Henkel Corporation - Electronics Datasheets for Thermal Compounds and Thermal Interface Materials

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more

Product Name Notes
(Known as Ablebond 8700K (5.4g) ) LOCTITE ABLESTIK 8700K is a high thermal conductivity, low temperature curing, microelectronics grade adhesive.
(Known as ABLESTIK ABLEBOND AAA3131A ) LOCTITE ABLESTIK AAA 3131A die attach is electrically and thermally conductive recommended for package types which require very low electrical resistivity. It is snap...
(Known as Ablestik ABLECOAT 8008HT ) LOCTITE ABLESTIK 8008HT is a high thermal conductivity snap cure adhesive utilizing wafer backside coating technology.
(Known as Ablestik ABLEFILM 5020K ) LOCTITE ABLESTIK 5020K is a high purity adhesive with excellent adhesion to gold-plated surfaces, particularly suited for use in hermetic packages. It is certified...
(Known as Ablestik ABLEFILM 506 ) LOCTITE ABLESTIK ECF 506 is a flexible film adhesive designed for bonding TCE mismatched materials. Slight tack can simplify assembly.
(Known as Ablestik ABLEFILM 550 ) LOCTITE ABLESTIK 550 is a high strength adhesive that bonds well to gold and other difficult bonding surfaces.
(Known as Ablestik ABLEFILM 550K ) LOCTITE ABLESTIK 550K combines high adhesion strength with very good thermal conductivity in a fiberglass supported film adhesive available in a wide range of...
(Known as ABLESTIK ABLEFILM 561 ) LOCTITE ABLESTIK 561 is a thermally conductive epoxy film designed for bonding materials with mismatched coefficients of thermal expansion.
(Known as Ablestik ABLEFILM 561K ) High adhesion strength with excellent flexibility for bonding mismatched CTE materials.
(Known as Ablestik ABLEFILM 563K ) LOCTITE ABLESTIK 563K is an electrically insulating film with high thermal conductivity and adhesion strength. Available either unsupported or with a fiberglass carrier.
(Known as Ablestik ABLEFILM 566K ) LOCTITE ABLESTIK 566K offers low temperature cure in a thermally conductive adhesive with excellent flexibility and adhesion.
(Known as Ablestik ABLEFILM 566KAPTON ) LOCTITE ABLESTIK 566KAP contains a polyamide carrier providing high insulation resistance. With a low temperature cure and excellent flexibility it is particularly suitable for...
(Known as Ablestik ABLEFILM ECF568 ) LOCTITE ABLESTIK ECF 568 was designed for low temperature cure applications. It has superior adhesion to most surfaces.
(Known as ABLESTIK ABP-8910T ) LOCTITE ABLESTIK ABP 8910T die attach adhesive is formulated with a medium modulus using hybrid chemistry and is targeted for use on medium to large...
(Known as Abletherm 2600AT ) LOCTITE ABLESTIK 2158 adhesive is designed for thermal management applications requiring high heat extraction from the die such as high power and discrete devices. This...
(Known as HYSOL ECCOBOND 281 epoxy paste ) LOCTITE ABLESTIK 281 is a thermally conductive and electrically insulating, one component filled thixotropic paste. It is suitable for use on a...
(Known as Hysol ECCOBOND E8502-1 ) LOCTITE ABLESTIK E 8502-1 is a low modulus, thermally conductive, modified epoxy adhesive is ideally suited for management of large CTE mismatch & bonding...
(Known as Hysol FP5001 ) LOCTITE ECCOBOND FP5001 is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent...
(Known as Hysol FP5300 ) LOCTITE ECCOBOND FP5300 has excellent adhesion strength to 2- and 3-layer flex and Iaminates. Low temp cure ACP. For use on RFID, Misc, Assembly.
(Known as Hysol QMI529HT-5DLT ) LOCTITE ABLESTIK QMI529HT is used for component or die attach where very high electrical and thermal conductivity are required. Suitable for high heat dissipation devices...
(Known as Hysol QMI536HT ) LOCTITE ABLESTIK QMI536HT(BORON) is a high thermal version of QMI536 and is ideal for mixed stacked die applications. Non-die damaging filler.
(Known as Hysol STYCAST TC4 ) LOCTITE TC 4 is a thermally conductive, high temperature silicone thermal grease.
(Known as Hysol STYCAST TC8M ) LOCTITE TC 8M is a thermally conductive, high temperature silicone thermal grease.
(Known as LOCTITE Thermstrate 2000 Phase Change ) LOCTITE TCF 1000 AL is a phase change thermal interface material suitable for use between a heat sink and a variety of...
Eccobond E3503-1 is optimised for SMT dispense and the manufacturing of high volume assemblies. It has high adhesion to the substrate finishes commonly used in microelectronics and will not adversely...
Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on...
Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and...
Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads.The material is fiberglass reinforced for improved puncture resistance and handling characteristics. Gap Pad...
Gap Pad 2000S40 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill...
Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap...
Gap Pad 5000S35 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability.The fiberglass reinforcement provides easy handling...
Gap Pad A2000 acts as a thermal interface and electrical insulator between electrical components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is...
Gap Pad A3000 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. Gap Pad...
Gap Pad EMI 1.0 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies...
Gap Pad HC 1000 is an extremely conformable, low modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows...
Gap Pad VO is a cost effective thermally conductive interface. The material is a filled thermally conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling.
Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on...
Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low stress vibration...
Gap Pad VO Ultra Soft-B is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening...
Gap Pad® 1000HD was designed to with-stand applications requiring high durability. The coated polyimide carrier on one side of the material allows easy rework, excellent handling characteristics and puncture resistance.
Gap Pad® 1450 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a permanent liner, which facilitates rework and improves puncture resistance...
Gap Pad® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to...
Gap Pad® 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. Gap Pad® 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap...
Gap Pad® 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due...
Gap Pad® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a...
GAP PAD™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to...
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT...
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT...
HYSOL ECCOBOND 281 BLK one component epoxy adhesive is formualted for use in applications requiring excellent thermal conductivity. It has high thermal conductivity, good chemical resistance and is electrically insulating.
Isostrate™ is an electrically isolating phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as a...
Liqui-Bond SA 1000 is a thermally conductive, one-part liquid silicone adhesive with a low viscosity for easy screenability. Liqui-Bond SA 1000 features a high thermal performance and maintains it’s structure...
Liqui-Bond SA 1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer. The adhesive is supplied as a one-part liquid component, offered in a tube...
Liqui-Bond SA 2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding elastomer. Liqui-Bond SA 2000 is supplied as a one-part liquid component, in either...
Liqui-Bond® EA 1805 is a two-component, epoxy based, liquid-dispensable adhesive. Liqui-Bond® EA 1805 has a thermal conductivity of 1.8 W/mK. Liqui-Bond® EA 1805 will be supplied in a two-component format,...
Liqui-Bond® SA 3505 is a higher performance, thermally conductive, liquid adhesive. This material is supplied as a two-part material and requires no refrigeration. The mixed material cures at elevated temperatures.
Liqui-Form® 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework. Liqui-Form® 2000...
LOCTITE 3873 is a fast curing, high-conductivity, self-shimming for bonding heat-generated devices to thermal spreader.
LOCTITE 3874 is a fast-curing, high-conductivity for bonding heat-generated devices to thermal spreader without glass beads.
LOCTITE ABLESTIK 3880 is designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required.
LOCTITE ISOSTRATE 2000 electrically conductive isolating phase change thermal interface material is suitable for use between a heat sink and a variety of heat dissipating components. It is supplied as...
LOCTITE NSWC100 is a non-silicone, water cleanable thermal compound.
LOCTITE Powerstrate Xtreme (PSX) is a reworkable unsupported film with superior thermal performance even at low pressure. Direct attach to heat sink at room temperature without adhesive. Also available in...
LOCTITE PSX-D (Powerstrate Xtreme) is a repeatable phase change thermal interface material. Supplied as a paste that can be stenciled, needle dispensed, screen printed or applied manually onto a heat...
LOCTITE PSX-D-LV (Powerstrate Xtreme) is a reworkable and repeatable phase change thermal interface material. It offers the enhanced performance and reliability of a phase change thermal interface material with the...
LOCTITE PSX-Pm (Medium Dry) (Powerstrate Xtreme) is a reworkable and repeatable phase change material. It offers enhanced performance and reliability with the application ease of thermal grease. Also available other...
Loctite Silverstrate is an electrically conductive phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as...
LOCTITE TAF 8800 is a heat absorbing material designed to reduce the skin temperature of mobile electronic devices. It can effectively absorb, spread, insulate and slowly dissipate thermal energy generated...
One component, low temperature curing thermally conductive epoxy adhesive.
Poly-Pad 1000 is a fiberglass-based insulator coated with a filled polyester resin. The mterial offers superior thermal resistance for high performance applications. Polyester-based, thermally conductive insulators from Bergquist provide a...
Poly-Pad 400 is a fiberglass-reinforced insulator coated with a filled polyester resin. Poly-Pad 400 is economical and designed for most standard applications. Polyester-based, thermally conductive insulators from Bergquist provide a...
Poly-Pad K-10 is a composite of film coated with a polyester resin. The material offers superior thermal performance for your most critical applications with a thermal resistance of 0.2°C-in2/W as...
Poly-Pad K-4 is a composite of film coated with a polyester resin. The material is an economical insulator and the film carrier provides excellent dielectric and physical strength. Polyester-based, thermally...
Recommended for high-temperature heat transfer in normal applications. It is used between heat generating devices and the surfaces to which they are mounted or other heat dissipating surfaces. This product...
The new Gap Pad 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensative applications. The material is ideal for applications with high standoff and flatness tolerances.
Unique product resulting from blend of thermoset and thermoplastic resins.