Henkel Corporation - Electronics Datasheets for Fluxes
Fluxes are chemical compositions used in soldering, brazing and welding. They clean the metal’s surface, assist with heat transfer, and remove unwanted oxide films.
Fluxes: Learn more
Product Name | Notes |
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(Known as MULTICORE HF108RWF ) LOCTITE MULTICORE HF 108RWF is a halogen-free flux gel for rework processes in conjunction with HF 108 solder paste and can be used wherever halogen-free... | |
(Known as Multicore Hydro-X20 High Activity Flux ) LOCTITE HYDX-20 is a high activity, flux designed for the soldering of the most difficult electronic assemblies. Unique activator package enables a... | |
(Known as MULTICORE MF210 Liquid Flux ) LOCTITE MF 210 is a no clean, resin-free, halide-free liquid flux designed for surfaces with poor solderability. It is recommended for consumer electronics... | |
(Known as MULTICORE MF388 No Clean Flux ) LOCTITE MF 388 is a sustained activity in high preheats for dual wave and lead-free processes. High PTH fill, low residues. High... | |
(Known as MULTICORE MF390HR ) LOCTITE MF 390HR is an halogen free, no clean, high activity liquid flux. It can be used in spray fluxers on standard wave soldering machines. | |
(Known as Multicore TFN700B ) LOCTITE TFN 700B is a Newtonian tacky flux designed for PoP applications. The rheology has been optimized to aid process consistency where mass flux transfer... | |
(Known as Multicore WS300 TACKY FLUX ) LOCTITE WS 300 RWF BU is a water wash flux system specially formulated with fine-powder lead-free alloys. High performance, water washable solder paste. | |
(Known as Multicore X32-10I No Clean Flux ) LOCTITE X32-10i No Clean Flux is a low solids synthetic resin flux meets global demand for ultra low residue medium activity flux. | |
Halide-free, No-clean, Pb-freeDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in SnPb... | |
Halide-free, No-clean, Pb-freePb-free solder paste with excellent resistance to solder balling and suitable for fine pitch, stencil printing applications.Also available in SnPb formulation | |
Halide-free, No-clean, SnPbDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in Pb-free... | |
Halide-free, No-clean, SnPbSnPb solder paste with excellent resistance to solder balling and suitable for fine pitch, stencil printing applications.Also available in Pb-free formulation | |
Halide-free, No-clean, SnPbSnPb, halide-free solder paste designed for high speed printing. Extended printed open time and tack life. Resistant to both hot and cold slump. | |
Halide-free, No-clean, SnPbSnPb, halide-free, high activity solder paste that displays resistance to high temperature and humidity environments. Suitable for a large range of assembly processes, including rheo pump, proflow, large,... | |
Halogen-free, No-clean, Pb-freeDispensing grade, halogen and Pb-free solder paste with exceptional dot-to-dot consistency, colorless residues and high-speed dispense capability with zero slump. | |
Halogen-free, No-clean, Pb-freeHalogen and Pb-free solder paste designed for medium to large boards. Excellent solderability over a wide reflow operating window in both air and nitrogen across a wide range... | |
Halogen-free, No-clean, Pb-freeHigh tack, low voiding solder paste designed for medium to large boards. Robust reflow process window with exceptional solderability across a wide range of challenging surfaces finishes including... | |
Halogen-free, No-clean, Pb-freeHigh tack, low voiding solder paste suitable for high speed printing. Excellent solderability over a wide reflow operating window in both air and nitrogen across a wide range... | |
Halogen-free, No-clean, Pb-freeIndustry-lead ing solder paste in paste-transfer efficiency. Improved stability at different storage and operating temperatures, with extended stencil life up to 72 hours and extended abandon time up... | |
Halogen-free, Pb-free, Water WashRoHS-compliant solder paste with excellent resistance in high humidity. Improved stability at different storage and operating temperatures, with extended stencil life over 24 hours. Suitable for high-density,... | |
Halogen-free, SnPb, Water WashSnPb water washable, halogen-free solder paste with excellent resistance to solder balling, humidity and slump. Residues can be removed with aqueous cleaner followed by deionized water for... | |
MULTICORE LF721 RWF is a reworkable tacky flux designed for a wide range of electronics assembly and rework processes. It is recommended for rework processes in conjunction with MULTICORE LF721. | |
MULTICORE LM100 no clean flux solder paste is designed for use with low temperature Pb-free solder alloys. LM100 is formulated to provide excellent dispensability, printability and solderability through various reflow... | |
Multicore WS300 is a water wash flux system specially formulated with fine-powder lead-free alloys. High performance, water washable solder paste. Residues are easily removed with DI water without the need... | |
No-clean, Pb-freePb-free solder paste designed for low-temperature, Pb-free solder alloys. This material is formulated to provide excellent dispensability, printability and solderability through various reflow profiles. | |
No-clean, SnPbSnPb, halide-containing solder paste formulated for dispensing or printing and reflow in air, where process yield is critical. Offers excellent open time, good soldering activity, especially on OSP copper. | |
Non-Newtonian, no-clean halogen-free, tacky flux intended for use in application such PoP and flip-chip. | |
Pb-free, Water WashPb-free water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. This material offers excellent open time and good soldering... | |
SnPb, Water WashSnPb water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. This material offers excellent open time, greatly extended abandon... | |
Tacky flux which provides excellent moisture and environmental protection for delicate circuitry in handheld devices.Non-Newtonia n tacky flux designed for solder sphere attach in BGAs and CSPs. The rheology has... | |
This halide-free, no-clean and Pb-free solder paste has an excellent humidity resistance and a broad process window for both reflow and printing. It offers high tack to resist component movement... |