Henkel Corporation - Electronics Datasheets for Encapsulants and Potting Compounds

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Encapsulants and Potting Compounds: Learn more

Product Name Notes
LOCTITE ECCOBOND 933 (Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant) -- 8799582060545 (Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant ) LOCTITE ECCOBOND 933 one component epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimized...
LOCTITE ECCOBOND UF 8806G (Known as Ablestik ABLEFILL UF8806G) -- 8802605662209 (Known as Ablestik ABLEFILL UF8806G ) LOCTITE ECCOBOND UF 8806G is moisture resistant. For die sizes <25mm. Ultra low alpha emissions.
LOCTITE ECCOBOND UF 8807 (Known as ABLESTIK ABLEFILL UF8807) -- 8802605170689 (Known as ABLESTIK ABLEFILL UF8807 ) One component, high flow liquid underfill encapsulant with superior moisture resistance.
LOCTITE ECCOBOND UF 8826 (Known as ABLESTIK ABLEFILL UF8826) -- 8799479726081 (Known as ABLESTIK ABLEFILL UF8826 ) LOCTITE ECCOBOND UF 8826 is for eutectic high lead low k applications. Medium modulus, low CTE.
LOCTITE CAT 15-1 CLEARJ (Known as CAT 15-1 CLEARJ) -- 8802608513025 (Known as CAT 15-1 CLEARJ ) LOCTITE CAT 15-1 CLEARJ is designed for use with potting and encapsulating resins.
LOCTITE CAT 15-1 LV (Known as CAT 15-1 LV) -- 8802608709633 (Known as CAT 15-1 LV ) LOCTITE CAT 15-1 LV is designed for use with potting and encapsulating resins.
LOCTITE STYCAST 5952 RD PTA (Known as E&C STYCAST 5952 A/B thermally conductive silicone encapsulant) -- 8799584059393 (Known as E&C STYCAST 5952 A/B thermally conductive silicone encapsulant ) LOCTITE STYCAST 5952 RD PTA is a filled, addition cured, silicone encapsulant. It features good thermal conductivity, excellent electrical...
LOCTITE STYCAST 276 (Known as ECCOBOND 276 1kg) -- 8799578062849 (Known as ECCOBOND 276 1kg ) LOCTITE STYCAST 276 epoxy is formulated not to sag or run during cure when applied on loose fitting parts set on vertical or overhead...
LOCTITE ECCOBOND DP1000 (Known as ECCOBOND DP1000 10cc (10g) Opt) -- 8802603270145 (Known as ECCOBOND DP1000 10cc (10g) Opt ) LOCTITE ECCOBOND DP1000 wirebond encapsulant features good adhesion to low energy plastic and metal substrates. It also has chemical and crack resistance.
LOCTITE ECCOBOND UF 3130 (Known as ECCOBOND UF 3130 underfill) -- 8802603565057 (Known as ECCOBOND UF 3130 underfill ) LOCTITE ECCOBOND UF 3130 is designed for use in heat sensitive optoelectronic components and other microelectronic devices.
LOCTITE ECCOBOND UV 9001 (Known as Eccobond UV9001) -- 8799551651841 (Known as Eccobond UV9001 ) LOCTITE ECCOBOND UV 9001 is a dual cure sealant and adhesive that can be syringe dispensed. It is a UV liqht and heat cure material...
LOCTITE 3508NH (Known as HYSOL 3508NH) -- 8799574425601 (Known as HYSOL 3508NH ) LOCTITE 3508NH is a one-component, reflow curable, halogen free epoxy designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. It can...
LOCTITE ECCOBOND CB0260 (Known as Hysol CB0260) -- 8799540543489 (Known as Hysol CB0260 ) LOCTITE ECCOBOND CB0260 is a high adhesion version of FP4450 for temperatures up to 260°C after being exposed to L2 JEDEC preconditioning.
LOCTITE ECCOBOND CB0260-1 (Known as Hysol CB0260-1) -- 8799540576257 (Known as Hysol CB0260-1 ) LOCTITE ECCOBOND CB0260-1 is a high adhesion version of FP4450 for temperatures up to 260°C after being exposed to L2 JEDEC preconditioning.
LOCTITE ECCOBOND CB064 (Known as Hysol CB064/FP4653) -- 8799374999553 (Known as Hysol CB064/FP4653 ) LOCTITE ECCOBOND CB064 is high purity, low stress, liquid, self-leveling encapsulant material. This material is for cavity fill or dam and fill applications. The unique...
LOCTITE ECCOBOND E 1216 (Known as Hysol E1216) -- 8799536775169 (Known as Hysol E1216 ) An innovative, non-reworkable, capillary flow underfill for CSP, BGA or flip chip devices. Designed for high volume assembly operations that require an underfill that flows...
LOCTITE E 1216M (Known as HYSOL E1216M) -- 8802596519937 (Known as HYSOL E1216M ) LOCTITE E 1216M is a snap curable capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that cures...
LOCTITE ECCOBOND E 1926 (Known as Hysol E1926) -- 8802590294017 (Known as Hysol E1926 ) LOCTITE ECCOBOND E 1926 is an non-reworkable, wafer-level underfill that provides excellent thermal reliability and cures relatively fast compared to standard first level underfills.
LOCTITE ABLESTIK 104 (Known as Hysol ECCOBOND 104) -- 8799501680641 (Known as Hysol ECCOBOND 104 ) A two component epoxy adhesive with outstanding physical and dielectric properties and service temperatures up to 230°C.
LOCTITE ABLESTIK A 312-20 (Known as Hysol ECCOBOND A312-20) -- 8799536971777 (Known as Hysol ECCOBOND A312-20 ) LOCTITE ABLESTIK A 312-20 is a one component, encapsulants potting epoxy.
LOCTITE ECCOBOND XUV 9085 (Known as Hysol ECCOBOND UV9085) -- 8799435456513 (Known as Hysol ECCOBOND UV9085 ) Designed as a faster curing, high thixotropic adhesive that gives good flow control and adhesion for a thick bondline.
LOCTITE STYCAST PC 355-1 (Known as Hysol ECCOCOAT PC355-1) -- 8799469699073 (Known as Hysol ECCOCOAT PC355-1 ) LOCTITE STYCAST PC 355-1 is a lead-free, transparent, one-component protective varnish system that is dry to the touch in under 30 minutes.
LOCTITE STYCAST PC 355-1FL (Known as HYSOL ECCOCOAT PC355-1FL conformal coating) -- 8802597371905 (Known as HYSOL ECCOCOAT PC355-1FL conformal coating ) LOCTITE STYCAST PC 355-1FL flexible thermoplastic varnish is formulated to protect and insulate printed wiring boards both on the component and the...
LOCTITE STYCAST SC 3613 (Known as Hysol ECCOCOAT SC3613) -- 8799536381953 (Known as Hysol ECCOCOAT SC3613 ) Heat curable, optically clear, high purity, one-component coating to be applied by brush, dip or flow coating.
LOCTITE STYCAST U 7510-1 (Known as Hysol ECCOCOAT U7510-1) -- 8799536414721 (Known as Hysol ECCOCOAT U7510-1 ) LOCTITE STYCAST U 7510-1 is a lead-free, transparent, one component protective varnish system that is dry to the touch in under 30 minutes.
LOCTITE STYCAST UV 7993 (Known as Hysol ECCOCOAT UV7993) -- 8802589999105 (Known as Hysol ECCOCOAT UV7993 ) Solvent-free, one component dual cure conformal coating.
LOCTITE STYCAST EE 1068 (Known as Hysol EE1068) -- 8799536676865 (Known as Hysol EE1068 ) LOCTITE STYCAST EE 1068 is a general purpose flame retardant casting compound formulated to have a glass transition temperature above 100°C.
LOCTITE STYCAST HD 3561 (Known as HYSOL EE1117-HD3561 epoxy system) -- 8799578423297 (Known as HYSOL EE1117-HD3561 epoxy system ) LOCTITE STYCAST HD 3561 epoxy system is designed for use as a sealant or for potting electronic devices. It is specially formulated for...
LOCTITE ECCOBOND EO 0206 (Known as HYSOL EO0206) -- 8802610937857 (Known as HYSOL EO0206 ) LOCTITE ECCOBOND EO 0206 one-component epoxy is designed for use on electronic devices. KEY BENEFITS Low Halogen content Non-Sag
LOCTITE ECCOBOND EO1016 (Known as Hysol EO1016) -- 8802589704193 (Known as Hysol EO1016 ) LOCTITE ECCOBOND EO1016 is a UL94V-0 encapsulant for Smartcards and watch IC's. Nonabrasive filler allows for grinding if necessary.
LOCTITE STYCAST EO 10587 (Known as Hysol EO1058) -- 8802591408129 (Known as Hysol EO1058 ) LOCTITE STYCAST EO 10587 is a single component epoxy system that cures at 125°C. Hysol EO1058 provides excellent environmental and thermal protection to encapsulated parts.
LOCTITE ECCOBOND EO1060 (Known as Hysol EO1060) -- 8799541559297 (Known as Hysol EO1060 ) LOCTITE ECCOBOND EO1060 is a low glob formulation for lower CTE and lower ionic than EO1016 content for more demanding applications.
LOCTITE ECCOBOND EO1061 (Known as Hysol EO1061) -- 8802591604737 (Known as Hysol EO1061 ) LOCTITE ECCOBOND EO1061 is a medium glob formulation for lower CTE and lower ionic than EO1016 content for more demanding applications.
LOCTITE ECCOBOND EO1062 (Known as Hysol EO1062) -- 8799402917889 (Known as Hysol EO1062 ) LOCTITE ECCOBOND EO1062 is a high glob version of EO1061.
LOCTITE ECCOBOND EO1080 (Known as Hysol EO1080) -- 8802589442049 (Known as Hysol EO1080 ) LOCTITE ECCOBOND EO1080 is a low CTE version of EO1016.
LOCTITE EO7021 (Known as HYSOL EO7021) -- 8802596978689 (Known as HYSOL EO7021 ) LOCTITE EO7021 is an encapsulant for use in smart card chip module applications. It is also suitable for die attach automated reel-to-reel processing.
LOCTITE EO7038 (Known as Hysol EO7038) -- 8799535955969 (Known as Hysol EO7038 ) LOCTITE EO7038 is a one-component epoxy potting system, formulated to protect sensors used in harsh environments, such as automotive applications.
LOCTITE ECCOBOND EO7039 (Known as HYSOL EO7039) -- 8799576391681 (Known as HYSOL EO7039 ) LOCTITE ECCOBOND EO7039 encapsulant is designed for attachment of integrated circuits and components to advanced flexible substrates. It is formulated to produce a void-free bond...
LOCTITE STYCAST ES 1002 DQ (Known as Hysol ES1002) -- 8799534186497 (Known as Hysol ES1002 ) Black, low cost, flexible, capable of UL94V-0, non-abrasive filled, long pot life.
LOCTITE STYCAST ES 1004 DQ (Known as HYSOL ES1004) -- 8802591997953 (Known as HYSOL ES1004 ) LOCTITE STYCAST ES 1004 DQ is capable of UL94V-0, stable to 155°C.
LOCTITE STYCAST ES 1902 DQ (Known as Hysol ES1902) -- 8802586722305 (Known as Hysol ES1902 ) LOCTITE STYCAST ES 1902 DQ is a clear, transparent, very fast UV gel with thermal co-cure, excellent dimensional stability and low viscosity; easy to handle.
LOCTITE ECCOBOND FF 2300 (Known as Hysol FF2300) -- 8799375392769 (Known as Hysol FF2300 ) LOCTITE ECCOBOND FF 2300 is a no-flow underfill for eutectic and lead-free applications.
LOCTITE ECCOBOND FP0114 (Known as Hysol FP0114) -- 8799469240321 (Known as Hysol FP0114 ) LOCTITE ECCOBOND FP0114 is a low viscosity, fast flow, epoxy based material designed for capillary underfill on flip chip applications. It has excellent wettability and...
LOCTITE ECCOBOND FP4323 (Known as Hysol FP4323) -- 8799542509569 (Known as Hysol FP4323 ) LOCTITE ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications.
LOCTITE ECCOBOND FP4410HF (Known as Hysol FP4410HF) -- 8799542706177 (Known as Hysol FP4410HF )
LOCTITE ECCOBOND FP4450 (Known as Hysol FP4450) -- 8799371952129 (Known as Hysol FP4450 ) LOCTITE ECCOBOND FP4450 is an industry standard fill material for fill or cavity down BGAs.
LOCTITE ECCOBOND FP4450HF (Known as Hysol FP4450HF) -- 8799376801793 (Known as Hysol FP4450HF ) LOCTITE ECCOBOND FP4450HF is a high flow version of FP4450LV using synthetic filler for use in fine wire and low alpha applications.
LOCTITE ECCOBOND FP4450LV (Known as Hysol FP4450LV) -- 8799376769025 (Known as Hysol FP4450LV ) LOCTITE ECCOBOND FP4450LV is a low viscosity version of FP4450 incorporating cleaner resins.
LOCTITE ECCOBOND FP4451 (Known as Hysol FP4451) -- 8799542870017 (Known as Hysol FP4451 ) LOCTITE ECCOBOND FP4451 is an industry standard damming material for BGAs.
LOCTITE ECCOBOND FP4451TD (Known as Hysol FP4451TD) -- 8802592063489 (Known as Hysol FP4451TD ) LOCTITE ECCOBOND FP4451TD is a tall dam version of FP4451 for applications requiring a taller, narrower dam. Ionically cleaner also.
LOCTITE ECCOBOND FP4460 (Known as Hysol FP4460) -- 8799372410881 (Known as Hysol FP4460 ) LOCTITE ECCOBOND FP4460 is a high purity, low stress glob top semiconductor encapsulant with improved moisture resistance and working life compared to earlier generation products.
LOCTITE ECCOBOND FP4470 (Known as Hysol FP4470) -- 8799372443649 (Known as Hysol FP4470 ) LOCTITE ECCOBOND FP4470 is a high adhesion version of FP4450 for 260°C L3 JEDEC performance.
LOCTITE ECCOBOND FP4526 (Known as Hysol FP4526) -- 8799372869633 (Known as Hysol FP4526 ) LOCTITE ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications.
LOCTITE ECCOBOND FP4530 (Known as Hysol FP4530) -- 8799543001089 (Known as Hysol FP4530 ) LOCTITE ECCOBOND FP4530 is a fast flow encapsulant material for flip chip underfill applications with a gap of 1 mil. The material is designed to...
LOCTITE ECCOBOND FP4549 (Known as Hysol FP4549) -- 8799543296001 (Known as Hysol FP4549 ) LOCTITE ECCOBOND FP4549 is used for fine-pitch flip chip applications, fast flowing, low stress underfill.
LOCTITE ECCOBOND FP4654 (Known as Hysol FP4654) -- 8799436308481 (Known as Hysol FP4654 ) LOCTITE ECCOBOND FP4654 is a low viscosity, high adhesion, version of FP4653 for large array packages.
LOCTITE ECCOBOND FP5001 (Known as Hysol FP5001) -- 8799534219265 (Known as Hysol FP5001 ) LOCTITE ECCOBOND FP5001 is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent...
LOCTITE ECCOBOND FP 5201 (Known as Hysol FP5201) -- 8799436505089 (Known as Hysol FP5201 ) LOCTITE ECCOBOND FP 5201 is designed for thermal compression bonding processes in flip chip to laminate assembly. Laminate Packages CSP, SCSP, SIP
LOCTITE ECCOBOND FP5300 (Known as Hysol FP5300) -- 8799544115201 (Known as Hysol FP5300 ) LOCTITE ECCOBOND FP5300 has excellent adhesion strength to 2- and 3-layer flex and Iaminates. Low temp cure ACP. For use on RFID, Misc, Assembly.
LOCTITE ECCOBOND LA 3032-78 (Known as HYSOL LA3032-78) -- 8799576621057 (Known as HYSOL LA3032-78 ) LOCTITE ECCOBOND LA 3032-78 encapsulant is designed for high throughput assembly operations. It is formulated to withstand high heat distortion temperatures and bonds well to...
LOCTITE STYCAST PC 18M (Known as Hysol PC18M) -- 8799375753217 (Known as Hysol PC18M ) LOCTITE STYCAST PC 18M is a flexible solvent-based, one-component coating. Provides good thermal shock resistance.
LOCTITE STYCAST PC 28-STD (Known as Hysol PC28STD) -- 8799376474113 (Known as Hysol PC28STD ) LOCTITE STYCAST PC 28-STD is a convenient aerosol packaging, oxygen-cure, printed circuit board coating system.
LOCTITE STYCAST PC 29M PTB (Known as Hysol PC29M) -- 8799547588609 (Known as Hysol PC29M ) LOCTITE STYCAST PC 29M PTB is a thin-film printed circuit board coating with good toughness and high flexibility. Note: Not sold in Europe.
LOCTITE STYCAST PC 40-UM (Known as Hysol PC40-UM) -- 8799547621377 (Known as Hysol PC40-UM ) LOCTITE STYCAST PC 40-UM is a solvent-free, low-viscosity, rapid gel, UV-moisture cure one component conformal coating.
LOCTITE STYCAST PC 40-UMF (Known as HYSOL PC40-UMF) -- 8799552077825 (Known as HYSOL PC40-UMF ) LOCTITE STYCAST PC 40-UMF conformal coating is specifically formulated to rapidly gel and immobolise when exposed to UV light and then fully cure when exposed...
LOCTITE ECCOBOND SB 50 (Known as Hysol SB-50) -- 8802592325633 (Known as Hysol SB-50 ) LOCTITE ECCOBOND SB 50 underfill material is ideal for high volume assembly processes. As the product does not flow under the solder array, it is...
LOCTITE STYCAST 1090 BK (Known as Hysol STYCAST 1090BLK) -- 8799572852737 (Known as Hysol STYCAST 1090BLK ) LOCTITE STYCAST 1090 BK is designed for encapsulation and potting of electronic assemblies that require lower weight such as aerospace applications.
LOCTITE STYCAST 2651J (Known as Hysol STYCAST 2651) -- 8799573147649 (Known as Hysol STYCAST 2651 ) Two component, low viscosity, general purpose epoxy encapsulant.
LOCTITE CAT 11 (Known as HYSOL STYCAST 2651-40FR/Catalyst 11) -- 8799576850433 (Known as HYSOL STYCAST 2651-40FR/Catalyst 11 ) LOCTITE CAT 11 epoxy encapsulant is designed for general potting applications. It is the flame retardant version of STYCAST 2651-40. It meets UL94V0...
LOCTITE CAT 24LV (Known as HYSOL STYCAST 2651-40FR/Catalyst 24LV) -- 8799576915969 (Known as HYSOL STYCAST 2651-40FR/Catalyst 24LV ) LOCTITE CAT 24LV is a two component encapsulant is designed for general potting applications. It is the flame retardant version of STYCAST 2651-40.
LOCTITE CAT 9 (Known as HYSOL STYCAST 2651-40FR/Catalyst 9) -- 8799576817665 (Known as HYSOL STYCAST 2651-40FR/Catalyst 9 ) LOCTITE CAT 9 is a two component epoxy encapsulant designed for general potting applications. It is a flame retardant version of STYCAST 2651-40.
LOCTITE STYCAST 2651MM (Known as HYSOL STYCAST 2651MM) -- 8799575474177 (Known as HYSOL STYCAST 2651MM ) LOCTITE STYCAST 2651MM is a filled, low viscosity, general purpose, epoxy encapsulant. It contains a soft filler that both reduces abrasion in meter/mix equipment...
LOCTITE STYCAST 2762 (Known as HYSOL STYCAST 2762 Catalyst 17M-1) -- 8799577079809 (Known as HYSOL STYCAST 2762 Catalyst 17M-1 ) LOCTITE STYCAST 2762 is a two component epoxy encapsulant designed for electronic components exposed to harsh environments. This material is also ideal...
LOCTITE CAT 14 (Known as HYSOL STYCAST 2762-Catalyst 14) -- 8802597011457 (Known as HYSOL STYCAST 2762-Catalyst 14 ) LOCTITE CAT 14 is a two component high thermal conductivity epoxy encapsulant for electronic components exposed to harsh environments. This material is also...
LOCTITE STYCAST 2850KT (Known as HYSOL STYCAST 2850KT/CATALYST 24LV) -- 8802596716545 (Known as HYSOL STYCAST 2850KT/CATALYST 24LV ) LOCTITE STYCAST 2850KT is a thermally conductive, electrically insulatiive epoxy encapsulant designed for heat sink replacement in non-integrated electrical components and assemblies. it...
LOCTITE CAT 27-1 (Known as HYSOL STYCAST 2850MT-Catalyst 27-1) -- 8799577210881 (Known as HYSOL STYCAST 2850MT-Catalyst 27-1 ) LOCTITE CAT 27-1 is a two component, electrically insulating general purpose encapsulant. It is recommended for encapsulation of components that require heat dissipation...
LOCTITE STYCAST 2850 MT (Known as HYSOL STYCAST 2850MT-Catalyst 9) -- 8799577145345 (Known as HYSOL STYCAST 2850MT-Catalyst 9 ) LOCTITE STYCAST 2850 MT is a two component, electrically insulating general purpose encapsulant. It is recommended for encapsulation of components that require heat...
LOCTITE STYCAST 3050 (Known as HYSOL STYCAST 3050 Catalyst 11) -- 8799577505793 (Known as HYSOL STYCAST 3050 Catalyst 11 ) LOCTITE STYCAST 3050 is a two component general purpose encapsulant desgined for potting and encapsulation applications with very small physical spacing between...
LOCTITE ECCOBOND 50500-1 (Known as Hysol STYCAST 50500-1) -- 8799573835777 (Known as Hysol STYCAST 50500-1 ) LOCTITE ECCOBOND 50500-1 is for protection of wire-bonded ICS, consider this flowable material for a fill.
LOCTITE STYCAST E 2534 FR (Known as Hysol STYCAST E2534FR) -- 8799573639169 (Known as Hysol STYCAST E2534FR ) LOCTITE STYCAST E 2534 FR epoxy potting compound complies with recent demands on environmentally friendly products and does not contain brominated flame retardants.
LOCTITE STYCAST U 2535 PTB (Known as HYSOL STYCAST U2535 Polyurethane Encapsulant) -- 8799577571329 (Known as HYSOL STYCAST U2535 Polyurethane Encapsulant ) LOCTITE STYCAST U 2535 PTB two component flexible polyurethane encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation...
LOCTITE ECCOBOND UF 3037 (Known as HYSOL UF3037) -- 8799575769089 (Known as HYSOL UF3037 ) LOCTITE ECCOBOND UF 3037 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at low temperatures to minimize stress to other...
LOCTITE ECCOBOND UF 3537 (Known as HYSOL UF3537) -- 8799551586305 (Known as HYSOL UF3537 ) LOCTITE ECCOBOND UF 3537 underfill is designed to improve board level assembly reliability.
Hysol UF3800 (Known as HYSOL UF3800 reworkable underfill) -- 8799570132993 (Known as HYSOL UF3800 reworkable underfill ) A high reliability, good reworkability, room temperature dispensable underfill compatible with most common solder pastes.
LOCTITE ECCOBOND UF 3808 (Known as HYSOL UF3808) -- 8802581086209 (Known as HYSOL UF3808 ) LOCTITE ECCOBOND UF 3808 is a capillary underfill designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material...
LOCTITE ECCOBOND UF 8830 (Known as Hysol UF8830) -- 8799551160321 (Known as Hysol UF8830 ) LOCTITE ECCOBOND UF 8830 is a liquid epoxy underfill encapsulant designed for flip chip BGA applications requiring improved crack/fracture resistance and low warpage.
LOCTITE STYCAST US 0154 (Known as Hysol US0154) -- 8799548473345 (Known as Hysol US0154 ) Encapsulant potting urethane.
LOCTITE STYCAST US 1151 (Known as HYSOL US1151) -- 8802596945921 (Known as HYSOL US1151 ) LOCTITE STYCAST US 1151 is a low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties. Introduction of this material on a...
LOCTITE STYCAST US 1750 (Known as HYSOL US1750) -- 8799575670785 (Known as HYSOL US1750 ) LOCTITE STYCAST US 1750 elastomeric polyurethane, is a waterwhite, clear, medical grade, fast gel potting material. It is ideal for blood heat exchanger, dialyzer and...
LOCTITE STYCAST US 2050 (Known as Hysol US2050) -- 8799548211201 (Known as Hysol US2050 ) LOCTITE STYCAST US 2050 is a quick set, optically clear polyurethane compound that exhibits excellent ultraviolet resistance. The excellent electrical properties also suggest its use...
LOCTITE STYCAST US 2350 (Known as Hysol US2350) -- 8799548145665 (Known as Hysol US2350 ) LOCTITE STYCAST US 2350 is a flexible, flame retardant, mineral filled, polyurethane compound. This potting compound has long pot life and is low viscosity so...
LOCTITE ECCOBOND UV 9060 (Known as HYSOL UV9060) -- 8799551291393 (Known as HYSOL UV9060 ) LOCTITE ECCOBOND UV 9060 is a no-flow UV/moisture cure encapsulant designed for local circuit board protection. It is fluorescent when viewed with ultraviolet (black) light.
LOCTITE ECCOBOND XE 1218 (Known as Hysol XE1218) -- 8802592751617 (Known as Hysol XE1218 ) LOCTITE ECCOBOND XE 1218 is a reworkable, snap cure, void-free, fast flowing underfill that also provides excellent adhesion and reliability benefits.
LOCTITE ECCOBOND XUV 9086 (Known as HYSOL XUV 9086) -- 8799577014273 (Known as HYSOL XUV 9086 ) LOCTITE ECCOBOND XUV 9086 is a one component UV cure encapsulant used in ink jet applications. It is formulated to dispense easily without stringing.
LOCTITE ECCOBOND UV 9052 (Known as Hysol XUV-9052) -- 8799536316417 (Known as Hysol XUV-9052 ) LOCTITE ECCOBOND UV 9052 is a one component, dual cure (UV & moisture) adhesive designed as a lead encapsulant used in ink jet applications.
LOCTITE 3323 (Known as LOCTITE 3323UV) -- 8802602188801 (Known as LOCTITE 3323UV ) LOCTITE 3323 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV...
LOCTITE 3327 (Known as LOCTITE 3327UV) -- 8802602352641 (Known as LOCTITE 3327UV ) LOCTITE 3327 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV...
LOCTITE ECCOBOND UF 8840 (Known as LOCTITE ECCOBOND UF 8840) -- 8799580127233 (Known as LOCTITE ECCOBOND UF 8840 ) LOCTITE ECCOBOND UF 8840 liquid epoxy underfill encapsulant is designed for flip chip BGA applications requiring improved crack/fracture resistance and low warpage. It...
LOCTITE STYCAST US 5533 PTB (Known as LOCTITE US5533 flame retardant potting compound) -- 8799579602945 (Known as LOCTITE US5533 flame retardant potting compound ) LOCTITE STYCAST US 5533 PTB is a two-component, flexible, flame retardant potting compound. It is formulated with low odor designed to...
LOCTITE STYCAST SC 8001 (Known as SC8001 5Gal) -- 8799469633537 (Known as SC8001 5Gal ) LOCTITE STYCAST SC 8001 one component B-stageable epoxy coating is designed to provide electrical insulation between conductive layers in thin-film photovoltaics.
LOCTITE STYCAST 1090SI (Known as STYCAST 1090SI) -- 8799572951041 (Known as STYCAST 1090SI ) LOCTITE STYCAST 1090SI encapsulant is recommended for applications where high compressive stress is applied to encapsulated circuitry - as in deep ocean work. This product...
LOCTITE STYCAST 2017M4 PTA (Known as STYCAST 2017M4/A 5kg) -- 8799573016577 (Known as STYCAST 2017M4/A 5kg ) Epoxy encapsulant developed for lamp type, blue LED.
LOCTITE STYCAST 2651-40 (Known as STYCAST 2651-40) -- 8799573245953 (Known as STYCAST 2651-40 ) LOCTITE STYCAST 2651-40 is a filled, general purpose, dielectric grade epoxy encapsulant. It is a lower viscosity version of STYCAST 2651. It has excellent adhesion...
LOCTITE STYCAST 2850FT (Known as STYCAST 2850FT) -- 8802585018369 (Known as STYCAST 2850FT ) LOCTITE STYCAST 2850FT is for high thermal conductivity and low outgassing, consider this encapsulant.
LOCTITE STYCAST NX17 (Known as STYCAST NX-17) -- 8802593472513 (Known as STYCAST NX-17 ) LOCTITE STYCAST NX17 is a two-component, heat cure, epoxy encapsulant with good adhesion to PPA.
LOCTITE STYCAST NX76 (Known as STYCAST NX-76) -- 8799572295681 (Known as STYCAST NX-76 ) LOCTITE STYCAST NX76 is an one-component epoxy encapsulant designed for SMD LED. Low CTE and good light dispersion by adding a small amount of filler.
LOCTITE ECCOBOND UV 9060F (Known as UV9060F (180g) Black) -- 8799579930625 (Known as UV9060F (180g) Black ) LOCTITE ECCOBOND UV9060F no flow, one component, UV cure encapsulant is designed for local circuit board protection. This product is fluorescent when viewed with...
Hysol STYCAST A312 -- 8802594324481 A one-component, unfilled solventless epoxy underfill encapsulant; fast curing and excellent chemical and heat resistance.
Hysol PC62 -- 8799550799873 Acrylic conformal coating non-toluene based, rapid drying, one-component for non-atomized spraying applications.
Hysol E1172A -- 8799536447489 An innovative non-reworkable capillary flow underfill. Hysol E1172A is a fast flow, snap cure underfill. It is a one-component epoxy chemistry that is non-anhydride curing for enhanced moisture resistance.
Hysol OTO149-3 -- 8802592260097 Clear glob top material with good adhesion to any substrate.
Hysol DC0114 -- 8799550013441 DC0114 epoxy underfill is suitable for high reliability applications due to its combination of properties. It can be applied to ceramic or organic substrates, including solder masks and polyimide.
Hysol 3329 -- 8802594848769 Developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol® UV dam encapsulants, such as Hysol 3323. This combination of...
Hysol US5532 -- 8799549587457 Encapsulant potting urethane.
Hysol STYCAST E1847 -- 8799551029249 Encapsulant potting, epoxy, one component.
Hysol STYCAST 2561/CAT 11 -- 8802595307521 Encapsulant potting, epoxy, two component, heat cure.
Hysol STYCAST 50500D -- 8799573770241 For protection of wire bonds consider this high purity material as either a dam or a glob top.
Hysol FP5500 -- 8799550144513 Heat cure material designed ACP process by thermal compression (RFID, Misc, Assembly).
TECHNOMELT AS 8998
TECHNOMELT PA 2384 -- 8807299842049
TECHNOMELT PA 341 -- 8802588327937
TECHNOMELT PA 5375
TECHNOMELT PA 6208 -- 8807692926977
TECHNOMELT PA 6208 Black -- 8799566462977
TECHNOMELT PA 633 -- 8802586427393
TECHNOMELT PA 6344 -- 8807299973121
TECHNOMELT PA 638 -- 8802586492929
TECHNOMELT PA 641 -- 8802586558465
TECHNOMELT PA 646 -- 8802586591233
TECHNOMELT PA 652 -- 8799377391617
TECHNOMELT PA 653
TECHNOMELT PA 657 -- 8799377358849
TECHNOMELT PA 658
TECHNOMELT PA 668 -- 8805825445889
TECHNOMELT PA 668 Clear
TECHNOMELT PA 673 (Known as Macromelt OM 673) -- 8802614804481
TECHNOMELT PA 678 -- 8802588065793
TECHNOMELT PA 682 -- 8799377424385
TECHNOMELT PA 687 -- 8807299710977
TECHNOMELT TC 50
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT...
TECHNOMELT PA 2692 Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT...
HYSOL E1159 -- 8799576064001 HYSOL E1159 is designed for high volume assembly operations that require and underfill that flows fast at room temperature and fully cures in one reflow oven cycle. It is specifically...
HYSOL EO1086 -- 8799551094785 HYSOL EO1086 is a one-component heat cure encapsulant designed for use in Chip on Board applications requiring excellent handling properties.
HYSOL ES1904 -- 8799578226689 HYSOL ES1904 is an opaque, medium-viscosity epoxy resin system recommended for small potting and laminating applications where excellent structural, mechanical and electrical properties are required. This two-part adhesive exhibits good...
HYSOL ES4512HF Non-Conductive Potting Compound -- 8799551356929 HYSOL ES4512HF is a two-part non-conductive, room temperature cure, halogen free potting compound. It is used in the consumer and industrial market.
Hysol FP4545FC -- 8799468158977 Hysol FP4545FC is a low viscosity version of FP4548FC
Hysol FP4583 -- 8799544049665 Hysol FP4583 is a high purity, FC underfill, high lead applications
Hysol FP6401 -- 8799544246273 Hysol FP6401 is a high purity, liquid flexible damming material.
HYSOL STYCAST 2651MM/CATALYST 23LV -- 8799575638017 HYSOL STYCAST 2651MM CATALYST 23LV is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining.
HYSOL STYCAST 2651MM/CATALYST 9 -- 8799575605249 HYSOL STYCAST 2651MM Catalyst 9 is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining.
HYSOL STYCAST 2850KT/CATALYST 9 -- 8802596749313 HYSOL STYCAST 2850KT with CATALYST 9 epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications...
HYSOL STYCAST 2850MT-Catalyst 24LV -- 8799577178113 HYSOL STYCAST 2850MT-Catalyst 24LV is a two component, electrically insulating general purpose encapsulant. It is recommended for encapsulation of components that require heat dissipation and thermal shock properties. It is...
HYSOL STYCAST E1070 -- 8802597076993 HYSOL STYCAST E1070 one component epoxy encapsulant is recommended for small mass potting applications, <50 grams, used in automotive electronic applications.
HYSOL STYCAST EFF15 syntactic foam powder -- 8802597339137 HYSOL STYCAST EFF15 is a one component epoxy based free flowing syntactic foam powder designed to infiltrate around densely packed components and fill voids in electronic modules. It exhibits low...
HYSOL UF3810 -- 8799575343105 HYSOL UF3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent...
Hysol US0146 -- 8799549161473 Hysol US0146 is an unfilled, two component clear amber polyurethane casting system formulated for potting. Characteristics of Hysol US0146 include low viscosity, low durometer, long pot life and hydrolytic stability.
HYSOL US1150 -- 8802596782081 HYSOL US1150 is an extended polybutadiene/MDI base, mineral filled, medium hardness, ambient cure urethane encapsulant/sealant. This material can be used for potting electronics or devices for protection against environmental hazards.
HYSOL ES1000 -- 8802586656769 HYSOL® ES1000™ is a two-component, long pot life casting system with excellent handling properties. This material has good thermal shock resistance and low exotherm, making it suitable for encapsulation of...
HYSOL ES1301 -- 8802586755073 HYSOL® ES1301™ is a silica filled epoxy casting system recommended for coils, transformers, and general pupose casting.
HYSOL ES1900 -- 8802589736961 HYSOL® ES1900™ is a two-component casting system with excellent handling properties. Transparent, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications where clarity and excellent structural, mechanical and...
HYSOL ES1901 -- 8802586820609 HYSOL® ES1901™ is a fast-setting, toughened, medium viscosity, industrial grade epoxy adhesive. Once mixed, the two-component epoxy cures at room temperature with low shrinkage and forms an ultra clear bondline...
HYSOL ES2202 -- 8802586787841 HYSOL® ES2202™ is an unfilled epoxy system with a high operating temperature and long pot life. Excellent chemical resistance, excellent performance under high moisture and humidity.
HYSOL ES2207 -- 8802586984449 HYSOL® ES2207™ is a filled, resilient, low viscosity, room temperature cure epoxy potting compound. It will meet UL 94 V-0 requirements in 1/8 inch thickness.
HYSOL ES2500 -- 8802587213825 HYSOL® ES2500™ is a resilient, low cost, fast gelling potting compound. Ideal for potting and encapsulating high volume parts. Meets UL 94 HB Flame Retardant to 1.5mm thickness.
Hysol FF2200 -- 8799375425537 Hysol® FluxFill™ FF2200 is a reflow encapsulant designed for the assembly and protection of flip chip semiconductor devices utilizing a single material approach. The material is formulated to provide the...
HYSOL FP5000 -- 8799535988737 Hysol® FP5000™ is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent protection of integrated circuit electrical joints...
LOCTITE 3118 -- 8799552602113 LOCTITE 3118 is a white image sensor adhesive.
LOCTITE 3119 -- 8799578783745 Loctite 3119™ cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive.
LOCTITE 3128 -- 8802600648705 LOCTITE 3128 is a black image sensor adhesive.
LOCTITE 3128NH -- 8799469469697 LOCTITE 3128NH edgebond material is designed to add reliability to chip scale packages and other electronic components. It is a low temperature cure adhesive ideal for use on heat sensitive...
LOCTITE 3129 -- 8802600681473 LOCTITE 3129 is an image sensor adhesive.
LOCTITE 3513 -- 8802601074689 LOCTITE 3513 is a single-component epoxy used as a reworkable underfill for CSP or BGA's.
LOCTITE 3517M -- 8799580160001 LOCTITE 3517M one component reworkable underfill is designed for use as a solder joint protection against mechanical stress in handheld electronic device applications. It the low halogen content version of...
LOCTITE 3563 -- 8799552634881 LOCTITE 3563 is a rapid curing fast flowing liquid epoxy for use as a capillary flow underfill for packaged IC's
LOCTITE 3593 -- 8799468290049 LOCTITE 3593 is a non-reworkable underfill for high mechanical reliability. Fast flow and snap cure for improved process time.
LOCTITE 3900 -- 8802599141377 LOCTITE 3900 is an air-dry coating designed for small production runs. It may be applied by spray, dip or brush procedures. Aerosol fast cure. Note: Not sold in Europe.
LOCTITE 5290 -- 8799373918209 Loctite 5290 is used for protecting printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is typically used in applications with an...
LOCTITE 5293 -- 8799403245569 LOCTITE 5293 is a repairable, solvent-free, medium viscosity, UV / moisture cure silicone suited to brush, dip and selective coating.
LOCTITE 5296 -- 8802598092801 LOCTITE 5296 is a heat cure silicone that can be applied with brush, dip or spray. High reliability automotive. Clear.
LOCTITE ECCOBOND COB UV8801 -- 8799579635713 LOCTITE ECCOBOND COB UV8801 one component epoxy encapsulant is developed to meet high temperature thermal cycling specifications. It cures to form a hard translucent coating when exposed to UV light...
LOCTITE ECCOBOND DP 1002UV -- 8802608218113 LOCTITE ECCOBOND DP 1002UV one component material is designed for use as a wire and tab bond lead encapsulant, damming or edgebond material. It can be applied by using non-contact...
LOCTITE ECCOBOND DP 1003UV -- 8802608316417 LOCTITE ECCOBOND DP 1003UV one component material is designed for use as a wire and tab bond lead encapsulant, and gap fillng adhesive. It can be applied by using non-contact...
LOCTITE ECCOBOND DS 3318LV -- 8799551488001 LOCTITE ECCOBOND DS 3318LV is a fast, UV curable material specially formulated for use in applications requiring lower energy cure. It is designed for protection of COG (Chip-on-glass) in LCD...
LOCTITE ECCOBOND EN 3707F -- 8802610905089 LOCTITE ECCOBOND EN 3707F is a one component, no-flow encapsulant designed for local circuit board protection. It cures in seconds when exposed to the appropriate intensity of UV light. It...
LOCTITE ECCOBOND EO1072 -- 8799371919361 LOCTITE ECCOBOND EO1072 is a one component high performance epoxy encapsulant with high Tg and low extractable ionics.
LOCTITE ECCOBOND UF 2800A reworkable underfill -- 8802603663361 LOCTITE ECCOBOND UF 2800A reworkable underfill is designed to provide protection for solder joints against induced stress, increasing both drop test and cycle performance of the device. This material is...
LOCTITE ECCOBOND UF 2800B reworkable underfill -- 8802603728897 LOCTITE ECCOBOND UF 2800B reworkable underfill is designed to provide protection for solder joints against induced stress, increasing both drop test and cycle performance of the device. This material is...
LOCTITE HYSOL EE0182 EB0625 -- 8799579570177 LOCTITE HYSOL EE0182 EB6025 is a two part, white epoxy casting system having low abrasion and rapid gel features.
LOCTITE STYCAST ES 4322FC epoxy encapsulant -- 8802609233921 LOCTITE STYCAST ES 4322FC liquid epoxy encapsulant is for protection of semiconductor devices. It is a high flow material which requires a cavity flow control barrier to prevent excessive flow.
LOCTITE UV8800M -- 8802595274753 LOCTITE UV8800M is a UV cure encapsulant for smart card and other COB applications.
Hysol EO1088 -- 8799542214657 One component encapsulants potting epoxy.
Hysol EE1068/HD3404 -- 8799436341249 Potting encapsulant-epoxy two component room temperature cure.
Hysol STYCAST 2850FT"/CAT 11 -- 8799550930945 STYCAST 2850FT/Catalyst 11 is recommended for encapsulation of components that require heat dissipation and thermal shock properties. Passes NASA outgassing standards.
Hysol STYCAST 2850FT/CAT 23LV -- 8799550963713 STYCAST 2850FT/Catalyst 23LV is recommended for encapsulation of components that require heat dissipation and thermal shock properties.
STYCAST EO2000HV -- 8799551455233 STYCAST EO2000HV one-component, oxide filled epoxy adhesive is designed to bond heat resistant plastics in applications requiring heat and chemical resistance. It is especially suited for use in harsh environments...
Hysol STYCAST U2500 -- 8799570460673 Stycast U2500 is an encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings.
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8660S
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8880S
With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting...