Hysol® FP5000™ is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent protection of integrated circuit electrical joints and provides resistance to thermal cycling. The product conforms with JEDEC Level 1, 260°C requirement.
| Henkel Corporation - Electronics | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | 8799535988737 |
| Product Name | HYSOL FP5000 |
| Industry | Electronics |
