Henkel Corporation - Electronics Datasheets for Solder

Solders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together.
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Product Name Notes
(Known as Multicore 381 ) LOCTITE 381 cored wire has been specially formulated to conform to the QQ-S-571E type Rosin-based Mildly Activated (RMA) specification, and can be used in electronic...
(Known as Multicore C400 Flux Cored Wire ) LOCTITE C 400 cored solder wire has been specially formulated to complement no clean wave and reflow soldering processes. Multicore C400 wires...
(Known as Multicore C502 Cored Wire ) LOCTITE C 502 cored solder wire has been specially formulated to complement no clean wave and reflow soldering processes. LOCTITE C 502 is...
(Known as Multicore C511 ) LOCTITE C 511 cored solder wire has been specially formulated to compliment no clean wave and reflow soldering processes. It is available in several tin/lead...
(Known as MULTICORE CR32 ) LOCTITE CR32 is a no clean, type L solder paste. It has been formulated as a modest residue level product for printing and reflow in...
(Known as MULTICORE CR37 solder paste ) LOCTITE CR 37 solder paste is suitable for most assembly processes. It is suited to meet the demands of high volume production which...
(Known as MULTICORE HF108 ) LOCTITE HF 108 is a halogen-free, no clean, low voiding Pb-free solder paste development product. HF108 also shows excellent humidity resistance and solderability when reflowed...
(Known as Multicore HF200 ) LOCTITE HF 200 is a Halogen-free, no clean, low voiding Pb-free solder paste. It shows excellent humidity resistance and solderability when reflowed in both air...
(Known as Multicore LF318 No-Clean Solder Paste: Lead-Free (96SC AGS 88.5) ) LOCTITE LF 318 96SCAGS88.5 BU is a halide-free, no clean, pin testable Pb-free solder paste which has excellent...
(Known as Multicore LF318 No-Clean Solder Paste: Lead-Free (97SC AGS 88.5) ) LOCTITE LF 318 97SCAGS88.5 BU is a halide-free, no clean, pin testable Pb-free solder paste which has excellent...
(Known as Multicore LF318 No-Clean Solder Paste: Lead-Free (97SC AGS 88.5V) ) LOCTITE LF 318M is a halide-free, no clean, pin testable Pb-free solder paste which has excellent humidity resistance...
(Known as MULTICORE LF318M ) LOCTITE LF 318M is a halide-free, no clean, low voiding Pb-free solder paste which has excellent humidity resistance and a broad process window both for...
(Known as Multicore LF700 ) LOCTITE LF 700 is a halide-free, no clean, Pb-free solder paste with a broad process window for printing, reflow and humidity resistance.
(Known as Multicore LF721 ) LOCTITE LF 721 is a halide-free, no clean, low voiding Pb free solder paste which has excellent humidity resistance and a broad process window for...
(Known as Multicore MP218 No-Clean Solder Paste: High humidity and temperature resistance ) LOCTITE MP 218 is a halide-free, no-clean, pin testable solder paste which has excellent humidity resistance and...
(Known as the Game Changer ) In what is a true market breakthrough, Henkel has developed the first-ever temperature stable solder paste. LOCTITE GC 10 is stable at 26.5 °C...
LOCTITE HF 212 Applications Solder Paste for Medium and Large Board Assemblies LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High...
Flux designed for solder die attach paste applications. Effective thermal control for Cu leadframe power semiconductor devices, such as rectifiers, power transistors, and for automorive and consumer packages.
Halide-free, no clean, low voiding Pb-free solder paste, which has excellent humidity resistance and a broad process window both for printing and reflow. LF730 has been formulated to give low...
Halide-free, No-clean, Pb-freeDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in SnPb...
Halide-free, No-clean, Pb-freePb-free solder paste with excellent resistance to solder balling and suitable for fine pitch, stencil printing applications.Also available in SnPb formulation
Halide-free, No-clean, SnPbDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in Pb-free...
Halide-free, No-clean, SnPbSnPb solder paste with excellent resistance to solder balling and suitable for fine pitch, stencil printing applications.Also available in Pb-free formulation
Halide-free, No-clean, SnPbSnPb, halide-free solder paste designed for high speed printing. Extended printed open time and tack life. Resistant to both hot and cold slump.
Halide-free, No-clean, SnPbSnPb, halide-free, high activity solder paste that displays resistance to high temperature and humidity environments. Suitable for a large range of assembly processes, including rheo pump, proflow, large,...
Halogen-free, No-clean, Pb-freeDispensing grade, halogen and Pb-free solder paste with exceptional dot-to-dot consistency, colorless residues and high-speed dispense capability with zero slump.
Halogen-free, No-clean, Pb-freeHalogen and Pb-free solder paste designed for medium to large boards. Excellent solderability over a wide reflow operating window in both air and nitrogen across a wide range...
Halogen-free, No-clean, Pb-freeHigh tack, low voiding solder paste designed for medium to large boards. Robust reflow process window with exceptional solderability across a wide range of challenging surfaces finishes including...
Halogen-free, No-clean, Pb-freeHigh tack, low voiding solder paste suitable for high speed printing. Excellent solderability over a wide reflow operating window in both air and nitrogen across a wide range...
Halogen-free, No-clean, Pb-freeIndustry-leading solder paste in paste-transfer efficiency. Improved stability at different storage and operating temperatures, with extended stencil life up to 72 hours and extended abandon time up to...
Halogen-free, Pb-free, Water WashRoHS-compliant solder paste with excellent resistance in high humidity. Improved stability at different storage and operating temperatures, with extended stencil life over 24 hours. Suitable for high-density,...
Halogen-free, SnPb, Water WashSnPb water washable, halogen-free solder paste with excellent resistance to solder balling, humidity and slump. Residues can be removed with aqueous cleaner followed by deionized water for...
LOCTITE MULTICORE HF 250DP is a type 5, halogen-free, lead-free, low-voiding solder paste with outstanding dispense characteristics. Exceptional dot-to-dot consistency, colorless residues and high speed dispense capability with zero slump...
MULTICORE 97SC (SAC305) alloy is designed to be a lead free substitute for tin/lead alloys in most electronics assembly soldering operations. It meets or exceeds QQ-S-571, J-STD-006 and JIS Z...
Multicore DA100 is a flux designed for solder die attach paste applications. >> DA100 Solder Paste Informational Video >> Multicore DA100 Solder Paste Chinese Version
MULTICORE HF208 is a halogen-free, no clean, low voiding Pb-free solder paste. It shows excellent humidity resistance and solderability when reflowed in both air and nitrogen across a wide range...
MULTICORE Hydro-X water soluble flux cored solder wires are suitable for use in normal hand soldering operations where the components have been assessed as being able to withstand the necessary...
Multicore LF318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste which has excellent humidity resistance and a broad process window both for reflow and printing. View...
MULTICORE LF328 is a halide-free no-clean Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Offers high tack to resist component...
MULTICORE LF600 is a halide-free, no-clean, solder paste that exhibits excellent thermal stability; it is capable of being print cycled on 0.5 mm pitch CSP apertures for 24 hours in...
MULTICORE MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both air and nitrogen. It has been formulated to have increased...
MulticoreLF328 is a halide-free no-clean Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Offers high tack to resist component movement...
No-clean, Pb-freePb-free solder paste designed for low-temperature, Pb-free solder alloys. This material is formulated to provide excellent dispensability, printability and solderability through various reflow profiles.
No-clean, SnPbSnPb, halide-containing solder paste formulated for dispensing or printing and reflow in air, where process yield is critical. Offers excellent open time, good soldering activity, especially on OSP copper.
Pb-free, Water WashPb-free water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. This material offers excellent open time and good soldering...
SnPb, Water WashSnPb water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. This material offers excellent open time, greatly extended abandon...
This halide-free, no-clean and Pb-free solder paste has an excellent humidity resistance and a broad process window for both reflow and printing. It offers high tack to resist component movement...