Henkel Corporation - Electronics LOCTITE ABLESTIK 2332-17 (Known as HYSOL ECCOBOND 2332-17) 8799574523905

Description
(Known as HYSOL ECCOBOND 2332-17 ) LOCTITE ABLESTIK 2332-17 is a solventless one component epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to 130°C. It combines flexibility at low temperatures plus high peel and tensile shear strength over a broad temperature range.
Description
(Known as HYSOL ECCOBOND 2332-17 ) LOCTITE ABLESTIK 2332-17 is a solventless one component epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to 130°C. It combines flexibility at low temperatures plus high peel and tensile shear strength over a broad temperature range.

Suppliers

Company
Product
Description
Supplier Links
LOCTITE ABLESTIK 2332-17 (Known as HYSOL ECCOBOND 2332-17) - 8799574523905 - Henkel Corporation - Electronics
Irvine, CA, USA
LOCTITE ABLESTIK 2332-17 (Known as HYSOL ECCOBOND 2332-17)
8799574523905
LOCTITE ABLESTIK 2332-17 (Known as HYSOL ECCOBOND 2332-17) 8799574523905
(Known as HYSOL ECCOBOND 2332-17 ) LOCTITE ABLESTIK 2332-17 is a solventless one component epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to 130°C. It combines flexibility at low temperatures plus high peel and tensile shear strength over a broad temperature range.

(Known as HYSOL ECCOBOND 2332-17 )

LOCTITE ABLESTIK 2332-17 is a solventless one component epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to 130°C. It combines flexibility at low temperatures plus high peel and tensile shear strength over a broad temperature range.

Supplier's Site

Technical Specifications

  Henkel Corporation - Electronics
Product Category Industrial Adhesives
Product Number 8799574523905
Product Name LOCTITE ABLESTIK 2332-17 (Known as HYSOL ECCOBOND 2332-17)
Industry Electronics
Unlock Full Specs
to access all available technical data

Similar Products

TAKELAC™ Polyurethane Adhesives -  - Mitsui Chemicals America, Inc.
Mitsui Chemicals America, Inc.
Specs
Chemical System Polyurethane
View Details
UV-Curing Epoxy, NOA 85, 6 gm Syringe - NOA-85S - Newport MKS
Specs
Cure / Technology UV or Radiation Cured
Chemical System Epoxy
View Details
Fluon® Perfluoro Adhesive - EA-2000 - AGC Chemicals Americas, Inc.
AGC Chemicals Americas, Inc.
Specs
Chemical System PFA
Type / Form Pellets
Features Laminaes
View Details
Thermal pad for chipset - SF800 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature -58 to 302 F (-50 to 150 C)
View Details