Henkel Corporation - Electronics LOCTITE ECCOBOND SB 50 (Known as Hysol SB-50) 8802592325633

Description
(Known as Hysol SB-50 ) LOCTITE ECCOBOND SB 50 underfill material is ideal for high volume assembly processes. As the product does not flow under the solder array, it is ideal for large packages where underfill flow is challenging.
  • LOCTITE ECCOBOND SB 50 (Known as Hysol SB-50) - 8802592325633 - Henkel Corporation - Electronics
    Henkel Corporation - Electronics
Description
(Known as Hysol SB-50 ) LOCTITE ECCOBOND SB 50 underfill material is ideal for high volume assembly processes. As the product does not flow under the solder array, it is ideal for large packages where underfill flow is challenging.

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LOCTITE ECCOBOND SB 50 (Known as Hysol SB-50) - 8802592325633 - Henkel Corporation - Electronics
Henkel Corporation - Electronics
Irvine, CA, USA
LOCTITE ECCOBOND SB 50 (Known as Hysol SB-50)
8802592325633
LOCTITE ECCOBOND SB 50 (Known as Hysol SB-50) 8802592325633
(Known as Hysol SB-50 ) LOCTITE ECCOBOND SB 50 underfill material is ideal for high volume assembly processes. As the product does not flow under the solder array, it is ideal for large packages where underfill flow is challenging.

(Known as Hysol SB-50 )

LOCTITE ECCOBOND SB 50 underfill material is ideal for high volume assembly processes. As the product does not flow under the solder array, it is ideal for large packages where underfill flow is challenging.

Supplier's Site

Technical Specifications

  Henkel Corporation - Electronics
Product Category Encapsulants and Potting Compounds
Product Number 8802592325633
Product Name LOCTITE ECCOBOND SB 50 (Known as Hysol SB-50)
Form / Function Gap Filler, Foam in Place Gasket
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