Henkel Corporation - Electronics Loctite 3551 8799403081729

Description
Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.
  • Loctite 3551 - 8799403081729 - Henkel Corporation - Electronics
    Henkel Corporation - Electronics
Description
Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.

Suppliers

Company
Product
Description
Supplier Links
Loctite 3551 - 8799403081729 - Henkel Corporation - Electronics
Henkel Corporation - Electronics
Irvine, CA, USA
Loctite 3551
8799403081729
Loctite 3551 8799403081729
Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.

Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.

Supplier's Site

Technical Specifications

  Henkel Corporation - Electronics
Product Category Electrical and Electronic Resins
Product Number 8799403081729
Product Name Loctite 3551
Industry Electronics
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