Henkel Corporation - Electronics Loctite 3551 8799403081729

Description

Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.

Henkel Corporation - Electronics

Description

Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.

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Company

Product

Description

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Henkel Corporation - Electronics

Irvine, CA, USA

Loctite 3551
8799403081729

Loctite 3551 8799403081729

Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.

Supplier's Site

Technical Specifications

	Henkel Corporation - Electronics
Product Category	Electrical and Electronic Resins
Product Number	8799403081729
Product Name	Loctite 3551
Industry	Electronics

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