TO-220F/3PF packages. |
| Hysol GR2710 -- 8799375523841 | Hysol GR2710 is a gold, low stress/non-flame retarded molding powder, for tantalum and ceramic capacitors, leaded or surface-mounted sensors. |
| HYSOL GR360A-ST-1 -- 8799574917121 | HYSOL GR360A-ST-1 is an environmentally friendly "green" molding compound containing no bromine, antimony or phosphorus flame retardant. It meets UL 94 V-0 flammability at 6.35 mm. |
| Hysol GR725LS -- 8799550406657 | Hysol GR725LS is a semiconductor grade molding compound designed for power package applications. This material is designed to achieve high JEDEC MSL requirements, at 260°C reflow temperature. |
| Hysol GR750HT-25 -- 8799546966017 | Hysol GR750HT-25 is a high thermal conductivity molding compound using fully alumina fillers designed to improve thermal management for semiconductor devices. It exhibits high adhesion to copper and copper alloys. |
| Hysol Huawei KLG750 -- 8799545229313 | Hysol HuaweiKLG750 has superior adhesion technology to ensure zero delamination performance for SOT and SOIC packages. Offers enhanced reliability performance for T/LQFP packages. |
| Hysol KL-G730 -- 8799545262081 | HYSOL KL-G730 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. Hysol KL-G730 offers enhanced... |
| Hysol MG15F-R -- 8799371821057 | Hysol MG15F-R is a anhydride cured molding compound designed for use in high voltage power applications requiring good electrical stability at high temperatures. The material is specifically recommended for power... |
| Hysol MG40FS -- 8799547752449 | Hysol MG40FSBlack / conventional molding of SMD and SIP networks; gold version MG40F-0526 available |
| Hysol GR750 -- 8799375032321 | Hysol® GR750™ are high thermal conductivity-isolated packages, green, designed to improve thermal management for semiconductor devices. High adhesion to copper and copper alloys. |
| Hysol GR828D -- 8799570100225 | Hysol® GR828D™ is a green, ultra low stress, high adhesion molding compound designed for SOIC, TSOP, and QFP packages with lead free finishes. |
| Hysol GR9810-1 -- 8799373819905 | Hysol® GR9810-1™ is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages including SIP and flip-chip array... |
| Hysol GR9851 -- 8799570165761 | Hysol® GR9851™ is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages. |
| Hysol Huawei KL-G900H -- 8799373885441 | Hysol® Huawei KL-G900H™ is a high adhesion, ultra low stress, green mold compound suitable for BGA and contains no bromine, antimony or phosphorus flame retardant. It’s low viscosity properties enables... |
| Hysol KL-G450H -- 8799403671553 | Hysol® KL-G45OH™ is a low stress, green mold compound suitable for SOP, SOJ and QFP and contains no bromine, antimony or phosphorus flame retardant. KL-G450H has a low stress flexible... |
| LOCTITE HYSOL GR 640HV-L1 B18 -- 8807890386945 | LOCTITE HYSOL GR 640HV-L1 B18 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature. LOCTITE... |
| LOCTITE HYSOL KL 4500-1 -- 8799403638785 | LOCTITE HYSOL KL 4500-1 is a low stress and high reliability molding compound suitable for TO, SOIC ,SSOP and QFP packages, providing high purity and low uranium content. It’s low... |
| LOCTITE Hysol MG15F-0140R -- 8802584854529 | LOCTITE Hysol MG15F-0140R is a anhydride cured molding compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperatures. This material is specifically recommended... |
| LOCTITE HYSOL MG 35F -- 8799547850753 | LOCTITE Hysol MG35F is suitable for discrete semiconductors requiring improvement in heat dissipation. Provides high productivity for power transistors. |
| LOCTITE HYSOL KL 4500-1N -- 8799403606017 | Loctite Hysol® KL-4500-1N™ is a low stress and high reliability molding compound suitable for TO, SOP and SSOP packages. KL-4500- 1N meets JEDEC Level 2/260C for DIP and SOP. It’s... |
| Macromelt MM Q-5375 -- 8799534546945 | Macromelt MM Q-5375 is a moldable polyolefin for demanding moisture and solvent resistance. Excellent adhesion to the most difficult substrates. |
| Macromelt MM 6208S -- 8802584887297 | Moldable polyamide with excellent adhesion to tough substrates. Great flexibility with incredible strain relief on cables and wires. Ideal for encapsulation of heat producing components in appliance and consumer electronics. |
| TECHNOMELT PA 7808 BLACK -- 8799534514177 | TECHNOMELT PA 7808 BLACK is a moldable polyamide with excellent adhesion to tough substrates. Great flexibility with incredible strain relief on cables and wires. Ideal for encapsulation of heat producing... |
| TECHNOMELT PA 7833 -- 8799377620993 | TECHNOMELT PA 7833 is a high performance thermoplastic polyamide designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low... |
| TECHNOMELT PA 7838 BLACK -- 8799377555457 | TECHNOMELT PA 7838 BLACK is a moldable polyamide with service temperature up to 125°C such as in an automotive firewall. |