(Known as HYSOL UF3037 )
LOCTITE ECCOBOND UF 3037 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at low temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints. It is compatible with most Pb-free and Halogen-free solders.
| Henkel Corporation - Electronics | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | 8799575769089 |
| Product Name | LOCTITE ECCOBOND UF 3037 (Known as HYSOL UF3037) |
| Form / Function | Gap Filler, Foam in Place Gasket |
