Henkel Corporation - Electronics Datasheets for UV Curing Adhesives

UV curing adhesives use ultraviolet (UV) light or other radiation sources to initiate curing, which allows a permanent bond without heating.
UV Curing Adhesives: Learn more

Product Name Notes
(Known as Ablestik ABLELUX OGR150THTG ) Photocurable adhesive is designed for high throughput optoelectronic assembly operations. This product also contains a secondary thermal cure mechanism for applications that contain shadowed...
(Known as Electrodag PF-021 UV Curable Encapsulant ) LOCTITE EDAG PF-021 E&C is a dot dispensable, UV curable encapsulating photopolymer designed to secure low profile surface mount devices to rigid...
(Known as Hysol ECCOBOND UV 9000 ) One component, low temperature curing thermally conductive epoxy adhesive.
(Known as HYSOL UV3000 ) LOCTITE ECCOBOND UV 3000 is a UV curable adhesive designed for high throughput assembly operations. This adhesive can withstand exposure to temperatures as high as...
LOCTITE 3129 is a one-component UV and heat dual cure adhesive for assembly of temperature sensitive electronic components.
LOCTITE 3217 is a one-component UV and heat dual cure adhesive for assembly of temperature sensitive electronic components.
LOCTITE 3705 is a UV-cured adhesive designed for bonding electronics components on PCBs. Thixotropic nature reduces migration of product. Excellent adhesion to a wide range of substrate. Bonds in seconds...
LOCTITE 3736 is a UV and visible light curable coating resin. This product is specially formulated for moisture protection on COG of LCD module or terminals of TAB mounts. Its...
Loctite® Liquid Optically Clear Adhesives (LOCAs) for cover lens bonding, touch panel sensor assembly and direct bonding applications in touch panel and display devices including mobile phones, tablets, monitors, televisions...
Photocurable adhesive is designed for high throughput assembly operations.
Single component, photocurable adhesive is designed for bonding camera module assemblies.
UV-curable cationic epoxy adhesive. Designed for use in sealing glass lid of packages of area image sensors such as CCD and CMOS.