An innovative non-reworkable capillary flow underfill. Hysol E1172A is a fast flow, snap cure underfill. It is a one-component epoxy chemistry that is non-anhydride curing for enhanced moisture resistance.
| Henkel Corporation - Electronics | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | 8799536447489 |
| Product Name | Hysol E1172A |
| Form / Function | Gap Filler, Foam in Place Gasket |
