Henkel Corporation - Electronics Datasheets for UV Curing Adhesives
UV curing adhesives use ultraviolet (UV) light or other radiation sources to initiate curing, which allows a permanent bond without heating.
UV Curing Adhesives: Learn more
| Product Name | Notes |
|---|---|
| (Known as Ablestik ABLELUX OGR150THTG ) Photocurable adhesive is designed for high throughput optoelectronic assembly operations. This product also contains a secondary thermal cure mechanism for applications that contain shadowed... | |
| (Known as Electrodag PF-021 UV Curable Encapsulant ) LOCTITE EDAG PF-021 E&C is a dot dispensable, UV curable encapsulating photopolymer designed to secure low profile surface mount devices to rigid... | |
| (Known as Hysol ECCOBOND UV 9000 ) One component, low temperature curing thermally conductive epoxy adhesive. | |
| (Known as HYSOL UV3000 ) LOCTITE ECCOBOND UV 3000 is a UV curable adhesive designed for high throughput assembly operations. This adhesive can withstand exposure to temperatures as high as... | |
| LOCTITE 3129 is a one-component UV and heat dual cure adhesive for assembly of temperature sensitive electronic components. | |
| LOCTITE 3217 is a one-component UV and heat dual cure adhesive for assembly of temperature sensitive electronic components. | |
| LOCTITE 3705 is a UV-cured adhesive designed for bonding electronics components on PCBs. Thixotropic nature reduces migration of product. Excellent adhesion to a wide range of substrate. Bonds in seconds... | |
| LOCTITE 3736 is a UV and visible light curable coating resin. This product is specially formulated for moisture protection on COG of LCD module or terminals of TAB mounts. Its... | |
| Loctite® Liquid Optically Clear Adhesives (LOCAs) for cover lens bonding, touch panel sensor assembly and direct bonding applications in touch panel and display devices including mobile phones, tablets, monitors, televisions... | |
| Photocurable adhesive is designed for high throughput assembly operations. | |
| Single component, photocurable adhesive is designed for bonding camera module assemblies. | |
| UV-curable cationic epoxy adhesive. Designed for use in sealing glass lid of packages of area image sensors such as CCD and CMOS. |