Henkel Corporation - Electronics LOCTITE ECCOBOND FF 2300 (Known as Hysol FF2300) 8799375392769

Name: LOCTITE ECCOBOND FF 2300 (Known as Hysol FF2300)
Brand: Henkel Corporation - Electronics

Description

(Known as Hysol FF2300 ) LOCTITE ECCOBOND FF 2300 is a no-flow underfill for eutectic and lead-free applications.

Description

(Known as Hysol FF2300 ) LOCTITE ECCOBOND FF 2300 is a no-flow underfill for eutectic and lead-free applications.

Suppliers

Company

Product

Description

Supplier Links

Irvine, CA, USA

LOCTITE ECCOBOND FF 2300 (Known as Hysol FF2300)
8799375392769

LOCTITE ECCOBOND FF 2300 (Known as Hysol FF2300) 8799375392769

(Known as Hysol FF2300 ) LOCTITE ECCOBOND FF 2300 is a no-flow underfill for eutectic and lead-free applications.

Supplier's Site

	Henkel Corporation - Electronics
Product Category	Encapsulants and Potting Compounds
Product Number	8799375392769
Product Name	LOCTITE ECCOBOND FF 2300 (Known as Hysol FF2300)
Form / Function	Gap Filler, Foam in Place Gasket

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Master Bond, Inc.

Specs

Type Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding

Form / Function Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket; Liquid

Cure / Technology Thermoset; Two Component

RS Components, Ltd.

Dymax

Specs

Cure / Technology Single Component

Tensile (Break) 750 psi (5171 KPa)

Elongation 150.0 %

TE Connectivity

Specs

Chemical System Two-Part Hydrocarbon Resin