Henkel Corporation - Electronics Hysol FP5500 8799550144513

Description
Heat cure material designed ACP process by thermal compression (RFID, Misc, Assembly).
  • Hysol FP5500 - 8799550144513 - Henkel Corporation - Electronics
    Henkel Corporation - Electronics
Description
Heat cure material designed ACP process by thermal compression (RFID, Misc, Assembly).

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Hysol FP5500 - 8799550144513 - Henkel Corporation - Electronics
Henkel Corporation - Electronics
Irvine, CA, USA
Hysol FP5500
8799550144513
Hysol FP5500 8799550144513
Heat cure material designed ACP process by thermal compression (RFID, Misc, Assembly).

Heat cure material designed ACP process by thermal compression (RFID, Misc, Assembly).

Supplier's Site

Technical Specifications

  Henkel Corporation - Electronics
Product Category Encapsulants and Potting Compounds
Product Number 8799550144513
Product Name Hysol FP5500
Industry Electronics
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