Henkel Corporation - Electronics Datasheets for Conductive Compounds
Conductive compounds provide an electrically and/or thermally conductive path between components.
Conductive Compounds: Learn more
| Product Name | Notes |
|---|---|
| (Known as Ablebond 2300 ) LOCTITE ABLESTIK 2300 is an ultra low moisture absorption, low stress adhesive. | |
| (Known as Ablebond 3230 ) LOCTITE ABLESTIK 3230 is an electrically conductive die attach adhesive is designed for high reliability package applications. It can be used in a variety of... | |
| (Known as Ablebond 3290 ) LOCTITE ABLESTIK 3290 is a snap curable, electrically conductive die attach adhesive designed for lead-free applications where high reliability is a key requirement. | |
| (Known as ABLEBOND 8175Q ) LOCTITE ABLESTIK 8175Q is an electrically conductive, paste adhesive designed for solder replacement in microelectronic interconnect applications | |
| (Known as Ablebond 8290 ) LOCTITE ABLESTIK 8290 is a low stress die attach adhesive suitable for die size <200 mil. | |
| (Known as Ablebond 8352L ) LOCTITE ABLESTIK 8352L is a high electrical and thermal conductivity die attach adhesive. | |
| (Known as Ablebond 8384 ) LOCTITE ABLESTIK 8384 is a die attach adhesive is designed for smart card applications. | |
| (Known as Ablebond 8387B ) LOCTITE ABLESTIK 8387B is a non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast... | |
| (Known as Ablebond 84-1LMISR3 ) LOCTITE ABLESTIK 84-1LMISR3 electrically conductive adhesive is designed for die attach applications. It is a low viscosity and higher thixotropic index version of ABLEBOND 84-1LMIS. | |
| (Known as Ablebond 84-1LMISR4 ) LOCTITE ABLESTIK 84-1LMISR4 is an industry standard die attach adhesive. | |
| (Known as Ablebond 84-1LMIT1 ) LOCTITE ABLESTIK 84-1LMIT1 is a fast, low temperature cure electrically & thermally conductive adhesive. Ideally suited for low stress die & component attaching, this adhesive... | |
| (Known as Ablebond 8700K (5.4g) ) LOCTITE ABLESTIK 8700K is a high thermal conductivity, low temperature curing, microelectronics grade adhesive. | |
| (Known as Ablebond 965-1L ) LOCTITE ABLESTIK 965-1L is an electrically conductive epoxy die attach designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion. It is... | |
| (Known as Ablebond 967-1 ) LOCTITE ABLESTIK 967-1 adhesive is designed for applications which require lower-than-normal cure temperatures. It is ideal for application by automatic dispenser, screen printing or hand... | |
| (Known as Ablebond 969-1 ) LOCTITE ABLESTIK 969-1 is an electrically conductive preimidized adhesive designed for semiconductor die attach. It is not recommended for use in hermetic packages. | |
| (Known as Ablestik 8008MD ) LOCTITE ABLESTIK 8008MD is an adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing... | |
| (Known as ABLESTIK 84-1LMISR4-S25 ) LOCTITE ABLESTIK 84-1LMISR4-S25 is an electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. This material is... | |
| (Known as ABLESTIK ABLEBOND 16-1 ) LOCTITE ABLESTIK 16-1 is a two-component, electrically conductive epoxy adhesive designed for general purpose applications. It cures at room temperature while providing a reasonable... | |
| (Known as ABLESTIK ABLEBOND 2000 ) LOCTITE ABLESTIK 2000 electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the... | |
| (Known as Ablestik ABLEBOND 2000B ) LOCTITE ABLESTIK 2000B is an electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to... | |
| (Known as ABLESTIK ABLEBOND 2030SC ) Die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage... | |
| (Known as Ablestik ABLEBOND 2100A ) LOCTITE ABLESTIK 2100A is an ultra low moisture absorption adhesive with high hot/wet die shear strength. For lead-free packaging. | |
| (Known as ABLESTIK ABLEBOND 2310 ) LOCTITE ABLESTIK 2310 Is a conductive die attach adhesive designed for use on a wide range of BGA die sizes. Its unique conductive filler... | |
| (Known as ABLESTIK ABLEBOND 3230A ) LOCTITE ABLESTIK 3230A adhesive die attach is designed for semiconductor packaging applications where high electrical conductivity is not required. It can be used in... | |
| (Known as ABLESTIK ABLEBOND 8200C ) LOCTITE ABLESTIK 8200C is an electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This... | |
| (Known as Ablestik ABLEBOND 8200TI ) LOCTITE ABLESTIK 8200TI is LOCTITE ABLESTIK 8200C with higher thermal conductivity and optimized adhesion on NiPdAu leadframe. | |
| (Known as ABLESTIK ABLEBOND 8340-O ) LOCTITE ABLESTIK 8340-O is an electrically conductive die attach adhesive designed for high reliability lead frame packaging applications. | |
| (Known as ABLESTIK ABLEBOND 8350M ) LOCTITE ABLESTIK 8350M electrically conductive one component die attach adhesive has been formulated for use in high throughput die attach applications. | |
| (Known as ABLESTIK ABLEBOND 8387BS ) LOCTITE ABLESTIK 8387BS is a single component adhesive is designed for high throughput bonding applications. It contains spacers for improved bondline control. | |
| (Known as ABLESTIK ABLEBOND 84-1A ) LOCTITE ABLESTIK 84-1A is an adhesive for high volume semiconductor applications. This paste adhesive is ideal for application by printing, dispensing or stamping. | |
| (Known as Ablestik ABLEBOND 84-1LMISR8 ) LOCTITE ABLESTIK 84-1LMISR8 is an electrically conductive adhesive is designed for power applications that use Cu leadframes. It can be used in a variety... | |
| (Known as ABLESTIK ABLEBOND 85-1 ) Gold-filled, high reliability conductive adhesive for critical applications. | |
| (Known as ABLESTIK ABLEBOND AAA3131A ) LOCTITE ABLESTIK AAA 3131A die attach is electrically and thermally conductive recommended for package types which require very low electrical resistivity. It is snap... | |
| (Known as ABLESTIK ABLEBOND FS849-TI ) LOCTITE ABLESTIK FS 849-TI is a high thermal conductivity adhesive with low electrical resistanc | |
| (Known as Ablestik ABLECOAT 8008HT ) LOCTITE ABLESTIK 8008HT is a high thermal conductivity snap cure adhesive utilizing wafer backside coating technology. | |
| (Known as Ablestik ABLEFILM 5020K ) LOCTITE ABLESTIK 5020K is a high purity adhesive with excellent adhesion to gold-plated surfaces, particularly suited for use in hermetic packages. It is certified... | |
| (Known as Ablestik ABLEFILM 5025E ) LOCTITE ABLESTIK 5025E is an unsupported epoxy adhesive film ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not... | |
| (Known as Ablestik ABLEFILM 506 ) LOCTITE ABLESTIK ECF 506 is a flexible film adhesive designed for bonding TCE mismatched materials. Slight tack can simplify assembly. | |
| (Known as Ablestik ABLEFILM 550 ) LOCTITE ABLESTIK 550 is a high strength adhesive that bonds well to gold and other difficult bonding surfaces. | |
| (Known as Ablestik ABLEFILM 550K ) LOCTITE ABLESTIK 550K combines high adhesion strength with very good thermal conductivity in a fiberglass supported film adhesive available in a wide range of... | |
| (Known as ABLESTIK ABLEFILM 561 ) LOCTITE ABLESTIK 561 is a thermally conductive epoxy film designed for bonding materials with mismatched coefficients of thermal expansion. | |
| (Known as Ablestik ABLEFILM 561K ) High adhesion strength with excellent flexibility for bonding mismatched CTE materials. | |
| (Known as Ablestik ABLEFILM 563K ) LOCTITE ABLESTIK 563K is an electrically insulating film with high thermal conductivity and adhesion strength. Available either unsupported or with a fiberglass carrier. | |
| (Known as Ablestik ABLEFILM 566K ) LOCTITE ABLESTIK 566K offers low temperature cure in a thermally conductive adhesive with excellent flexibility and adhesion. | |
| (Known as Ablestik ABLEFILM 566KAPTON ) LOCTITE ABLESTIK 566KAP contains a polyamide carrier providing high insulation resistance. With a low temperature cure and excellent flexibility it is particularly suitable for... | |
| (Known as ABLESTIK ABLEFILM ECF550 ) ABLESTIK ABLEFILM ECF550 adhesive is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, this adhesive film acts as an... | |
| (Known as Ablestik ABLEFILM ECF561E ) LOCTITE ABLESTIK ECF 561E is the most flexible of the fiberglass-supported electrically conductive products. | |
| (Known as Ablestik ABLEFILM ECF564A ) LOCTITE ABLESTIK ECF 564A is an ionically clean, fiberglass supported adhesive with very good thermal conductivity. It is certified to MIL-STD-883, Method 5011. | |
| (Known as ABLESTIK ABLEFILM ECF564AHF ) LOCTITE ABLESTIK ECF 564AHF1004 is a heat cure, electrically conductive epoxy film designed for use in hybrid packages where outgassing and ionic contamination must... | |
| (Known as Ablestik ABLEFILM ECF568 ) LOCTITE ABLESTIK ECF 568 was designed for low temperature cure applications. It has superior adhesion to most surfaces. | |
| (Known as Ablestik ABP 8064T ) LOCTITE ABLESTIK ABP 8064T highly filled, conductive die attach paste adhesive is designed to provide high thermal and electrical conductivity in the attachment of... | |
| (Known as ABLESTIK ABP-8910T ) LOCTITE ABLESTIK ABP 8910T die attach adhesive is formulated with a medium modulus using hybrid chemistry and is targeted for use on medium to large... | |
| (Known as Ablestik C115 ) LOCTITE ABLESTIK C100 Series (C115 and C130) die attach adhesive film is suitable for tight geometry (<100μm) leadframe packages where high electrical performance is required. | |
| (Known as Ablestik CDF 815P6B ) LOCTITE ABLESTIK CDF 800 Series are high filled, conductive die attach adhesive film designed to provide high thermal and electrical conductivity in the attachment... | |
| (Known as ABLESTIK ICP-3535M1 ) LOCTITE ABLESTIK ICP 3535M1 is an electrically conductive adhesive is designed for circuit assembly applications. It is specially recommended for mounting lower cost tin (Sn)... | |
| (Known as ABLESTIK ICP-4000 ) LOCTITE ABLESTIK ICP 4000 is a silicone based, electronically conductive adhesive recommended in mounting small components to a variety of interconnect substrates. It can be... | |
| (Known as Ablestik ICP-4298 S39 ) LOCTITE ABLESTIK ICP 4298 is a silicone based electrically conductive adhesive. It is specially designed for applications where both high flexibility and excellent conductivity... | |
| (Known as ABLESTIK ICP4001 ) LOCTITE ABLESTIK ICP 4001 is an isotropic, one component, conductive, solvent-free silicone paste specifically designed for applications where a high degree of flexibility is required. | |
| (Known as Abletherm 2600AT ) LOCTITE ABLESTIK 2158 adhesive is designed for thermal management applications requiring high heat extraction from the die such as high power and discrete devices. This... | |
| (Known as ABLETHERM 2700HT ) LOCTITE ABLESTIK 2700HT is a die attach is desgined for Pb-free array packaging. This adhesive is ideal for small needle dispensing in SIP or MCM... | |
| (Known as ABP 8060T(18g) ) LOCTITE ABLESTIK ABP 8060T electrically conductive die attach paste is formulated to provide high heat transfer generated from power devices. This material can also be... | |
| (Known as ABP-2100AC (35g) ) LOCTITE ABLESTIK ABP 2100AC die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures necessary for... | |
| (Known as ABP-8062T (17.5g) ) LOCTITE ABLESTIK ABP 8062T electrically conductive die attach paste is formulated to provide high heat transfer generated from power devices. This material can also be... | |
| (Known as ECCOBOND C-860-1J ) LOCTITE ABLESTIK C860-1J is an one component silver filled epoxy adhesive. | |
| (Known as Hysol CF3350 ) LOCTITE ABLESTIK CF 3350 offers an excellent balance of adhesion strength, electrical and thermal conductivity, and processability. It is especially suited for RF applications. | |
| (Known as HYSOL ECCOBOND 281 epoxy paste ) LOCTITE ABLESTIK 281 is a thermally conductive and electrically insulating, one component filled thixotropic paste. It is suitable for use on a... | |
| (Known as Hysol ECCOBOND 59C ) LOCTITE ABLESTIK 59C is a two component, flexible, low temperature cure. | |
| (Known as Hysol ECCOBOND CE3103WLV ) LOCTITE ABLESTIK CE 3103WLV is electrically conductive adhesive for thin film PV assembly with superior contact resistance stability. Low viscosity for fine line dispensing. | |
| (Known as Hysol ECCOBOND CE3104WXL ) LOCTITE ABLESTIK CE 3104WXL is an electrically conductive adhesive with superior contact resistance stability. Viscosity optimized for screen- and/or stencil-printing. | |
| (Known as Hysol ECCOBOND CE3513 ) LOCTITE ABLESTIK CE 3513 is a one component, silver-filled, non-bleeding, electrically conductive epoxy adhesive with long shelf life at room temperature. | |
| (Known as Hysol ECCOBOND CE3804 A/B ) LOCTITE ABLESTIK CE3804 is an electrically conductive epoxy adhesive for microelectronics. | |
| (Known as Hysol ECCOBOND E8502-1 ) LOCTITE ABLESTIK E 8502-1 is a low modulus, thermally conductive, modified epoxy adhesive is ideally suited for management of large CTE mismatch & bonding... | |
| (Known as Hysol FP5001 ) LOCTITE ECCOBOND FP5001 is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent... | |
| (Known as Hysol FP5300 ) LOCTITE ECCOBOND FP5300 has excellent adhesion strength to 2- and 3-layer flex and Iaminates. Low temp cure ACP. For use on RFID, Misc, Assembly. | |
| (Known as Hysol QMI 3555R ) LOCTITE ABLESTIK QMI3555R is a no-dry Ag/glass die attach for glass, solder and seamed sealed packages. Very high thermal conductivity with a 450°C temperature... | |
| (Known as Hysol QMI519 ) LOCTITE ABLESTIK QMI519 is JEDEC L1 260°C for SOIC, industry standard for QFN packages. Industry standard for preplated finishes. Exceptional performance on clean uncoated silver-plated... | |
| (Known as Hysol QMI529HT-5DLT ) LOCTITE ABLESTIK QMI529HT is used for component or die attach where very high electrical and thermal conductivity are required. Suitable for high heat dissipation devices... | |
| (Known as HYSOL QMI529HT-LV2C1.5 ) LOCTITE ABLESTIK QMI529HT-LV electrically conductive adhesive is designed for die attach applicaitons. It is recommended for use in the attachment integrated circuits and components onto... | |
| (Known as Hysol QMI536HT ) LOCTITE ABLESTIK QMI536HT(BORON) is a high thermal version of QMI536 and is ideal for mixed stacked die applications. Non-die damaging filler. | |
| (Known as Hysol STYCAST TC4 ) LOCTITE TC 4 is a thermally conductive, high temperature silicone thermal grease. | |
| (Known as Hysol STYCAST TC8M ) LOCTITE TC 8M is a thermally conductive, high temperature silicone thermal grease. | |
| (Known as LOCTITE Thermstrate 2000 Phase Change ) LOCTITE TCF 1000 AL is a phase change thermal interface material suitable for use between a heat sink and a variety of... | |
| ABLESTIK ABLEBOND 958-8C is an electrically conductive epoxy designed for solder replacement in microelectronic interconnect applications. It may be used with thick film metalizations or traditional printed circuit board surfaces. | |
| ABLESTIK ABLEFILM ECF563 unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in... | |
| ABLESTIK ABP-8000 conductive die attach is desgined for bonding devices where high heat transfer is required. It is recommended for use in the attachment of integrated circuits and components onto... | |
| ABLESTIK C100 Series (C115 and C130) die attach adhesive film is suitable for tight geometry (<100μm) leadframe packages where high electrical performance is required. This material was originally sampled as... | |
| ACHESON ELECTRODAG 5915 is a one component, fast cure, electrically conductive isotropic ink designed for bonding surface mount devices to flexible or rigid printed circuits. | |
| Eccobond C850-6 is a fast curing, general conductive, one component, low viscosity, silver filled epoxy die attach adhesive paste. It features high electrical and thermal conductivity and high strength at... | |
| Eccobond E3503-1 is optimised for SMT dispense and the manufacturing of high volume assemblies. It has high adhesion to the substrate finishes commonly used in microelectronics and will not adversely... | |
| Enhanced thermal conductivity, fast cure, low stress die and component attach adhesive optimized for GaAs MMIC attach. | |
| Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on... | |
| Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and... | |
| Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads.The material is fiberglass reinforced for improved puncture resistance and handling characteristics. Gap Pad... | |
| Gap Pad 2000S40 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill... | |
| Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap... | |
| Gap Pad 5000S35 is a fiberglass-reinforce d filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability.The fiberglass reinforcement provides easy... | |
| Gap Pad A2000 acts as a thermal interface and electrical insulator between electrical components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is... | |
| Gap Pad A3000 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. Gap Pad... | |
| Gap Pad EMI 1.0 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies... | |
| Gap Pad HC 1000 is an extremely conformable, low modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows... | |
| Gap Pad VO is a cost effective thermally conductive interface. The material is a filled thermally conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling. | |
| Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on... | |
| Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low stress vibration... | |
| Gap Pad VO Ultra Soft-B is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening... | |
| Gap Pad® 1000HD was designed to with-stand applications requiring high durability. The coated polyimide carrier on one side of the material allows easy rework, excellent handling characteristics and puncture resistance. | |
| Gap Pad® 1450 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a permanent liner, which facilitates rework and improves puncture resistance... | |
| Gap Pad® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to... | |
| Gap Pad® 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. Gap Pad® 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap... | |
| Gap Pad® 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due... | |
| Gap Pad® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a... | |
| GAP PAD™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to... | |
| Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT... | |
| Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT... | |
| HYSOL ECCOBOND 281 BLK one component epoxy adhesive is formualted for use in applications requiring excellent thermal conductivity. It has high thermal conductivity, good chemical resistance and is electrically insulating. | |
| Isostrate™ is an electrically isolating phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as a... | |
| Liqui-Bond SA 1000 is a thermally conductive, one-part liquid silicone adhesive with a low viscosity for easy screenability. Liqui-Bond SA 1000 features a high thermal performance and maintains it’s structure... | |
| Liqui-Bond SA 1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer. The adhesive is supplied as a one-part liquid component, offered in a tube... | |
| Liqui-Bond SA 2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding elastomer. Liqui-Bond SA 2000 is supplied as a one-part liquid component, in either... | |
| Liqui-Bond® EA 1805 is a two-component, epoxy based, liquid-dispensable adhesive. Liqui-Bond® EA 1805 has a thermal conductivity of 1.8 W/mK. Liqui-Bond® EA 1805 will be supplied in a two-component format,... | |
| Liqui-Bond® SA 3505 is a higher performance, thermally conductive, liquid adhesive. This material is supplied as a two-part material and requires no refrigeration. The mixed material cures at elevated temperatures. | |
| Liqui-Form® 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework. Liqui-Form® 2000... | |
| LOCTITE 3873 is a fast curing, high-conductivity, self-shimming for bonding heat-generated devices to thermal spreader. | |
| LOCTITE 3874 is a fast-curing, high-conductivity for bonding heat-generated devices to thermal spreader without glass beads. | |
| LOCTITE ABLESTIK 3880 is designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required. | |
| LOCTITE ABLESTIK 3888 is a room temperature cure adhesive for applications requiring a combination of good mechanical and electrical properties. | |
| LOCTITE ABLESTIK CDF 200 Series is a highly filled, conductive die attach film adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and... | |
| LOCTITE ABLESTIK SSP 2020 is a sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated... | |
| LOCTITE ABLESTIK SSP-2000 printable low temperature silver sintering paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated... | |
| LOCTITE ISOSTRATE 2000 electrically conductive isolating phase change thermal interface material is suitable for use between a heat sink and a variety of heat dissipating components. It is supplied as... | |
| LOCTITE NSWC100 is a non-silicone, water cleanable thermal compound. | |
| LOCTITE Powerstrate Xtreme (PSX) is a reworkable unsupported film with superior thermal performance even at low pressure. Direct attach to heat sink at room temperature without adhesive. Also available in... | |
| LOCTITE PSX-D (Powerstrate Xtreme) is a repeatable phase change thermal interface material. Supplied as a paste that can be stenciled, needle dispensed, screen printed or applied manually onto a heat... | |
| LOCTITE PSX-D-LV (Powerstrate Xtreme) is a reworkable and repeatable phase change thermal interface material. It offers the enhanced performance and reliability of a phase change thermal interface material with the... | |
| LOCTITE PSX-Pm (Medium Dry) (Powerstrate Xtreme) is a reworkable and repeatable phase change material. It offers enhanced performance and reliability with the application ease of thermal grease. Also available other... | |
| Loctite Silverstrate is an electrically conductive phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as... | |
| LOCTITE TAF 8800 is a heat absorbing material designed to reduce the skin temperature of mobile electronic devices. It can effectively absorb, spread, insulate and slowly dissipate thermal energy generated... | |
| One component epoxy adhesive paste providing high mechanical strength and stable contact resistance on Cu and 100% Sn. | |
| One component, low temperature curing thermally conductive epoxy adhesive. | |
| Poly-Pad 1000 is a fiberglass-based insulator coated with a filled polyester resin. The mterial offers superior thermal resistance for high performance applications. Polyester-based, thermally conductive insulators from Bergquist provide a... | |
| Poly-Pad 400 is a fiberglass-reinforce d insulator coated with a filled polyester resin. Poly-Pad 400 is economical and designed for most standard applications. Polyester-based, thermally conductive insulators from Bergquist provide... | |
| Poly-Pad K-10 is a composite of film coated with a polyester resin. The material offers superior thermal performance for your most critical applications with a thermal resistance of 0.2°C-in2/W as... | |
| Poly-Pad K-4 is a composite of film coated with a polyester resin. The material is an economical insulator and the film carrier provides excellent dielectric and physical strength. Polyester-based, thermally... | |
| Recommended for high-temperature heat transfer in normal applications. It is used between heat generating devices and the surfaces to which they are mounted or other heat dissipating surfaces. This product... | |
| The new Gap Pad 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensative applications. The material is ideal for applications with high standoff and flatness tolerances. | |
| Unique product resulting from blend of thermoset and thermoplastic resins. | |
| With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting... |