Henkel Corporation - Electronics Loctite 3551 8799403081729

Description

Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.

Henkel Corporation - Electronics

Description

Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.

Suppliers

Company

Product

Description

Supplier Links

Henkel Corporation - Electronics

Irvine, CA, USA

Loctite 3551
8799403081729

Loctite 3551 8799403081729

Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.

Supplier's Site

Technical Specifications

	Henkel Corporation - Electronics
Product Category	Electrical and Electronic Resins
Product Number	8799403081729
Product Name	Loctite 3551
Industry	Electronics

Unlock Full Specs

to access all available technical data

Similar Products

CHT USA Inc.

2-Part, Silicone Gel and Encapsulant with UV Tracer

QGel-311UV

Specs

Form / Shape Gel

Industry Electronics

Cure / Technology Addition

View Details

MacDermid Alpha Electronics Solutions

Precision Camera Module Adhesive Solutions

ALPHA ® HiTech ® AD13-9521B

Specs

Form / Shape Liquid

Industry Semiconductors, IC's; Electronics

Composition Single Component

View Details

AGC Chemicals Americas, Inc.

Fluon® Perfluoro Adhesive

EA-2000

Specs

Form / Shape Pellets

Industry Electronics

Chemical System PFA

View Details

Dongguan Sheen Electronic Technology Co., Ltd.

Not dry out high thermal conductivity interface silicone grease for electrical products

SG560-30

Specs

Form / Shape Grease, Paste

Industry Electronics

Features Thermally Conductive

View Details