Henkel Corporation - Electronics Datasheets for Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more
Product Name | Notes |
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(Known as Ablebond 8700K (5.4g) ) LOCTITE ABLESTIK 8700K is a high thermal conductivity, low temperature curing, microelectronics grade adhesive. | |
(Known as ABLESTIK ABLEBOND AAA3131A ) LOCTITE ABLESTIK AAA 3131A die attach is electrically and thermally conductive recommended for package types which require very low electrical resistivity. It is snap... | |
(Known as Ablestik ABLECOAT 8008HT ) LOCTITE ABLESTIK 8008HT is a high thermal conductivity snap cure adhesive utilizing wafer backside coating technology. | |
(Known as Ablestik ABLEFILM 5020K ) LOCTITE ABLESTIK 5020K is a high purity adhesive with excellent adhesion to gold-plated surfaces, particularly suited for use in hermetic packages. It is certified... | |
(Known as Ablestik ABLEFILM 506 ) LOCTITE ABLESTIK ECF 506 is a flexible film adhesive designed for bonding TCE mismatched materials. Slight tack can simplify assembly. | |
(Known as Ablestik ABLEFILM 550 ) LOCTITE ABLESTIK 550 is a high strength adhesive that bonds well to gold and other difficult bonding surfaces. | |
(Known as Ablestik ABLEFILM 550K ) LOCTITE ABLESTIK 550K combines high adhesion strength with very good thermal conductivity in a fiberglass supported film adhesive available in a wide range of... | |
(Known as ABLESTIK ABLEFILM 561 ) LOCTITE ABLESTIK 561 is a thermally conductive epoxy film designed for bonding materials with mismatched coefficients of thermal expansion. | |
(Known as Ablestik ABLEFILM 561K ) High adhesion strength with excellent flexibility for bonding mismatched CTE materials. | |
(Known as Ablestik ABLEFILM 563K ) LOCTITE ABLESTIK 563K is an electrically insulating film with high thermal conductivity and adhesion strength. Available either unsupported or with a fiberglass carrier. | |
(Known as Ablestik ABLEFILM 566K ) LOCTITE ABLESTIK 566K offers low temperature cure in a thermally conductive adhesive with excellent flexibility and adhesion. | |
(Known as Ablestik ABLEFILM 566KAPTON ) LOCTITE ABLESTIK 566KAP contains a polyamide carrier providing high insulation resistance. With a low temperature cure and excellent flexibility it is particularly suitable for... | |
(Known as Ablestik ABLEFILM ECF568 ) LOCTITE ABLESTIK ECF 568 was designed for low temperature cure applications. It has superior adhesion to most surfaces. | |
(Known as ABLESTIK ABP-8910T ) LOCTITE ABLESTIK ABP 8910T die attach adhesive is formulated with a medium modulus using hybrid chemistry and is targeted for use on medium to large... | |
(Known as Abletherm 2600AT ) LOCTITE ABLESTIK 2158 adhesive is designed for thermal management applications requiring high heat extraction from the die such as high power and discrete devices. This... | |
(Known as HYSOL ECCOBOND 281 epoxy paste ) LOCTITE ABLESTIK 281 is a thermally conductive and electrically insulating, one component filled thixotropic paste. It is suitable for use on a... | |
(Known as Hysol ECCOBOND E8502-1 ) LOCTITE ABLESTIK E 8502-1 is a low modulus, thermally conductive, modified epoxy adhesive is ideally suited for management of large CTE mismatch & bonding... | |
(Known as Hysol FP5001 ) LOCTITE ECCOBOND FP5001 is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent... | |
(Known as Hysol FP5300 ) LOCTITE ECCOBOND FP5300 has excellent adhesion strength to 2- and 3-layer flex and Iaminates. Low temp cure ACP. For use on RFID, Misc, Assembly. | |
(Known as Hysol QMI529HT-5DLT ) LOCTITE ABLESTIK QMI529HT is used for component or die attach where very high electrical and thermal conductivity are required. Suitable for high heat dissipation devices... | |
(Known as Hysol QMI536HT ) LOCTITE ABLESTIK QMI536HT(BORON) is a high thermal version of QMI536 and is ideal for mixed stacked die applications. Non-die damaging filler. | |
(Known as Hysol STYCAST TC4 ) LOCTITE TC 4 is a thermally conductive, high temperature silicone thermal grease. | |
(Known as Hysol STYCAST TC8M ) LOCTITE TC 8M is a thermally conductive, high temperature silicone thermal grease. | |
(Known as LOCTITE Thermstrate 2000 Phase Change ) LOCTITE TCF 1000 AL is a phase change thermal interface material suitable for use between a heat sink and a variety of... | |
Eccobond E3503-1 is optimised for SMT dispense and the manufacturing of high volume assemblies. It has high adhesion to the substrate finishes commonly used in microelectronics and will not adversely... | |
Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on... | |
Gap Pad 1500R has the same highly conformable, low modulus polymer as the standard Gap Pad 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and... | |
Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads.The material is fiberglass reinforced for improved puncture resistance and handling characteristics. Gap Pad... | |
Gap Pad 2000S40 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill... | |
Gap Pad 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap... | |
Gap Pad 5000S35 is a fiberglass-reinforce d filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability.The fiberglass reinforcement provides easy... | |
Gap Pad A2000 acts as a thermal interface and electrical insulator between electrical components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is... | |
Gap Pad A3000 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. Gap Pad... | |
Gap Pad EMI 1.0 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies... | |
Gap Pad HC 1000 is an extremely conformable, low modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows... | |
Gap Pad VO is a cost effective thermally conductive interface. The material is a filled thermally conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling. | |
Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on... | |
Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low stress vibration... | |
Gap Pad VO Ultra Soft-B is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening... | |
Gap Pad® 1000HD was designed to with-stand applications requiring high durability. The coated polyimide carrier on one side of the material allows easy rework, excellent handling characteristics and puncture resistance. | |
Gap Pad® 1450 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a permanent liner, which facilitates rework and improves puncture resistance... | |
Gap Pad® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to... | |
Gap Pad® 3004SF is high performance, 3.0 W/m-K, thermally conductive gap filling material. Gap Pad® 3004SF is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. Gap... | |
Gap Pad® 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due... | |
Gap Pad® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a... | |
GAP PAD™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to... | |
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT... | |
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT... | |
HYSOL ECCOBOND 281 BLK one component epoxy adhesive is formualted for use in applications requiring excellent thermal conductivity. It has high thermal conductivity, good chemical resistance and is electrically insulating. | |
Isostrate™ is an electrically isolating phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as a... | |
Liqui-Bond SA 1000 is a thermally conductive, one-part liquid silicone adhesive with a low viscosity for easy screenability. Liqui-Bond SA 1000 features a high thermal performance and maintains it’s structure... | |
Liqui-Bond SA 1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer. The adhesive is supplied as a one-part liquid component, offered in a tube... | |
Liqui-Bond SA 2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding elastomer. Liqui-Bond SA 2000 is supplied as a one-part liquid component, in either... | |
Liqui-Bond® EA 1805 is a two-component, epoxy based, liquid-dispensable adhesive. Liqui-Bond® EA 1805 has a thermal conductivity of 1.8 W/mK. Liqui-Bond® EA 1805 will be supplied in a two-component format,... | |
Liqui-Bond® SA 3505 is a higher performance, thermally conductive, liquid adhesive. This material is supplied as a two-part material and requires no refrigeration. The mixed material cures at elevated temperatures. | |
Liqui-Form® 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework. Liqui-Form® 2000... | |
LOCTITE 3873 is a fast curing, high-conductivity, self-shimming for bonding heat-generated devices to thermal spreader. | |
LOCTITE 3874 is a fast-curing, high-conductivity for bonding heat-generated devices to thermal spreader without glass beads. | |
LOCTITE ABLESTIK 3880 is designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required. | |
LOCTITE ISOSTRATE 2000 electrically conductive isolating phase change thermal interface material is suitable for use between a heat sink and a variety of heat dissipating components. It is supplied as... | |
LOCTITE NSWC100 is a non-silicone, water cleanable thermal compound. | |
LOCTITE Powerstrate Xtreme (PSX) is a reworkable unsupported film with superior thermal performance even at low pressure. Direct attach to heat sink at room temperature without adhesive. Also available in... | |
LOCTITE PSX-D (Powerstrate Xtreme) is a repeatable phase change thermal interface material. Supplied as a paste that can be stenciled, needle dispensed, screen printed or applied manually onto a heat... | |
LOCTITE PSX-D-LV (Powerstrate Xtreme) is a reworkable and repeatable phase change thermal interface material. It offers the enhanced performance and reliability of a phase change thermal interface material with the... | |
LOCTITE PSX-Pm (Medium Dry) (Powerstrate Xtreme) is a reworkable and repeatable phase change material. It offers enhanced performance and reliability with the application ease of thermal grease. Also available other... | |
Loctite Silverstrate is an electrically conductive phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as... | |
LOCTITE TAF 8800 is a heat absorbing material designed to reduce the skin temperature of mobile electronic devices. It can effectively absorb, spread, insulate and slowly dissipate thermal energy generated... | |
One component, low temperature curing thermally conductive epoxy adhesive. | |
Poly-Pad 1000 is a fiberglass-based insulator coated with a filled polyester resin. The mterial offers superior thermal resistance for high performance applications. Polyester-based, thermally conductive insulators from Bergquist provide a... | |
Poly-Pad 400 is a fiberglass-reinforce d insulator coated with a filled polyester resin. Poly-Pad 400 is economical and designed for most standard applications. Polyester-based, thermally conductive insulators from Bergquist provide... | |
Poly-Pad K-10 is a composite of film coated with a polyester resin. The material offers superior thermal performance for your most critical applications with a thermal resistance of 0.2°C-in2/W as... | |
Poly-Pad K-4 is a composite of film coated with a polyester resin. The material is an economical insulator and the film carrier provides excellent dielectric and physical strength. Polyester-based, thermally... | |
Recommended for high-temperature heat transfer in normal applications. It is used between heat generating devices and the surfaces to which they are mounted or other heat dissipating surfaces. This product... | |
The new Gap Pad 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensative applications. The material is ideal for applications with high standoff and flatness tolerances. | |
Unique product resulting from blend of thermoset and thermoplastic resins. |