Henkel Corporation - Electronics Datasheets for Conductive Compounds

Conductive compounds provide an electrically and/or thermally conductive path between components.
Conductive Compounds: Learn more

Product Name Notes
LOCTITE ABLESTIK 2300 (Known as Ablebond 2300) -- 8799471697921 (Known as Ablebond 2300 ) LOCTITE ABLESTIK 2300 is an ultra low moisture absorption, low stress adhesive.
LOCTITE ABLESTIK 3230 (Known as Ablebond 3230) -- 8802575319041 (Known as Ablebond 3230 ) LOCTITE ABLESTIK 3230 is an electrically conductive die attach adhesive is designed for high reliability package applications. It can be used in a variety of...
LOCTITE ABLESTIK 3290 (Known as Ablebond 3290) -- 8799580356609 (Known as Ablebond 3290 ) LOCTITE ABLESTIK 3290 is a snap curable, electrically conductive die attach adhesive designed for lead-free applications where high reliability is a key requirement.
LOCTITE ABLESTIK 8175Q (Known as ABLEBOND 8175Q) -- 8802605793281 (Known as ABLEBOND 8175Q ) LOCTITE ABLESTIK 8175Q is an electrically conductive, paste adhesive designed for solder replacement in microelectronic interconnect applications
LOCTITE ABLESTIK 8290 (Known as Ablebond 8290) -- 8799554273281 (Known as Ablebond 8290 ) LOCTITE ABLESTIK 8290 is a low stress die attach adhesive suitable for die size <200 mil.
LOCTITE ABLESTIK 8352L (Known as Ablebond 8352L) -- 8802605039617 (Known as Ablebond 8352L ) LOCTITE ABLESTIK 8352L is a high electrical and thermal conductivity die attach adhesive.
LOCTITE ABLESTIK 8384 (Known as Ablebond 8384) -- 8802575089665 (Known as Ablebond 8384 ) LOCTITE ABLESTIK 8384 is a die attach adhesive is designed for smart card applications.
LOCTITE ABLESTIK 8387B (Known as Ablebond 8387B) -- 8802605891585 (Known as Ablebond 8387B ) LOCTITE ABLESTIK 8387B is a non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast...
LOCTITE ABLESTIK 84-1LMISR3 (Known as Ablebond 84-1LMISR3) -- 8799556272129 (Known as Ablebond 84-1LMISR3 ) LOCTITE ABLESTIK 84-1LMISR3 electrically conductive adhesive is designed for die attach applications. It is a low viscosity and higher thixotropic index version of ABLEBOND 84-1LMIS.
LOCTITE ABLESTIK 84-1LMISR4 (Known as Ablebond 84-1LMISR4) -- 8799474286593 (Known as Ablebond 84-1LMISR4 ) LOCTITE ABLESTIK 84-1LMISR4 is an industry standard die attach adhesive.
LOCTITE ABLESTIK 84-1LMIT1 (Known as Ablebond 84-1LMIT1) -- 8799473205249 (Known as Ablebond 84-1LMIT1 ) LOCTITE ABLESTIK 84-1LMIT1 is a fast, low temperature cure electrically & thermally conductive adhesive. Ideally suited for low stress die & component attaching, this adhesive...
LOCTITE ABLESTIK 8700K (Known as Ablebond 8700K (5.4g)) -- 8799475073025 (Known as Ablebond 8700K (5.4g) ) LOCTITE ABLESTIK 8700K is a high thermal conductivity, low temperature curing, microelectronics grade adhesive.
LOCTITE ABLESTIK 965-1L (Known as Ablebond 965-1L) -- 8799556501505 (Known as Ablebond 965-1L ) LOCTITE ABLESTIK 965-1L is an electrically conductive epoxy die attach designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion. It is...
LOCTITE ABLESTIK 967-1 (Known as Ablebond 967-1) -- 8799475531777 (Known as Ablebond 967-1 ) LOCTITE ABLESTIK 967-1 adhesive is designed for applications which require lower-than-normal cure temperatures. It is ideal for application by automatic dispenser, screen printing or hand...
LOCTITE ABLESTIK 969-1 (Known as Ablebond 969-1) -- 8799580389377 (Known as Ablebond 969-1 ) LOCTITE ABLESTIK 969-1 is an electrically conductive preimidized adhesive designed for semiconductor die attach. It is not recommended for use in hermetic packages.
LOCTITE ABLESTIK 8008MD (Known as Ablestik 8008MD) -- 8799474089985 (Known as Ablestik 8008MD ) LOCTITE ABLESTIK 8008MD is an adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing...
LOCTITE ABLESTIK 84-1LMISR4-S25 (Known as ABLESTIK 84-1LMISR4-S25) -- 8799581732865 (Known as ABLESTIK 84-1LMISR4-S25 ) LOCTITE ABLESTIK 84-1LMISR4-S25 is an electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. This material is...
LOCTITE ABLESTIK 16-1 (Known as ABLESTIK ABLEBOND 16-1) -- 8799555846145 (Known as ABLESTIK ABLEBOND 16-1 ) LOCTITE ABLESTIK 16-1 is a two-component, electrically conductive epoxy adhesive designed for general purpose applications. It cures at room temperature while providing a reasonable...
LOCTITE ABLESTIK 2000 (Known as ABLESTIK ABLEBOND 2000) -- 8799581536257 (Known as ABLESTIK ABLEBOND 2000 ) LOCTITE ABLESTIK 2000 electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the...
LOCTITE ABLESTIK 2000B (Known as Ablestik ABLEBOND 2000B) -- 8799554568193 (Known as Ablestik ABLEBOND 2000B ) LOCTITE ABLESTIK 2000B is an electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to...
LOCTITE ABLESTIK 2030SC (Known as ABLESTIK ABLEBOND 2030SC) -- 8802575220737 (Known as ABLESTIK ABLEBOND 2030SC ) Die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage...
LOCTITE ABLESTIK 2100A (Known as Ablestik ABLEBOND 2100A) -- 8799554207745 (Known as Ablestik ABLEBOND 2100A ) LOCTITE ABLESTIK 2100A is an ultra low moisture absorption adhesive with high hot/wet die shear strength. For lead-free packaging.
LOCTITE ABLESTIK 2310 (Known as ABLESTIK ABLEBOND 2310) -- 8802610216961 (Known as ABLESTIK ABLEBOND 2310 ) LOCTITE ABLESTIK 2310 Is a conductive die attach adhesive designed for use on a wide range of BGA die sizes. Its unique conductive filler...
LOCTITE ABLESTIK 3230A (Known as ABLESTIK ABLEBOND 3230A) -- 8799580651521 (Known as ABLESTIK ABLEBOND 3230A ) LOCTITE ABLESTIK 3230A adhesive die attach is designed for semiconductor packaging applications where high electrical conductivity is not required. It can be used in...
LOCTITE ABLESTIK 8200C (Known as ABLESTIK ABLEBOND 8200C) -- 8799473238017 (Known as ABLESTIK ABLEBOND 8200C ) LOCTITE ABLESTIK 8200C is an electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This...
LOCTITE ABLESTIK 8200TI (Known as Ablestik ABLEBOND 8200TI) -- 8799473074177 (Known as Ablestik ABLEBOND 8200TI ) LOCTITE ABLESTIK 8200TI is LOCTITE ABLESTIK 8200C with higher thermal conductivity and optimized adhesion on NiPdAu leadframe.
LOCTITE ABLESTIK 8340-O (Known as ABLESTIK ABLEBOND 8340-O) -- 8799555977217 (Known as ABLESTIK ABLEBOND 8340-O ) LOCTITE ABLESTIK 8340-O is an electrically conductive die attach adhesive designed for high reliability lead frame packaging applications.
LOCTITE ABLESTIK 8350M (Known as ABLESTIK ABLEBOND 8350M) -- 8799556108289 (Known as ABLESTIK ABLEBOND 8350M ) LOCTITE ABLESTIK 8350M electrically conductive one component die attach adhesive has been formulated for use in high throughput die attach applications.
LOCTITE ABLESTIK 8387BS (Known as ABLESTIK ABLEBOND 8387BS) -- 8799473303553 (Known as ABLESTIK ABLEBOND 8387BS ) LOCTITE ABLESTIK 8387BS is a single component adhesive is designed for high throughput bonding applications. It contains spacers for improved bondline control.
LOCTITE ABLESTIK 84-1A (Known as ABLESTIK ABLEBOND 84-1A) -- 8799474319361 (Known as ABLESTIK ABLEBOND 84-1A ) LOCTITE ABLESTIK 84-1A is an adhesive for high volume semiconductor applications. This paste adhesive is ideal for application by printing, dispensing or stamping.
LOCTITE ABLESTIK 84-1LMISR8 (Known as Ablestik ABLEBOND 84-1LMISR8) -- 8799473369089 (Known as Ablestik ABLEBOND 84-1LMISR8 ) LOCTITE ABLESTIK 84-1LMISR8 is an electrically conductive adhesive is designed for power applications that use Cu leadframes. It can be used in a variety...
LOCTITE ABLESTIK 85-1 (Known as ABLESTIK ABLEBOND 85-1) -- 8799474778113 (Known as ABLESTIK ABLEBOND 85-1 ) Gold-filled, high reliability conductive adhesive for critical applications.
LOCTITE ABLESTIK AAA 3131A (Known as ABLESTIK ABLEBOND AAA3131A) -- 8799581241345 (Known as ABLESTIK ABLEBOND AAA3131A ) LOCTITE ABLESTIK AAA 3131A die attach is electrically and thermally conductive recommended for package types which require very low electrical resistivity. It is snap...
LOCTITE ABLESTIK FS 849-TI (Known as ABLESTIK ABLEBOND FS849-TI) -- 8799476416513 (Known as ABLESTIK ABLEBOND FS849-TI ) LOCTITE ABLESTIK FS 849-TI is a high thermal conductivity adhesive with low electrical resistanc
LOCTITE ABLESTIK 8008HT (Known as Ablestik ABLECOAT 8008HT) -- 8799476973569 (Known as Ablestik ABLECOAT 8008HT ) LOCTITE ABLESTIK 8008HT is a high thermal conductivity snap cure adhesive utilizing wafer backside coating technology.
LOCTITE ABLESTIK 5020K (Known as Ablestik ABLEFILM 5020K) -- 8802605105153 (Known as Ablestik ABLEFILM 5020K ) LOCTITE ABLESTIK 5020K is a high purity adhesive with excellent adhesion to gold-plated surfaces, particularly suited for use in hermetic packages. It is certified...
LOCTITE ABLESTIK 5025E (Known as Ablestik ABLEFILM 5025E) -- 8802605268993 (Known as Ablestik ABLEFILM 5025E ) LOCTITE ABLESTIK 5025E is an unsupported epoxy adhesive film ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not...
LOCTITE ABLESTIK ECF 506 (Known as Ablestik ABLEFILM 506) -- 8799477071873 (Known as Ablestik ABLEFILM 506 ) LOCTITE ABLESTIK ECF 506 is a flexible film adhesive designed for bonding TCE mismatched materials. Slight tack can simplify assembly.
LOCTITE ABLESTIK 550 (Known as Ablestik ABLEFILM 550) -- 8802605563905 (Known as Ablestik ABLEFILM 550 ) LOCTITE ABLESTIK 550 is a high strength adhesive that bonds well to gold and other difficult bonding surfaces.
LOCTITE ABLESTIK 550K (Known as Ablestik ABLEFILM 550K) -- 8799477727233 (Known as Ablestik ABLEFILM 550K ) LOCTITE ABLESTIK 550K combines high adhesion strength with very good thermal conductivity in a fiberglass supported film adhesive available in a wide range of...
LOCTITE ABLESTIK 561 (Known as ABLESTIK ABLEFILM 561) -- 8799580291073 (Known as ABLESTIK ABLEFILM 561 ) LOCTITE ABLESTIK 561 is a thermally conductive epoxy film designed for bonding materials with mismatched coefficients of thermal expansion.
LOCTITE ABLESTIK 561K (Known as Ablestik ABLEFILM 561K) -- 8799477170177 (Known as Ablestik ABLEFILM 561K ) High adhesion strength with excellent flexibility for bonding mismatched CTE materials.
LOCTITE ABLESTIK 563K (Known as Ablestik ABLEFILM 563K) -- 8799435522049 (Known as Ablestik ABLEFILM 563K ) LOCTITE ABLESTIK 563K is an electrically insulating film with high thermal conductivity and adhesion strength. Available either unsupported or with a fiberglass carrier.
LOCTITE ABLESTIK 566K (Known as Ablestik ABLEFILM 566K) -- 8799477202945 (Known as Ablestik ABLEFILM 566K ) LOCTITE ABLESTIK 566K offers low temperature cure in a thermally conductive adhesive with excellent flexibility and adhesion.
LOCTITE ABLESTIK 566KAP (Known as Ablestik ABLEFILM 566KAPTON) -- 8799477235713 (Known as Ablestik ABLEFILM 566KAPTON ) LOCTITE ABLESTIK 566KAP contains a polyamide carrier providing high insulation resistance. With a low temperature cure and excellent flexibility it is particularly suitable for...
LOCTITE ABLESTIK ECF 550 (Known as ABLESTIK ABLEFILM ECF550) -- 8799581667329 (Known as ABLESTIK ABLEFILM ECF550 ) ABLESTIK ABLEFILM ECF550 adhesive is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, this adhesive film acts as an...
LOCTITE ABLESTIK ECF 561E (Known as Ablestik ABLEFILM ECF561E) -- 8799478546433 (Known as Ablestik ABLEFILM ECF561E ) LOCTITE ABLESTIK ECF 561E is the most flexible of the fiberglass-supported electrically conductive products.
LOCTITE ABLESTIK ECF 564A (Known as Ablestik ABLEFILM ECF564A) -- 8799436079105 (Known as Ablestik ABLEFILM ECF564A ) LOCTITE ABLESTIK ECF 564A is an ionically clean, fiberglass supported adhesive with very good thermal conductivity. It is certified to MIL-STD-883, Method 5011.
LOCTITE ABLESTIK ECF 564AHF1004 (Known as ABLESTIK ABLEFILM ECF564AHF) -- 8799556599809 (Known as ABLESTIK ABLEFILM ECF564AHF ) LOCTITE ABLESTIK ECF 564AHF1004 is a heat cure, electrically conductive epoxy film designed for use in hybrid packages where outgassing and ionic contamination must...
LOCTITE ABLESTIK ECF 568 (Known as Ablestik ABLEFILM ECF568) -- 8799478153217 (Known as Ablestik ABLEFILM ECF568 ) LOCTITE ABLESTIK ECF 568 was designed for low temperature cure applications. It has superior adhesion to most surfaces.
LOCTITE ABLESTIK ABP 8064T (Known as Ablestik ABP 8064T) -- 8799582126081 (Known as Ablestik ABP 8064T ) LOCTITE ABLESTIK ABP 8064T highly filled, conductive die attach paste adhesive is designed to provide high thermal and electrical conductivity in the attachment of...
LOCTITE ABLESTIK ABP 8910T (Known as ABLESTIK ABP-8910T) -- 8799581339649 (Known as ABLESTIK ABP-8910T ) LOCTITE ABLESTIK ABP 8910T die attach adhesive is formulated with a medium modulus using hybrid chemistry and is targeted for use on medium to large...
LOCTITE ABLESTIK C100 Series (Known as Ablestik C115) -- 8799436439553 (Known as Ablestik C115 ) LOCTITE ABLESTIK C100 Series (C115 and C130) die attach adhesive film is suitable for tight geometry (<100μm) leadframe packages where high electrical performance is required.
LOCTITE ABLESTIK CDF 800 Series Conductive Die Attach Film (Known as Ablestik CDF 815P6B) -- 8802612051969 (Known as Ablestik CDF 815P6B ) LOCTITE ABLESTIK CDF 800 Series are high filled, conductive die attach adhesive film designed to provide high thermal and electrical conductivity in the attachment...
LOCTITE ABLESTIK ICP 3535M1 (Known as ABLESTIK ICP-3535M1) -- 8799580749825 (Known as ABLESTIK ICP-3535M1 ) LOCTITE ABLESTIK ICP 3535M1 is an electrically conductive adhesive is designed for circuit assembly applications. It is specially recommended for mounting lower cost tin (Sn)...
LOCTITE ABLESTIK ICP 4000 (Known as ABLESTIK ICP-4000) -- 8799555747841 (Known as ABLESTIK ICP-4000 ) LOCTITE ABLESTIK ICP 4000 is a silicone based, electronically conductive adhesive recommended in mounting small components to a variety of interconnect substrates. It can be...
LOCTITE ABLESTIK ICP 4298-S39 (Known as Ablestik ICP-4298 S39) -- 8802610380801 (Known as Ablestik ICP-4298 S39 ) LOCTITE ABLESTIK ICP 4298 is a silicone based electrically conductive adhesive. It is specially designed for applications where both high flexibility and excellent conductivity...
LOCTITE ABLESTIK ICP 4001 (Known as ABLESTIK ICP4001) -- 8802606874625 (Known as ABLESTIK ICP4001 ) LOCTITE ABLESTIK ICP 4001 is an isotropic, one component, conductive, solvent-free silicone paste specifically designed for applications where a high degree of flexibility is required.
LOCTITE ABLESTIK 2600AT (Known as Abletherm 2600AT) -- 8802584788993 (Known as Abletherm 2600AT ) LOCTITE ABLESTIK 2158 adhesive is designed for thermal management applications requiring high heat extraction from the die such as high power and discrete devices. This...
LOCTITE ABLESTIK 2700HT (Known as ABLETHERM 2700HT) -- 8799580684289 (Known as ABLETHERM 2700HT ) LOCTITE ABLESTIK 2700HT is a die attach is desgined for Pb-free array packaging. This adhesive is ideal for small needle dispensing in SIP or MCM...
LOCTITE ABLESTIK ABP 8060T (Known as ABP 8060T(18g)) -- 8799469568001 (Known as ABP 8060T(18g) ) LOCTITE ABLESTIK ABP 8060T electrically conductive die attach paste is formulated to provide high heat transfer generated from power devices. This material can also be...
LOCTITE ABLESTIK ABP 2100AC (Known as ABP-2100AC (35g)) -- 8799581863937 (Known as ABP-2100AC (35g) ) LOCTITE ABLESTIK ABP 2100AC die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures necessary for...
LOCTITE ABLESTIK ABP 8062T (Known as ABP-8062T (17.5g)) -- 8799582322689 (Known as ABP-8062T (17.5g) ) LOCTITE ABLESTIK ABP 8062T electrically conductive die attach paste is formulated to provide high heat transfer generated from power devices. This material can also be...
LOCTITE ABLESTIK C860-1J (Known as ECCOBOND C-860-1J) -- 8802575548417 (Known as ECCOBOND C-860-1J ) LOCTITE ABLESTIK C860-1J is an one component silver filled epoxy adhesive.
LOCTITE ABLESTIK CF 3350 (Known as Hysol CF3350) -- 8799540707329 (Known as Hysol CF3350 ) LOCTITE ABLESTIK CF 3350 offers an excellent balance of adhesion strength, electrical and thermal conductivity, and processability. It is especially suited for RF applications.
LOCTITE ABLESTIK 281 (Known as HYSOL ECCOBOND 281 epoxy paste) -- 8802597470209 (Known as HYSOL ECCOBOND 281 epoxy paste ) LOCTITE ABLESTIK 281 is a thermally conductive and electrically insulating, one component filled thixotropic paste. It is suitable for use on a...
LOCTITE ABLESTIK 59C (Known as Hysol ECCOBOND 59C) -- 8799502794753 (Known as Hysol ECCOBOND 59C ) LOCTITE ABLESTIK 59C is a two component, flexible, low temperature cure.
LOCTITE ABLESTIK CE 3103WLV (Known as Hysol ECCOBOND CE3103WLV) -- 8799538642945 (Known as Hysol ECCOBOND CE3103WLV ) LOCTITE ABLESTIK CE 3103WLV is electrically conductive adhesive for thin film PV assembly with superior contact resistance stability. Low viscosity for fine line dispensing.
LOCTITE ABLESTIK CE 3104WXL (Known as Hysol ECCOBOND CE3104WXL) -- 8799538708481 (Known as Hysol ECCOBOND CE3104WXL ) LOCTITE ABLESTIK CE 3104WXL is an electrically conductive adhesive with superior contact resistance stability. Viscosity optimized for screen- and/or stencil-printing.
LOCTITE ABLESTIK CE 3513 (Known as Hysol ECCOBOND CE3513) -- 8799474155521 (Known as Hysol ECCOBOND CE3513 ) LOCTITE ABLESTIK CE 3513 is a one component, silver-filled, non-bleeding, electrically conductive epoxy adhesive with long shelf life at room temperature.
LOCTITE ABLESTIK CE3804 (Known as Hysol ECCOBOND CE3804 A/B) -- 8799549784065 (Known as Hysol ECCOBOND CE3804 A/B ) LOCTITE ABLESTIK CE3804 is an electrically conductive epoxy adhesive for microelectronics.
LOCTITE ABLESTIK E 8502-1 (Known as Hysol ECCOBOND E8502-1) -- 8799540150273 (Known as Hysol ECCOBOND E8502-1 ) LOCTITE ABLESTIK E 8502-1 is a low modulus, thermally conductive, modified epoxy adhesive is ideally suited for management of large CTE mismatch & bonding...
LOCTITE ECCOBOND FP5001 (Known as Hysol FP5001) -- 8799534219265 (Known as Hysol FP5001 ) LOCTITE ECCOBOND FP5001 is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent...
LOCTITE ECCOBOND FP5300 (Known as Hysol FP5300) -- 8799544115201 (Known as Hysol FP5300 ) LOCTITE ECCOBOND FP5300 has excellent adhesion strength to 2- and 3-layer flex and Iaminates. Low temp cure ACP. For use on RFID, Misc, Assembly.
LOCTITE ABLESTIK QMI3555R (Known as Hysol QMI 3555R) -- 8799402819585 (Known as Hysol QMI 3555R ) LOCTITE ABLESTIK QMI3555R is a no-dry Ag/glass die attach for glass, solder and seamed sealed packages. Very high thermal conductivity with a 450°C temperature...
LOCTITE ABLESTIK QMI519 (Known as Hysol QMI519) -- 8799541493761 (Known as Hysol QMI519 ) LOCTITE ABLESTIK QMI519 is JEDEC L1 260°C for SOIC, industry standard for QFN packages. Industry standard for preplated finishes. Exceptional performance on clean uncoated silver-plated...
LOCTITE ABLESTIK QMI529HT (Known as Hysol QMI529HT-5DLT) -- 8799468978177 (Known as Hysol QMI529HT-5DLT ) LOCTITE ABLESTIK QMI529HT is used for component or die attach where very high electrical and thermal conductivity are required. Suitable for high heat dissipation devices...
LOCTITE ABLESTIK QMI529HT-LV (Known as HYSOL QMI529HT-LV2C1.5) -- 8802595700737 (Known as HYSOL QMI529HT-LV2C1.5 ) LOCTITE ABLESTIK QMI529HT-LV electrically conductive adhesive is designed for die attach applicaitons. It is recommended for use in the attachment integrated circuits and components onto...
LOCTITE ABLESTIK QMI536HT(BORON) (Known as Hysol QMI536HT) -- 8799542116353 (Known as Hysol QMI536HT ) LOCTITE ABLESTIK QMI536HT(BORON) is a high thermal version of QMI536 and is ideal for mixed stacked die applications. Non-die damaging filler.
LOCTITE TC 4 (Known as Hysol STYCAST TC4) -- 8799572197377 (Known as Hysol STYCAST TC4 ) LOCTITE TC 4 is a thermally conductive, high temperature silicone thermal grease.
LOCTITE TC 8M (Known as Hysol STYCAST TC8M) -- 8802592718849 (Known as Hysol STYCAST TC8M ) LOCTITE TC 8M is a thermally conductive, high temperature silicone thermal grease.
LOCTITE TCF 1000 AL (Known as LOCTITE Thermstrate 2000 Phase Change) -- 8799553847297 (Known as LOCTITE Thermstrate 2000 Phase Change ) LOCTITE TCF 1000 AL is a phase change thermal interface material suitable for use between a heat sink and a variety of...
ABLESTIK ABLEBOND 958-8C -- 8799556337665 ABLESTIK ABLEBOND 958-8C is an electrically conductive epoxy designed for solder replacement in microelectronic interconnect applications. It may be used with thick film metalizations or traditional printed circuit board surfaces.
ABLESTIK ABLEFILM ECF563 -- 8799581700097 ABLESTIK ABLEFILM ECF563 unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in...
ABLESTIK ABP-8000 -- 8802606383105 ABLESTIK ABP-8000 conductive die attach is desgined for bonding devices where high heat transfer is required. It is recommended for use in the attachment of integrated circuits and components onto...
Ablestik C130 -- 8799555026945 ABLESTIK C100 Series (C115 and C130) die attach adhesive film is suitable for tight geometry (<100μm) leadframe packages where high electrical performance is required. This material was originally sampled as...
ACHESON ELECTRODAG 5915 -- 8799582519297 ACHESON ELECTRODAG 5915 is a one component, fast cure, electrically conductive isotropic ink designed for bonding surface mount devices to flexible or rigid printed circuits.
Hysol ECCOBOND C850-6 -- 8799537594369 Eccobond C850-6 is a fast curing, general conductive, one component, low viscosity, silver filled epoxy die attach adhesive paste. It features high electrical and thermal conductivity and high strength at...
Hysol ECCOBOND E3503-1 -- 8799540346881 Eccobond E3503-1 is optimised for SMT dispense and the manufacturing of high volume assemblies. It has high adhesion to the substrate finishes commonly used in microelectronics and will not adversely...
Hysol ECCOBOND 8177-0 -- 8799537168385 Enhanced thermal conductivity, fast cure, low stress die and component attach adhesive optimized for GaAs MMIC attach.
Gap Pad 1500 -- 8806384238593 Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on...
Gap Pad 1500R -- 8806384435201 Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and...
Gap Pad 1500S30 -- 8806384533505 Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads.The material is fiberglass reinforced for improved puncture resistance and handling characteristics. Gap Pad...
Gap Pad 2000S40 -- 8806384697345 Gap Pad 2000S40 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill...
Gap Pad 2200SF -- 8806383845377 Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap...
Gap Pad 5000S35 -- 8806384959489 Gap Pad 5000S35 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability.The fiberglass reinforcement provides easy handling...
Gap Pad A2000 -- 8806384664577 Gap Pad A2000 acts as a thermal interface and electrical insulator between electrical components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is...
Gap Pad A3000 -- 8806384828417 Gap Pad A3000 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. Gap Pad...
Gap Pad EMI 1.0 -- 8807037599745 Gap Pad EMI 1.0 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies...
Gap Pad HC1000 -- 8806383976449 Gap Pad HC 1000 is an extremely conformable, low modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows...
Gap Pad VO -- 8806383550465 Gap Pad VO is a cost effective thermally conductive interface. The material is a filled thermally conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling.
Gap Pad VO Soft -- 8806383484929 Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on...
Gap Pad VO Ultra Soft -- 8806383616001 Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low stress vibration...
Gap Pad VO Ultra Soft Black -- 8806383583233 Gap Pad VO Ultra Soft-B is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening...
Gap Pad 1000HD -- 8806383648769 Gap Pad® 1000HD was designed to with-stand applications requiring high durability. The coated polyimide carrier on one side of the material allows easy rework, excellent handling characteristics and puncture resistance.
Gap Pad 1450 -- 8806384107521 Gap Pad® 1450 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a permanent liner, which facilitates rework and improves puncture resistance...
Gap Pad 2202SF -- 8806383878145 Gap Pad® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to...
Gap Pad 3004SF -- 8806384861185 Gap Pad® 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. Gap Pad® 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap...
Gap Pad 3500ULM -- 8806384893953 Gap Pad® 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due...
Gap Pad HC3.0 -- 8806384009217 Gap Pad® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a...
Thermal Interface Material -- GAP PAD HC 5.0 GAP PAD™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to...
TECHNOMELT PA 2384 -- 8807299842049
TECHNOMELT PA 341 -- 8802588327937
TECHNOMELT PA 5375
TECHNOMELT PA 6208 -- 8807692926977
TECHNOMELT PA 6208 Black -- 8799566462977
TECHNOMELT PA 633 -- 8802586427393
TECHNOMELT PA 6344 -- 8807299973121
TECHNOMELT PA 638 -- 8802586492929
TECHNOMELT PA 641 -- 8802586558465
TECHNOMELT PA 646 -- 8802586591233
TECHNOMELT PA 652 -- 8799377391617
TECHNOMELT PA 653
TECHNOMELT PA 657 -- 8799377358849
TECHNOMELT PA 658
TECHNOMELT PA 668 -- 8805825445889
TECHNOMELT PA 668 Clear
TECHNOMELT PA 673 (Known as Macromelt OM 673) -- 8802614804481
TECHNOMELT PA 678 -- 8802588065793
TECHNOMELT PA 682 -- 8799377424385
TECHNOMELT PA 687 -- 8807299710977
TECHNOMELT TC 50
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT...
TECHNOMELT PA 2692 Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT...
HYSOL ECCOBOND 281 BLK epoxy adhesive -- 8799577702401 HYSOL ECCOBOND 281 BLK one component epoxy adhesive is formualted for use in applications requiring excellent thermal conductivity. It has high thermal conductivity, good chemical resistance and is electrically insulating.
Loctite Isostrate -- 8799553519617 Isostrate™ is an electrically isolating phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as a...
Liqui-Bond SA 1000 (One-Part) -- 8806383517697 Liqui-Bond SA 1000 is a thermally conductive, one-part liquid silicone adhesive with a low viscosity for easy screenability. Liqui-Bond SA 1000 features a high thermal performance and maintains it’s structure...
Liqui-Bond SA 1800 (One-Part) -- 8806384762881 Liqui-Bond SA 1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer. The adhesive is supplied as a one-part liquid component, offered in a tube...
Liqui Bond SA 2000 (One-Part) -- 8806384795649 Liqui-Bond SA 2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding elastomer. Liqui-Bond SA 2000 is supplied as a one-part liquid component, in either...
Liqui-Bond EA 1805 -- 8806384926721 Liqui-Bond® EA 1805 is a two-component, epoxy based, liquid-dispensable adhesive. Liqui-Bond® EA 1805 has a thermal conductivity of 1.8 W/mK. Liqui-Bond® EA 1805 will be supplied in a two-component format,...
Liqui Bond SA 3505 -- 8806384730113 Liqui-Bond® SA 3505 is a higher performance, thermally conductive, liquid adhesive. This material is supplied as a two-part material and requires no refrigeration. The mixed material cures at elevated temperatures.
Liqui-Form 2000 -- 8806383419393 Liqui-Form® 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework. Liqui-Form® 2000...
LOCTITE 3873 -- 8799552208897 LOCTITE 3873 is a fast curing, high-conductivity, self-shimming for bonding heat-generated devices to thermal spreader.
LOCTITE 3874 -- 8799552241665 LOCTITE 3874 is a fast-curing, high-conductivity for bonding heat-generated devices to thermal spreader without glass beads.
LOCTITE ABLESTIK 3880 -- 8799373950977 LOCTITE ABLESTIK 3880 is designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required.
LOCTITE ABLESTIK 3888 -- 8802598125569 LOCTITE ABLESTIK 3888 is a room temperature cure adhesive for applications requiring a combination of good mechanical and electrical properties.
LOCTITE ABLESTIK CDF 200 Series -- 8799469535233 LOCTITE ABLESTIK CDF 200 Series is a highly filled, conductive die attach film adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and...
LOCTITE ABLESTIK SSP 2020 Silver sintering paste die attach -- 8802610806785 LOCTITE ABLESTIK SSP 2020 is a sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated...
LOCTITE ABLESTIK SSP-2000 silver sintering paste -- 8799581798401 LOCTITE ABLESTIK SSP-2000 printable low temperature silver sintering paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated...
LOCTITE ISOSTRATE 2000 -- 8799580028929 LOCTITE ISOSTRATE 2000 electrically conductive isolating phase change thermal interface material is suitable for use between a heat sink and a variety of heat dissipating components. It is supplied as...
LOCTITE NSWC100 -- 8799553552385 LOCTITE NSWC100 is a non-silicone, water cleanable thermal compound.
LOCTITE Powerstrate Xtreme -- 8799553617921 LOCTITE Powerstrate Xtreme (PSX) is a reworkable unsupported film with superior thermal performance even at low pressure. Direct attach to heat sink at room temperature without adhesive. Also available in...
LOCTITE PSX-D -- 8799553683457 LOCTITE PSX-D (Powerstrate Xtreme) is a repeatable phase change thermal interface material. Supplied as a paste that can be stenciled, needle dispensed, screen printed or applied manually onto a heat...
LOCTITE PSX-D-LV -- 8799554043905 LOCTITE PSX-D-LV (Powerstrate Xtreme) is a reworkable and repeatable phase change thermal interface material. It offers the enhanced performance and reliability of a phase change thermal interface material with the...
LOCTITE PSX-Pm -- 8799554076673 LOCTITE PSX-Pm (Medium Dry) (Powerstrate Xtreme) is a reworkable and repeatable phase change material. It offers enhanced performance and reliability with the application ease of thermal grease. Also available other...
LOCTITE Silverstrate -- 8799553814529 Loctite Silverstrate is an electrically conductive phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as...
LOCTITE TAF 8800 Thermal Absorbing Film -- 8802610348033 LOCTITE TAF 8800 is a heat absorbing material designed to reduce the skin temperature of mobile electronic devices. It can effectively absorb, spread, insulate and slowly dissipate thermal energy generated...
Hysol ECCOBOND CE3535 -- 8799539298305 One component epoxy adhesive paste providing high mechanical strength and stable contact resistance on Cu and 100% Sn.
Hysol ECCOBOND TE3530 -- 8799536054273 One component, low temperature curing thermally conductive epoxy adhesive.
Poly-Pad 1000 -- 8806383058945 Poly-Pad 1000 is a fiberglass-based insulator coated with a filled polyester resin. The mterial offers superior thermal resistance for high performance applications. Polyester-based, thermally conductive insulators from Bergquist provide a...
Poly-Pad 400 -- 8806383091713 Poly-Pad 400 is a fiberglass-reinforced insulator coated with a filled polyester resin. Poly-Pad 400 is economical and designed for most standard applications. Polyester-based, thermally conductive insulators from Bergquist provide a...
Poly-Pad K-10 -- 8806383222785 Poly-Pad K-10 is a composite of film coated with a polyester resin. The material offers superior thermal performance for your most critical applications with a thermal resistance of 0.2°C-in2/W as...
Poly-Pad K-4 -- 8806383124481 Poly-Pad K-4 is a composite of film coated with a polyester resin. The material is an economical insulator and the film carrier provides excellent dielectric and physical strength. Polyester-based, thermally...
LOCTITE TG100 -- 8799578947585 Recommended for high-temperature heat transfer in normal applications. It is used between heat generating devices and the surfaces to which they are mounted or other heat dissipating surfaces. This product...
Gap Pad 1000SF -- 8806383747073 The new Gap Pad 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensative applications. The material is ideal for applications with high standoff and flatness tolerances.
Hysol QMI5030 -- 8799541002241 Unique product resulting from blend of thermoset and thermoplastic resins.
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8660S
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8880S
With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting...