Henkel Corporation - Electronics Datasheets for Electrical and Electronic Resins
Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Electrical and Electronic Resins: Learn more
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| Product Name | Notes |
|---|---|
| (Known as Ablestik CDF 815P6B ) LOCTITE ABLESTIK CDF 800 Series are high filled, conductive die attach adhesive film designed to provide high thermal and electrical conductivity in the attachment... | |
| (Known as ECCOBOND C-850-5A ) LOCTITE ABLESTIK C 850-5A 114 is an electrically conductive adhesive designed for LED die bonding and other die attach applications. KEY BENEFITS: One Component Fast... | |
| (Known as Loctite Ablestik ICP CB5424 ) LOCTITE ABLESTIK ICP CB5424 is a one component silicone paste. It is an electrically conductive adhesive. designed for applications where a high degree... | |
| Your benefits Thermal impedance 0.52°C-in²/W (@50 psi) High bond strength to a variety of surfaces Double-sided, pressure sensitive adhesive tape High performance, thermally conductive acrylic adhesive Can be used instead... | |
| Bergquist Bond-Ply 400 is an un-reinforced, thermally conductive, pressure sensitive adhesive tape. The tape is supplied with protective topside tabs and a carrier liner. Bond-Ply 400 is designed to attain... | |
| Bergquist introduces a new high thermal performance dielectric into its comprehensive Thermal Clad metal core PCB (MCPCB’s) line. HPL is a dielectric specifically formulated for high power lighting LED applications... | |
| Bergquist Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. Q-Pad 3 may be installed prior to soldering and cleaning without... | |
| Bergquist Sil-Pad 1500ST (Soft Tack) is a fiberglass reinforced thermal interface material that is naturally tacky on both sides. Sil-Pad 1500ST exhibits superior thermal performance when compared to the competitors'... | |
| Bergquist Sil-Pad A1500 is a silicone-based thermally conductive and electrically insulating material. It consists of a cured silicone elastomeric compound coated on both sides of a fiberglass reinforcement layer. Sil-Pad... | |
| Bond-Ply 660P is a thermally conductive, electrically insulating, double sided pressure sensitive adhesive tape.The tape consists of a high performance, thermally conductive acrylic adhesive coated on both sides of a... | |
| Bond-Ply LMS 500P is a thermally conductive laminate with a polyimide film substrate.The product consists of a high performance thermally conductive low modulus silicone compound coated both sides of a... | |
| Bond-Ply® 800 is a thermally conductive, electrically isolation double-sided tape. Bond-Ply® 800 is utilized in lighting applications that require thermal transfer and electric isolation. High bond strengths obtained at ambient... | |
| Bond-Ply® LMS-HD is a thermally conductive heat curable laminate material. The product consists of a high performance thermally conductive low modulus silicone compound coated on a cured core, and double... | |
| Gap Filler 1000 is a thermally conductive, liquid gap filling material. It is supplied as a two-component, room or elevated temperature curing system. The material is formulated to provide a... | |
| Gap Filler 1000SR is a two-part, thermally conductive, liquid gap filling material that features superior slump resistance. The mixed system will cure at room temperature and can be accelerated with... | |
| Gap Filler 1100SF is the thermal solution for silicone-sensitive applications. The material is supplied as a two-part component curing at room or elevated temperatures. The material exhibits low modulus properties... | |
| Gap Filler 1500 is a two-part, high performance, thermally conductive liquid gap filling material, which features superior slump resistance and high shear thinning characteristics for optimized consistency and control during... | |
| Gap Filler 1500LV is a two-part, high performance, thermally conductive, liquid gap filling material. This material offers the high temperature resistance and low modulus of a silicone material with significantly... | |
| Gap Filler 2000 is a high performance, thermally conductive liquid gap filling material supplied as a two-component, room or elevated temperature curing system.The material provides a balance of cured material... | |
| Gap Filler 3500S35 is the technology leader in thermally conductive, liquid gap filling materials, featuring ultra-high thermal performance and superior softness. The material is a two-component, cured either at room... | |
| Gap Filler 4000 is a two-part, high performance, thermally conductive, liquid gap filling material. The mixed material will cure at room temparature and can be accelerated with the addition of... | |
| Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on... | |
| Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and... | |
| Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads.The material is fiberglass reinforced for improved puncture resistance and handling characteristics. Gap Pad... | |
| Gap Pad 2000S40 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill... | |
| Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap... | |
| Gap Pad 5000S35 is a fiberglass-reinforce d filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability.The fiberglass reinforcement provides easy... | |
| Gap Pad A2000 acts as a thermal interface and electrical insulator between electrical components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is... | |
| Gap Pad A3000 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. Gap Pad... | |
| Gap Pad EMI 1.0 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies... | |
| Gap Pad HC 1000 is an extremely conformable, low modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows... | |
| Gap Pad VO is a cost effective thermally conductive interface. The material is a filled thermally conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling. | |
| Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on... | |
| Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low stress vibration... | |
| Gap Pad VO Ultra Soft-B is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening... | |
| Gap Pad® 1000HD was designed to with-stand applications requiring high durability. The coated polyimide carrier on one side of the material allows easy rework, excellent handling characteristics and puncture resistance. | |
| Gap Pad® 1450 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a permanent liner, which facilitates rework and improves puncture resistance... | |
| Gap Pad® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to... | |
| Gap Pad® 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. Gap Pad® 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap... | |
| Gap Pad® 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due... | |
| Gap Pad® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a... | |
| GAP PAD™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to... | |
| Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT... | |
| Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT... | |
| Hi-Flow 105 is a phase change material coated on both sides of an aluminum substrate. It is designed specifically to replace grease as a thermal interface, eliminating the mess, contamination... | |
| Hi-Flow 225F-AC is a high performance, thermal interface material for use between a computer processor and a heat sink. Hi-Flow 225F-AC consists of a soft, thermally conductive 55°C phase change... | |
| Hi-Flow 225U is designed for use as a thermal interface material between a computer processor and a heat sink. The product consists of a thermally conductive 55°C phase change compound... | |
| Hi-Flow 225UT is designed as a pressure sensitive thermal interface material for use between a high performance processor and a heat sink. Hi-Flow 225UT is a thermally conductive 55°C phase... | |
| Hi-Flow 300G consists of a thermally conductive 55°C phase change compound coated on a fiberglass web. Hi-Flow 300G is designed as a thermal interface material between a computer processor and... | |
| Hi-Flow 300P consists of a thermally conductive 55°C phase change compound coated on a thermally conductive polyimide film.The polyimide reinforcement makes the material easy to handle, and the 55°C phase... | |
| Hi-Flow 330P is a thermally conductive phase change material featuring a natural tack on one side and reinforced with a polyimide film.The polyimide film provides a high dielectric strength and... | |
| Hi-Flow 565U is a thermally conductive phase change material which is applied in tabulated pad form. In the application the easy to use material undergoes a phase change at 52°C. | |
| Hi-Flow 565UT is a naturally tacky, thermally conductive phase change material which is supplied in an easy to use tabulated pad form. In the application the material undergoes a phase... | |
| Hi-Flow 625 is a film-reinforced phase change material. The product consists of a thermally conductive 65°C phase change compound coated on PEN film. Hi-Flow 625 is designed to be used... | |
| Hi-Flow 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side.The polyimide film provides a high dielectric strength and high... | |
| In addition to excellent heat transfer and dielectric properties, Sil-Pad 980 is specially formulated for high resistance to crushing and cut-through typically found in high-pressure applications where surface imperfections such... | |
| Liqui-Bond SA 1000 is a thermally conductive, one-part liquid silicone adhesive with a low viscosity for easy screenability. Liqui-Bond SA 1000 features a high thermal performance and maintains it’s structure... | |
| Liqui-Bond SA 1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer. The adhesive is supplied as a one-part liquid component, offered in a tube... | |
| Liqui-Bond SA 2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding elastomer. Liqui-Bond SA 2000 is supplied as a one-part liquid component, in either... | |
| Liqui-Bond® EA 1805 is a two-component, epoxy based, liquid-dispensable adhesive. Liqui-Bond® EA 1805 has a thermal conductivity of 1.8 W/mK. Liqui-Bond® EA 1805 will be supplied in a two-component format,... | |
| Liqui-Bond® SA 3505 is a higher performance, thermally conductive, liquid adhesive. This material is supplied as a two-part material and requires no refrigeration. The mixed material cures at elevated temperatures. | |
| Liqui-Form® 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework. Liqui-Form® 2000... | |
| LOCTITE ABLESTIK ABP 2030SCR conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between... | |
| LOCTITE ABLESTIK ICP 3540 Isotropic conductive paste | |
| LOCTITE ECCOBOND DS 6601 epoxy hybrid is specially designed for use as the main sealant in narrow bezel LCD ODF panel assembly applications. KEY BENEFITS: One component Good curing at... | |
| LOCTITE ECCOBOND DS 8027LV is a non-conductive epoxy perimeter sealant designed to be used in display applications, such as OLED and E-paper. | |
| LOCTITE ECCOBOND NCP 5208 is a non-conductive paste for thermal compression bonding processes in flip chip to laminate assembly. It is designed for advanced flip chip Cu pillar applications. It... | |
| LOCTITE ECCOBOND UV 9061F is a no flow, UV/moisture cure encapsulant designed for local circuit board protection. This product is fluorescent when viewed with ultraviolet (black) light. | |
| LOCTITE ECI 5004 E & C two component, electrically and thermally conductive adhesive is designed to cure at ambient temperatures. LOCTITE ECI 5004 E & C is a screen printable... | |
| LOCTITE TCP 8010 thermal grease is recommended for use in assembly of parts requiring high temperature heat transfer. It is used between heat generating devices and the surfaces to which... | |
| LOCTITE® ABLESTIK ABP 2035SCR™ non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between... | |
| Loctite® Liquid Optically Clear Adhesives (LOCAs) for cover lens bonding, touch panel sensor assembly and direct bonding applications in touch panel and display devices including mobile phones, tablets, monitors, televisions... | |
| Poly-Pad 1000 is a fiberglass-based insulator coated with a filled polyester resin. The mterial offers superior thermal resistance for high performance applications. Polyester-based, thermally conductive insulators from Bergquist provide a... | |
| Poly-Pad 400 is a fiberglass-reinforce d insulator coated with a filled polyester resin. Poly-Pad 400 is economical and designed for most standard applications. Polyester-based, thermally conductive insulators from Bergquist provide... | |
| Poly-Pad K-10 is a composite of film coated with a polyester resin. The material offers superior thermal performance for your most critical applications with a thermal resistance of 0.2°C-in2/W as... | |
| Poly-Pad K-4 is a composite of film coated with a polyester resin. The material is an economical insulator and the film carrier provides excellent dielectric and physical strength. Polyester-based, thermally... | |
| Q-Pad II is a composite of aluminum foil coated on both sides with thermally / electrically conductive Sil-Pad rubber. The material is designed for those applications in which maximum heat... | |
| Sil-Pad 1100ST (Soft Tack) is a fiberglass-reinforce d thermal interface material featuring inherent tack on both sides. The material exhibits excellent thermal performance at low mounting pressures. The material is... | |
| Sil-Pad 1200 is a silicone based, fiberglass-reinforce d thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use,... | |
| Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding aerospace and commercial applications. Sil-Pad 2000 is a silicone elastomer formulated to maximize the thermal and dielectric performance... | |
| Sil-Pad 400 is a composite of silicone rubber and fiberglass. The material is flame retardant and is specially formulated for use as a thermally conductive insulator. The primary use for... | |
| Sil-Pad A2000 is a conformable elastomer with very high thermal conductivity that acts as a thermal interface between electrical components and heat sinks. Sil-Pad A2000 is for applications where optimal... | |
| Sil-Pad K-4 uses a specially developed film which has high thermal conductivity, high dielectric strength and is very durable. Sil-Pad K-4 combines the thermal transfer properties of well-known Sil-Pad rubber... | |
| Sil-Pad K-6 is a medium performance, film-based thermally conductive insulator. The film is coated with a silicone elastomer to deliver high performance and provide a continuous, physically strong dielectric barrier... | |
| SPT 1000 (Sil-Pad Tube) provides thermally conductive insulation for clip mounted plastic power packages. Sil-Pad Tubes are made of silicone rubber with high thermal conductivity. Sil-Pad Tube 1000 is best... | |
| SPT 400 (Sil-Pad Tube) provides thermally conductive insulation for clip mounted plastic power packages. Sil-Pad Tubes are made of silicone rubber with high thermal conductivity. Sil-Pad Tube 400 is ideal... | |
| SPT 400 and SPT 1000 (Sil-Pad Tubes) provide thermally conductive insulation for clip mounted plastic power packages. Sil-Pad Tubes are made of silicone rubber with high thermal conductivity. Sil-Pad Tube... | |
| The new Gap Pad 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensative applications. The material is ideal for applications with high standoff and flatness tolerances. | |
| The Sil-Pad 800 family of thermally conductive insulation materials is designed for applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component... | |
| The true workhorse of the Sil-Pad product family, Sil-Pad 900S thermally conductive insulation material, is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These... | |
| Thermal Clad Metal Core PCB’s (MCPCB’s) minimize thermal impedance and conduct heat more effectively than standard printed wiring boards (PWB's).These substrates are more mechanically robust than thick-film ceramic and direct... | |
| TIC 1000A is a high performance, thermally conductive compound intended for use as a thermal interface material between a high end computer processor and a heat sink. Other high watt... | |
| TIC 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based heat sink. Other high watt density applications... | |
| With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting... |
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