Henkel Corporation - Electronics Datasheets for Encapsulants and Potting Compounds

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Encapsulants and Potting Compounds: Learn more

Product Name Notes
(Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant ) LOCTITE ECCOBOND 933 one component epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimized...
(Known as Ablestik ABLEFILL UF8806G ) LOCTITE ECCOBOND UF 8806G is moisture resistant. For die sizes <25mm. Ultra low alpha emissions.
(Known as ABLESTIK ABLEFILL UF8807 ) One component, high flow liquid underfill encapsulant with superior moisture resistance.
(Known as ABLESTIK ABLEFILL UF8826 ) LOCTITE ECCOBOND UF 8826 is for eutectic high lead low k applications. Medium modulus, low CTE.
(Known as CAT 15-1 CLEARJ ) LOCTITE CAT 15-1 CLEARJ is designed for use with potting and encapsulating resins.
(Known as CAT 15-1 LV ) LOCTITE CAT 15-1 LV is designed for use with potting and encapsulating resins.
(Known as E&C STYCAST 5952 A/B thermally conductive silicone encapsulant ) LOCTITE STYCAST 5952 RD PTA is a filled, addition cured, silicone encapsulant. It features good thermal conductivity, excellent electrical...
(Known as ECCOBOND 276 1kg ) LOCTITE STYCAST 276 epoxy is formulated not to sag or run during cure when applied on loose fitting parts set on vertical or overhead...
(Known as ECCOBOND DP1000 10cc (10g) Opt ) LOCTITE ECCOBOND DP1000 wirebond encapsulant features good adhesion to low energy plastic and metal substrates. It also has chemical and crack resistance.
(Known as ECCOBOND UF 3130 underfill ) LOCTITE ECCOBOND UF 3130 is designed for use in heat sensitive optoelectronic components and other microelectronic devices.
(Known as Eccobond UV9001 ) LOCTITE ECCOBOND UV 9001 is a dual cure sealant and adhesive that can be syringe dispensed. It is a UV liqht and heat cure material...
(Known as HYSOL 3508NH ) LOCTITE 3508NH is a one-component, reflow curable, halogen free epoxy designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. It can...
(Known as Hysol CB0260 ) LOCTITE ECCOBOND CB0260 is a high adhesion version of FP4450 for temperatures up to 260°C after being exposed to L2 JEDEC preconditioning.
(Known as Hysol CB0260-1 ) LOCTITE ECCOBOND CB0260-1 is a high adhesion version of FP4450 for temperatures up to 260°C after being exposed to L2 JEDEC preconditioning.
(Known as Hysol CB064/FP4653 ) LOCTITE ECCOBOND CB064 is high purity, low stress, liquid, self-leveling encapsulant material. This material is for cavity fill or dam and fill applications. The unique...
(Known as Hysol E1216 ) An innovative, non-reworkable, capillary flow underfill for CSP, BGA or flip chip devices. Designed for high volume assembly operations that require an underfill that flows...
(Known as HYSOL E1216M ) LOCTITE E 1216M is a snap curable capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that cures...
(Known as Hysol E1926 ) LOCTITE ECCOBOND E 1926 is an non-reworkable, wafer-level underfill that provides excellent thermal reliability and cures relatively fast compared to standard first level underfills.
(Known as Hysol ECCOBOND 104 ) A two component epoxy adhesive with outstanding physical and dielectric properties and service temperatures up to 230°C.
(Known as Hysol ECCOBOND A312-20 ) LOCTITE ABLESTIK A 312-20 is a one component, encapsulants potting epoxy.
(Known as Hysol ECCOBOND UV9085 ) Designed as a faster curing, high thixotropic adhesive that gives good flow control and adhesion for a thick bondline.
(Known as Hysol ECCOCOAT PC355-1 ) LOCTITE STYCAST PC 355-1 is a lead-free, transparent, one-component protective varnish system that is dry to the touch in under 30 minutes.
(Known as HYSOL ECCOCOAT PC355-1FL conformal coating ) LOCTITE STYCAST PC 355-1FL flexible thermoplastic varnish is formulated to protect and insulate printed wiring boards both on the component and the...
(Known as Hysol ECCOCOAT SC3613 ) Heat curable, optically clear, high purity, one-component coating to be applied by brush, dip or flow coating.
(Known as Hysol ECCOCOAT U7510-1 ) LOCTITE STYCAST U 7510-1 is a lead-free, transparent, one component protective varnish system that is dry to the touch in under 30 minutes.
(Known as Hysol ECCOCOAT UV7993 ) Solvent-free, one component dual cure conformal coating.
(Known as Hysol EE1068 ) LOCTITE STYCAST EE 1068 is a general purpose flame retardant casting compound formulated to have a glass transition temperature above 100°C.
(Known as HYSOL EE1117-HD3561 epoxy system ) LOCTITE STYCAST HD 3561 epoxy system is designed for use as a sealant or for potting electronic devices. It is specially formulated for...
(Known as HYSOL EO0206 ) LOCTITE ECCOBOND EO 0206 one-component epoxy is designed for use on electronic devices. KEY BENEFITS Low Halogen content Non-Sag
(Known as Hysol EO1016 ) LOCTITE ECCOBOND EO1016 is a UL94V-0 encapsulant for Smartcards and watch IC's. Nonabrasive filler allows for grinding if necessary.
(Known as Hysol EO1058 ) LOCTITE STYCAST EO 10587 is a single component epoxy system that cures at 125°C. Hysol EO1058 provides excellent environmental and thermal protection to encapsulated parts.
(Known as Hysol EO1060 ) LOCTITE ECCOBOND EO1060 is a low glob formulation for lower CTE and lower ionic than EO1016 content for more demanding applications.
(Known as Hysol EO1061 ) LOCTITE ECCOBOND EO1061 is a medium glob formulation for lower CTE and lower ionic than EO1016 content for more demanding applications.
(Known as Hysol EO1062 ) LOCTITE ECCOBOND EO1062 is a high glob version of EO1061.
(Known as Hysol EO1080 ) LOCTITE ECCOBOND EO1080 is a low CTE version of EO1016.
(Known as HYSOL EO7021 ) LOCTITE EO7021 is an encapsulant for use in smart card chip module applications. It is also suitable for die attach automated reel-to-reel processing.
(Known as Hysol EO7038 ) LOCTITE EO7038 is a one-component epoxy potting system, formulated to protect sensors used in harsh environments, such as automotive applications.
(Known as HYSOL EO7039 ) LOCTITE ECCOBOND EO7039 encapsulant is designed for attachment of integrated circuits and components to advanced flexible substrates. It is formulated to produce a void-free bond...
(Known as Hysol ES1002 ) Black, low cost, flexible, capable of UL94V-0, non-abrasive filled, long pot life.
(Known as HYSOL ES1004 ) LOCTITE STYCAST ES 1004 DQ is capable of UL94V-0, stable to 155°C.
(Known as Hysol ES1902 ) LOCTITE STYCAST ES 1902 DQ is a clear, transparent, very fast UV gel with thermal co-cure, excellent dimensional stability and low viscosity; easy to handle.
(Known as Hysol FF2300 ) LOCTITE ECCOBOND FF 2300 is a no-flow underfill for eutectic and lead-free applications.
(Known as Hysol FP0114 ) LOCTITE ECCOBOND FP0114 is a low viscosity, fast flow, epoxy based material designed for capillary underfill on flip chip applications. It has excellent wettability and...
(Known as Hysol FP4323 ) LOCTITE ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications.
(Known as Hysol FP4410HF )
(Known as Hysol FP4450 ) LOCTITE ECCOBOND FP4450 is an industry standard fill material for fill or cavity down BGAs.
(Known as Hysol FP4450HF ) LOCTITE ECCOBOND FP4450HF is a high flow version of FP4450LV using synthetic filler for use in fine wire and low alpha applications.
(Known as Hysol FP4450LV ) LOCTITE ECCOBOND FP4450LV is a low viscosity version of FP4450 incorporating cleaner resins.
(Known as Hysol FP4451 ) LOCTITE ECCOBOND FP4451 is an industry standard damming material for BGAs.
(Known as Hysol FP4451TD ) LOCTITE ECCOBOND FP4451TD is a tall dam version of FP4451 for applications requiring a taller, narrower dam. Ionically cleaner also.
(Known as Hysol FP4460 ) LOCTITE ECCOBOND FP4460 is a high purity, low stress glob top semiconductor encapsulant with improved moisture resistance and working life compared to earlier generation products.
(Known as Hysol FP4470 ) LOCTITE ECCOBOND FP4470 is a high adhesion version of FP4450 for 260°C L3 JEDEC performance.
(Known as Hysol FP4526 ) LOCTITE ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications.
(Known as Hysol FP4530 ) LOCTITE ECCOBOND FP4530 is a fast flow encapsulant material for flip chip underfill applications with a gap of 1 mil. The material is designed to...
(Known as Hysol FP4549 ) LOCTITE ECCOBOND FP4549 is used for fine-pitch flip chip applications, fast flowing, low stress underfill.
(Known as Hysol FP4654 ) LOCTITE ECCOBOND FP4654 is a low viscosity, high adhesion, version of FP4653 for large array packages.
(Known as Hysol FP5001 ) LOCTITE ECCOBOND FP5001 is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent...
(Known as Hysol FP5201 ) LOCTITE ECCOBOND FP 5201 is designed for thermal compression bonding processes in flip chip to laminate assembly. Laminate Packages CSP, SCSP, SIP
(Known as Hysol FP5300 ) LOCTITE ECCOBOND FP5300 has excellent adhesion strength to 2- and 3-layer flex and Iaminates. Low temp cure ACP. For use on RFID, Misc, Assembly.
(Known as HYSOL LA3032-78 ) LOCTITE ECCOBOND LA 3032-78 encapsulant is designed for high throughput assembly operations. It is formulated to withstand high heat distortion temperatures and bonds well to...
(Known as Hysol PC18M ) LOCTITE STYCAST PC 18M is a flexible solvent-based, one-component coating. Provides good thermal shock resistance.
(Known as Hysol PC28STD ) LOCTITE STYCAST PC 28-STD is a convenient aerosol packaging, oxygen-cure, printed circuit board coating system.
(Known as Hysol PC29M ) LOCTITE STYCAST PC 29M PTB is a thin-film printed circuit board coating with good toughness and high flexibility. Note: Not sold in Europe.
(Known as Hysol PC40-UM ) LOCTITE STYCAST PC 40-UM is a solvent-free, low-viscosity, rapid gel, UV-moisture cure one component conformal coating.
(Known as HYSOL PC40-UMF ) LOCTITE STYCAST PC 40-UMF conformal coating is specifically formulated to rapidly gel and immobolise when exposed to UV light and then fully cure when exposed...
(Known as Hysol SB-50 ) LOCTITE ECCOBOND SB 50 underfill material is ideal for high volume assembly processes. As the product does not flow under the solder array, it is...
(Known as Hysol STYCAST 1090BLK ) LOCTITE STYCAST 1090 BK is designed for encapsulation and potting of electronic assemblies that require lower weight such as aerospace applications.
(Known as Hysol STYCAST 2651 ) Two component, low viscosity, general purpose epoxy encapsulant.
(Known as HYSOL STYCAST 2651-40FR/Catalyst 11 ) LOCTITE CAT 11 epoxy encapsulant is designed for general potting applications. It is the flame retardant version of STYCAST 2651-40. It meets UL94V0...
(Known as HYSOL STYCAST 2651-40FR/Catalyst 24LV ) LOCTITE CAT 24LV is a two component encapsulant is designed for general potting applications. It is the flame retardant version of STYCAST 2651-40.
(Known as HYSOL STYCAST 2651-40FR/Catalyst 9 ) LOCTITE CAT 9 is a two component epoxy encapsulant designed for general potting applications. It is a flame retardant version of STYCAST 2651-40.
(Known as HYSOL STYCAST 2651MM ) LOCTITE STYCAST 2651MM is a filled, low viscosity, general purpose, epoxy encapsulant. It contains a soft filler that both reduces abrasion in meter/mix equipment...
(Known as HYSOL STYCAST 2762 Catalyst 17M-1 ) LOCTITE STYCAST 2762 is a two component epoxy encapsulant designed for electronic components exposed to harsh environments. This material is also ideal...
(Known as HYSOL STYCAST 2762-Catalyst 14 ) LOCTITE CAT 14 is a two component high thermal conductivity epoxy encapsulant for electronic components exposed to harsh environments. This material is also...
(Known as HYSOL STYCAST 2850KT/CATALYST 24LV ) LOCTITE STYCAST 2850KT is a thermally conductive, electrically insulatiive epoxy encapsulant designed for heat sink replacement in non-integrated electrical components and assemblies. it...
(Known as HYSOL STYCAST 2850MT-Catalyst 27-1 ) LOCTITE CAT 27-1 is a two component, electrically insulating general purpose encapsulant. It is recommended for encapsulation of components that require heat dissipation...
(Known as HYSOL STYCAST 2850MT-Catalyst 9 ) LOCTITE STYCAST 2850 MT is a two component, electrically insulating general purpose encapsulant. It is recommended for encapsulation of components that require heat...
(Known as HYSOL STYCAST 3050 Catalyst 11 ) LOCTITE STYCAST 3050 is a two component general purpose encapsulant desgined for potting and encapsulation applications with very small physical spacing between...
(Known as Hysol STYCAST 50500-1 ) LOCTITE ECCOBOND 50500-1 is for protection of wire-bonded ICS, consider this flowable material for a fill.
(Known as Hysol STYCAST E2534FR ) LOCTITE STYCAST E 2534 FR epoxy potting compound complies with recent demands on environmentally friendly products and does not contain brominated flame retardants.
(Known as HYSOL STYCAST U2535 Polyurethane Encapsulant ) LOCTITE STYCAST U 2535 PTB two component flexible polyurethane encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation...
(Known as HYSOL UF3037 ) LOCTITE ECCOBOND UF 3037 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at low temperatures to minimize stress to other...
(Known as HYSOL UF3537 ) LOCTITE ECCOBOND UF 3537 underfill is designed to improve board level assembly reliability.
(Known as HYSOL UF3800 reworkable underfill ) A high reliability, good reworkability, room temperature dispensable underfill compatible with most common solder pastes.
(Known as HYSOL UF3808 ) LOCTITE ECCOBOND UF 3808 is a capillary underfill designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material...
(Known as Hysol UF8830 ) LOCTITE ECCOBOND UF 8830 is a liquid epoxy underfill encapsulant designed for flip chip BGA applications requiring improved crack/fracture resistance and low warpage.
(Known as Hysol US0154 ) Encapsulant potting urethane.
(Known as HYSOL US1151 ) LOCTITE STYCAST US 1151 is a low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties. Introduction of this material on a...
(Known as HYSOL US1750 ) LOCTITE STYCAST US 1750 elastomeric polyurethane, is a waterwhite, clear, medical grade, fast gel potting material. It is ideal for blood heat exchanger, dialyzer and...
(Known as Hysol US2050 ) LOCTITE STYCAST US 2050 is a quick set, optically clear polyurethane compound that exhibits excellent ultraviolet resistance. The excellent electrical properties also suggest its use...
(Known as Hysol US2350 ) LOCTITE STYCAST US 2350 is a flexible, flame retardant, mineral filled, polyurethane compound. This potting compound has long pot life and is low viscosity so...
(Known as HYSOL UV9060 ) LOCTITE ECCOBOND UV 9060 is a no-flow UV/moisture cure encapsulant designed for local circuit board protection. It is fluorescent when viewed with ultraviolet (black) light.
(Known as Hysol XE1218 ) LOCTITE ECCOBOND XE 1218 is a reworkable, snap cure, void-free, fast flowing underfill that also provides excellent adhesion and reliability benefits.
(Known as HYSOL XUV 9086 ) LOCTITE ECCOBOND XUV 9086 is a one component UV cure encapsulant used in ink jet applications. It is formulated to dispense easily without stringing.
(Known as Hysol XUV-9052 ) LOCTITE ECCOBOND UV 9052 is a one component, dual cure (UV & moisture) adhesive designed as a lead encapsulant used in ink jet applications.
(Known as LOCTITE 3323UV ) LOCTITE 3323 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV...
(Known as LOCTITE 3327UV ) LOCTITE 3327 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV...
(Known as LOCTITE ECCOBOND UF 8840 ) LOCTITE ECCOBOND UF 8840 liquid epoxy underfill encapsulant is designed for flip chip BGA applications requiring improved crack/fracture resistance and low warpage. It...
(Known as LOCTITE US5533 flame retardant potting compound ) LOCTITE STYCAST US 5533 PTB is a two-component, flexible, flame retardant potting compound. It is formulated with low odor designed to...
(Known as SC8001 5Gal ) LOCTITE STYCAST SC 8001 one component B-stageable epoxy coating is designed to provide electrical insulation between conductive layers in thin-film photovoltaics.
(Known as STYCAST 1090SI ) LOCTITE STYCAST 1090SI encapsulant is recommended for applications where high compressive stress is applied to encapsulated circuitry - as in deep ocean work. This product...
(Known as STYCAST 2017M4/A 5kg ) Epoxy encapsulant developed for lamp type, blue LED.
(Known as STYCAST 2651-40 ) LOCTITE STYCAST 2651-40 is a filled, general purpose, dielectric grade epoxy encapsulant. It is a lower viscosity version of STYCAST 2651. It has excellent adhesion...
(Known as STYCAST 2850FT ) LOCTITE STYCAST 2850FT is for high thermal conductivity and low outgassing, consider this encapsulant.
(Known as STYCAST NX-17 ) LOCTITE STYCAST NX17 is a two-component, heat cure, epoxy encapsulant with good adhesion to PPA.
(Known as STYCAST NX-76 ) LOCTITE STYCAST NX76 is an one-component epoxy encapsulant designed for SMD LED. Low CTE and good light dispersion by adding a small amount of filler.
(Known as UV9060F (180g) Black ) LOCTITE ECCOBOND UV9060F no flow, one component, UV cure encapsulant is designed for local circuit board protection. This product is fluorescent when viewed with...
A one-component, unfilled solventless epoxy underfill encapsulant; fast curing and excellent chemical and heat resistance.
Acrylic conformal coating non-toluene based, rapid drying, one-component for non-atomized spraying applications.
An innovative non-reworkable capillary flow underfill. Hysol E1172A is a fast flow, snap cure underfill. It is a one-component epoxy chemistry that is non-anhydride curing for enhanced moisture resistance.
Clear glob top material with good adhesion to any substrate.
DC0114 epoxy underfill is suitable for high reliability applications due to its combination of properties. It can be applied to ceramic or organic substrates, including solder masks and polyimide.
Developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol® UV dam encapsulants, such as Hysol 3323. This combination of...
Encapsulant potting urethane.
Encapsulant potting, epoxy, one component.
Encapsulant potting, epoxy, two component, heat cure.
For protection of wire bonds consider this high purity material as either a dam or a glob top.
Heat cure material designed ACP process by thermal compression (RFID, Misc, Assembly).
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT...
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT...
HYSOL E1159 is designed for high volume assembly operations that require and underfill that flows fast at room temperature and fully cures in one reflow oven cycle. It is specifically...
HYSOL EO1086 is a one-component heat cure encapsulant designed for use in Chip on Board applications requiring excellent handling properties.
HYSOL ES1904 is an opaque, medium-viscosity epoxy resin system recommended for small potting and laminating applications where excellent structural, mechanical and electrical properties are required. This two-part adhesive exhibits good...
HYSOL ES4512HF is a two-part non-conductive, room temperature cure, halogen free potting compound. It is used in the consumer and industrial market.
Hysol FP4545FC is a low viscosity version of FP4548FC
Hysol FP4583 is a high purity, FC underfill, high lead applications
Hysol FP6401 is a high purity, liquid flexible damming material.
HYSOL STYCAST 2651MM CATALYST 23LV is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining.
HYSOL STYCAST 2651MM Catalyst 9 is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining.
HYSOL STYCAST 2850KT with CATALYST 9 epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications...
HYSOL STYCAST 2850MT-Catalyst 24LV is a two component, electrically insulating general purpose encapsulant. It is recommended for encapsulation of components that require heat dissipation and thermal shock properties. It is...
HYSOL STYCAST E1070 one component epoxy encapsulant is recommended for small mass potting applications, <50 grams, used in automotive electronic applications.
HYSOL STYCAST EFF15 is a one component epoxy based free flowing syntactic foam powder designed to infiltrate around densely packed components and fill voids in electronic modules. It exhibits low...
HYSOL UF3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent...
Hysol US0146 is an unfilled, two component clear amber polyurethane casting system formulated for potting. Characteristics of Hysol US0146 include low viscosity, low durometer, long pot life and hydrolytic stability.
HYSOL US1150 is an extended polybutadiene/MDI base, mineral filled, medium hardness, ambient cure urethane encapsulant/sealant. This material can be used for potting electronics or devices for protection against environmental hazards.
HYSOL® ES1000™ is a two-component, long pot life casting system with excellent handling properties. This material has good thermal shock resistance and low exotherm, making it suitable for encapsulation of...
HYSOL® ES1301™ is a silica filled epoxy casting system recommended for coils, transformers, and general pupose casting.
HYSOL® ES1900™ is a two-component casting system with excellent handling properties. Transparent, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications where clarity and excellent structural, mechanical and...
HYSOL® ES1901™ is a fast-setting, toughened, medium viscosity, industrial grade epoxy adhesive. Once mixed, the two-component epoxy cures at room temperature with low shrinkage and forms an ultra clear bondline...
HYSOL® ES2202™ is an unfilled epoxy system with a high operating temperature and long pot life. Excellent chemical resistance, excellent performance under high moisture and humidity.
HYSOL® ES2207™ is a filled, resilient, low viscosity, room temperature cure epoxy potting compound. It will meet UL 94 V-0 requirements in 1/8 inch thickness.
HYSOL® ES2500™ is a resilient, low cost, fast gelling potting compound. Ideal for potting and encapsulating high volume parts. Meets UL 94 HB Flame Retardant to 1.5mm thickness.
Hysol® FluxFill™ FF2200 is a reflow encapsulant designed for the assembly and protection of flip chip semiconductor devices utilizing a single material approach. The material is formulated to provide the...
Hysol® FP5000™ is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent protection of integrated circuit electrical joints...
LOCTITE 3118 is a white image sensor adhesive.
Loctite 3119™ cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive.
LOCTITE 3128 is a black image sensor adhesive.
LOCTITE 3128NH edgebond material is designed to add reliability to chip scale packages and other electronic components. It is a low temperature cure adhesive ideal for use on heat sensitive...
LOCTITE 3129 is an image sensor adhesive.
LOCTITE 3513 is a single-component epoxy used as a reworkable underfill for CSP or BGA's.
LOCTITE 3517M one component reworkable underfill is designed for use as a solder joint protection against mechanical stress in handheld electronic device applications. It the low halogen content version of...
LOCTITE 3563 is a rapid curing fast flowing liquid epoxy for use as a capillary flow underfill for packaged IC's
LOCTITE 3593 is a non-reworkable underfill for high mechanical reliability. Fast flow and snap cure for improved process time.
LOCTITE 3900 is an air-dry coating designed for small production runs. It may be applied by spray, dip or brush procedures. Aerosol fast cure. Note: Not sold in Europe.
Loctite 5290 is used for protecting printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is typically used in applications with an...
LOCTITE 5293 is a repairable, solvent-free, medium viscosity, UV / moisture cure silicone suited to brush, dip and selective coating.
LOCTITE 5296 is a heat cure silicone that can be applied with brush, dip or spray. High reliability automotive. Clear.
LOCTITE ECCOBOND COB UV8801 one component epoxy encapsulant is developed to meet high temperature thermal cycling specifications. It cures to form a hard translucent coating when exposed to UV light...
LOCTITE ECCOBOND DP 1002UV one component material is designed for use as a wire and tab bond lead encapsulant, damming or edgebond material. It can be applied by using non-contact...
LOCTITE ECCOBOND DP 1003UV one component material is designed for use as a wire and tab bond lead encapsulant, and gap fillng adhesive. It can be applied by using non-contact...
LOCTITE ECCOBOND DS 3318LV is a fast, UV curable material specially formulated for use in applications requiring lower energy cure. It is designed for protection of COG (Chip-on-glass) in LCD...
LOCTITE ECCOBOND EN 3707F is a one component, no-flow encapsulant designed for local circuit board protection. It cures in seconds when exposed to the appropriate intensity of UV light. It...
LOCTITE ECCOBOND EO1072 is a one component high performance epoxy encapsulant with high Tg and low extractable ionics.
LOCTITE ECCOBOND UF 2800A reworkable underfill is designed to provide protection for solder joints against induced stress, increasing both drop test and cycle performance of the device. This material is...
LOCTITE ECCOBOND UF 2800B reworkable underfill is designed to provide protection for solder joints against induced stress, increasing both drop test and cycle performance of the device. This material is...
LOCTITE HYSOL EE0182 EB6025 is a two part, white epoxy casting system having low abrasion and rapid gel features.
LOCTITE STYCAST ES 4322FC liquid epoxy encapsulant is for protection of semiconductor devices. It is a high flow material which requires a cavity flow control barrier to prevent excessive flow.
LOCTITE UV8800M is a UV cure encapsulant for smart card and other COB applications.
One component encapsulants potting epoxy.
Potting encapsulant-epoxy two component room temperature cure.
STYCAST 2850FT/Catalyst 11 is recommended for encapsulation of components that require heat dissipation and thermal shock properties. Passes NASA outgassing standards.
STYCAST 2850FT/Catalyst 23LV is recommended for encapsulation of components that require heat dissipation and thermal shock properties.
STYCAST EO2000HV one-component, oxide filled epoxy adhesive is designed to bond heat resistant plastics in applications requiring heat and chemical resistance. It is especially suited for use in harsh environments...
Stycast U2500 is an encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings.
With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting...