Henkel Corporation - Electronics Hysol E1172A 8799536447489

Description
An innovative non-reworkable capillary flow underfill. Hysol E1172A is a fast flow, snap cure underfill. It is a one-component epoxy chemistry that is non-anhydride curing for enhanced moisture resistance.
Description
An innovative non-reworkable capillary flow underfill. Hysol E1172A is a fast flow, snap cure underfill. It is a one-component epoxy chemistry that is non-anhydride curing for enhanced moisture resistance.

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Hysol E1172A 8799536447489
An innovative non-reworkable capillary flow underfill. Hysol E1172A is a fast flow, snap cure underfill. It is a one-component epoxy chemistry that is non-anhydride curing for enhanced moisture resistance.

An innovative non-reworkable capillary flow underfill. Hysol E1172A is a fast flow, snap cure underfill. It is a one-component epoxy chemistry that is non-anhydride curing for enhanced moisture resistance.

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Technical Specifications

  Henkel Corporation - Electronics
Product Category Encapsulants and Potting Compounds
Product Number 8799536447489
Product Name Hysol E1172A
Form / Function Gap Filler, Foam in Place Gasket
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