Shenzhen DeepMaterial Technologies Co., Ltd Datasheets for Industrial Adhesives
Industrial adhesives consist of hot melt adhesives, epoxy adhesives, polyurethane adhesives, sealants, thermoset adhesives, UV curing adhesives, silicon adhesives, acrylic adhesives and other related industrial products.
Industrial Adhesives: Learn more
| Product Name | Notes |
|---|---|
| Classic low-temperature curing adhesive, used for LCD backlight module assembly. | |
| DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy | |
| Deepmaterial provide customized adhesive services on your demand, custom electronic adhesives, PUR structural adhesive, UV moisture curing adhesive, epoxy adhesive, conductive silver glue, epoxy underfill adhesive, epoxy encapsulant, functional protective... | |
| Designed to bond metal and glass substrates. Typical applications include furniture (bonding stainless steel and tempered glass) and decorations (Copper bonded crystal glass). | |
| Dual-curing adhesives are specially designed for the assembly of temperature-sensitiv e electronic components. The formula of this product is to perform initial curing under ultraviolet radiation, and then perform secondary... | |
| Easy to repair, fast curing, high elongation, low hardness. | |
| Easy to repair | |
| Fast curing at low temperature, used for the assembly of CCD or CMOS components and VCM motors. This product is specifically designed for heat-sensitive applications that require low-temperature curing. It... | |
| Fast curing, high modulus, ultra-high initial adhesion, high polarity material bonding. | |
| Fast curing, high toughness, excellent heat cycle performance, low yellowing. Typical applications include bonding electronic equipment, home appliance parts and decorative components. After curing, it has excellent resistance to vibration... | |
| Fast curing, low modulus, super high initial adhesion. | |
| Fast curing, medium viscosity, suitable for bonding glass to itself and glass to the surface of many other materials. Automotive lighting components, molded glass tableware, rough glass surfaces. | |
| For gasket and sealing applications. The product has high resilience. This product is usually used from -53°C to 250°C. | |
| General label adhesive, easy to die-cut, high initial adhesion, excellent aging resistance | |
| General-purpose classic product, tough and flexible after curing, impact resistance, moisture resistance, often used for glass bonding. | |
| Glass to glass or glass to metal bonding and sealing, such as precision optical instruments, furniture and industrial equipment. The electrical properties of this product also make it suitable for... | |
| High adhesion, cold flow pressure sensitive adhesive, can be applied to tire labels | |
| High initial tack, high stickiness, excellent resistance to plasticization, used in film labels | |
| High thixotropy, suitable for filling and bonding of large gaps, suitable for materials with low surface energy and difficult to stick. Surfaces such as PTFE, PE, PP are low-energy surfaces. | |
| High toughness, excellent heat cycle performance. | |
| High-quality, high-viscosity hot-melt pressure-sensitive adhesive specially developed for TV backplane adhesives. The product has light color, low odor, excellent initial adhesion performance, good cohesion, high adhesion, and excellent high temperature... | |
| Impact resistant, reworkable is a reactive black polyurethane hot melt adhesive, cured with moisture. Long opening time, suitable for automatic or manual assembly line production. | |
| In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable for the reinforcement of printed circuit boards and... | |
| It has a long open time and good light transmittance. It can be used in scenes that cannot be cured by UV and allows for secondary moisture curing. It is... | |
| It is a conformal coating designed to provide strong protection from moisture and harsh chemicals. Compatible with industry standard solder masks, no-clean fluxes, metallized components and substrate materials. | |
| It is a fast curing reactive hot melt adhesive and sealant. It is a 100% solid, one-component material with a secondary moisture curing system. The material can be heated and... | |
| It is a low-viscosity, epoxy adhesive industrial product. After mixing, the two-component epoxy resin is cured at room temperature with minimal shrinkage to form an ultra-clear adhesive tape with excellent... | |
| It is a one-component thermal curing epoxy resin. This product is suitable for low-temperature curing and has good adhesion to a variety of materials in a very short time. Typical... | |
| It is a one-component, high-viscosity anaerobic structural adhesive. Suitable for bonding most materials. The product will cure when exposed to suitable UV light. The bonding on the surface of the... | |
| It is a pressure-sensitive reactive hot melt adhesive. Its formula is cured by moisture, providing high initial strength and rapid setting speed instantly. | |
| It is a reactive black polyurethane hot melt adhesive, cured with moisture. This material is pressure sensitive and provides instant high initial strength after connecting parts. It has good basic... | |
| It is a reactive hot melt adhesive based on polyurethane prepolymer. It takes a long time to turn on. After the bonding line has cured, the adhesive provides good initial... | |
| It is a reactive hot melt adhesive based on polyurethane prepolymer. The adhesive is pressure sensitive and provides high initial strength after adding the part immediately. It has excellent rework... | |
| It is a single component, high-end adhesive with dual curing mechanism, specially designed for the optical device industry, typical applications include PLC packaging, semiconductor laser packaging, collimator lens bonding, filter... | |
| It is a single-component, VOC-free conformal coating. This product is specially designed to quickly gel and cure under ultraviolet light, even if exposed to moisture in the air in the... | |
| It is a thixotropic, non-depressed paste that combines very well with carbon composite materials and aluminum materials. This one-component, non-mixing, heat-activated formula has tough and strong structural bonds, and has... | |
| It is a two-component acrylic structural adhesive. At room temperature (23°C), the operating time is 3-5 minutes, the curing time is 5 minutes, and it can be used in 1... | |
| It is a two-component epoxy resin structural adhesive. At room temperature (25°C), the operating time is 20 minutes, the curing position is 90 minutes, and the curing is complete in... | |
| It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12... | |
| It is a two-component low-odor acrylic structural adhesive, which produces less odor than traditional acrylic adhesives when applied. At room temperature (23°C), the operating time is 5-8 minutes, the curing... | |
| It is a unitized, UV-curable adhesive, specially designed for pin bonding applications of LCD terminals. | |
| It is specially designed to bond metals, glass and some thermoplastics for reliable structures. It is used for different bonding, positioning welding, coating and sealing operations. It can bond some... | |
| It is suitable for a wide range of applications requiring fast curing, good environmental performance and high adhesion. The product cures quickly when exposed to temperatures as low as 100°... | |
| It is suitable for the structural bonding of notebook and tablet computer shells. It has fast curing, short fastening time, super impact resistance and fatigue resistance. It is an all-rounder... | |
| It is used for wire protection coating in the manufacture of earphone assembly and fixing of various equipment or electronic components (mobile phone motor, earphone cable) and so on. | |
| Low viscosity, fast curing. | |
| Low viscosity, short open time, fast curing. | |
| Low viscosity, suitable for bonding with extremely narrow frame. | |
| Mainly used for polycarbonate bonding, and will not produce stress cracking under typical compression stress. It can be quickly cured under sufficient UV or visible light to form a flexible... | |
| Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. | |
| Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the... | |
| Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire drawing problems, greatly saving... | |
| Medium easy to repair, PA substrate bonding. | |
| Medium-viscosity removable adhesive, strong adhesion to PE surface material, can be used for removable labels | |
| No flow, UV/moisture curing package, suitable for partial circuit board protection. This product has fluorescent characteristics in ultraviolet (black). It is mainly used for partial protection of WLCSP and BGA... | |
| Off-white/universal structural adhesive, low to medium viscosity, good manufacturability, steel sheet bonding strength over 38Mpa, temperature resistance 200 degrees. | |
| Suitable for all kinds of low temperature applications above -10°C, easy to die cutting, excellent viscosity at room temperature, can be used for cold chain logistics labels | |
| Suitable for all kinds of low temperature applications above -25°C, easy to die cutting, excellent viscosity at room temperature, can be used for cold storage labels | |
| Suitable for stress-sensitive materials, PC/PVC strong bonding. This product shows excellent adhesion to most substrates including glass, many plastics and most metals. | |
| Suitable for stress-sensitive materials, PC/PVC/PMMA/ABS strong bonding. Mainly used for polycarbonate bonding, and will not produce stress cracking under typical compression stress. Under sufficient intensity of UV or visible light,... | |
| The frame of the camera module industry and the fixing of the optical lens. | |
| The industrial window is wide, the operating time is 120min, and the bonding strength after curing is high. It is a high-viscosity industrial-grade epoxy adhesive with long service life. Once... | |
| The no-flow package is designed for local circuit board protection. This adhesive can be cured in a few seconds under UV light of appropriate intensity. In addition to light curing,... | |
| The special formula of this product is suitable for the moisture-proof treatment of the COG or TAB installation terminal of the LCD module. The product's high flexibility and good moisture-proof... | |
| Typical applications include bonding ferrite and electroplating materials in places where quick fixation is required, such as motors, speaker hardware, and jewelry, as well as the place where the product... | |
| Ultra-low viscosity, short open time, can be used for LCM side edge sealant. | |
| Ultra-low viscosity, short opening time, can be used on the side of the camera round light. | |
| Under 365nm ultraviolet rays, it will be cured in a few seconds to form an impact-resistant adhesive layer, which has long-term moisture or water immersion resistance. It is mainly used... | |
| Used for LCD pin fixing. | |
| Used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is usually used from -53°C to 204°C. | |
| UV curing end face sealant suitable for LCD applications, convection process. | |
| UV-curable adhesive is a one component, high viscosity, UV-curable adhesive. The product is mainly used for sound, speakers and other voice coil sound film bonding, in sufficient intensity of UV... | |
| VL adhesive (visible light curing adhesive), on the basis of maintaining the advantages of UV adhesive, reduces the investment in curing equipment and avoids UV damage to the human body. | |
| When exposed to 365nm ultraviolet rays, it will cure within a few seconds to form an impact-resistant adhesive layer that has long-term moisture or water immersion resistance. It is mainly... |