Henkel Corporation - Electronics LOCTITE ECCOBOND UF 3037 (Known as HYSOL UF3037) 8799575769089

Description
(Known as HYSOL UF3037 ) LOCTITE ECCOBOND UF 3037 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at low temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints. It is compatible with most Pb-free and Halogen-free solders.
Description
(Known as HYSOL UF3037 ) LOCTITE ECCOBOND UF 3037 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at low temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints. It is compatible with most Pb-free and Halogen-free solders.

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LOCTITE ECCOBOND UF 3037 (Known as HYSOL UF3037) - 8799575769089 - Henkel Corporation - Electronics
Irvine, CA, USA
LOCTITE ECCOBOND UF 3037 (Known as HYSOL UF3037)
8799575769089
LOCTITE ECCOBOND UF 3037 (Known as HYSOL UF3037) 8799575769089
(Known as HYSOL UF3037 ) LOCTITE ECCOBOND UF 3037 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at low temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints. It is compatible with most Pb-free and Halogen-free solders.

(Known as HYSOL UF3037 )

LOCTITE ECCOBOND UF 3037 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at low temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints. It is compatible with most Pb-free and Halogen-free solders.

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Technical Specifications

  Henkel Corporation - Electronics
Product Category Encapsulants and Potting Compounds
Product Number 8799575769089
Product Name LOCTITE ECCOBOND UF 3037 (Known as HYSOL UF3037)
Form / Function Gap Filler, Foam in Place Gasket
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