Shenzhen DeepMaterial Technologies Co., Ltd Reactive polyurethane Moisture curing Hot Melt Adhesive DM-6549

Description
It is a pressure-sensitive reactive hot melt adhesive. Its formula is cured by moisture, providing high initial strength and rapid setting speed instantly.
  • Reactive polyurethane Moisture curing Hot Melt Adhesive - DM-6549 - Shenzhen DeepMaterial Technologies Co., Ltd
    Shenzhen DeepMaterial Technologies Co., Ltd
Description
It is a pressure-sensitive reactive hot melt adhesive. Its formula is cured by moisture, providing high initial strength and rapid setting speed instantly.

Suppliers

Company
Product
Description
Supplier Links
Reactive polyurethane Moisture curing Hot Melt Adhesive - DM-6549 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
Reactive polyurethane Moisture curing Hot Melt Adhesive
DM-6549
Reactive polyurethane Moisture curing Hot Melt Adhesive DM-6549
It is a pressure-sensitive reactive hot melt adhesive. Its formula is cured by moisture, providing high initial strength and rapid setting speed instantly.

It is a pressure-sensitive reactive hot melt adhesive. Its formula is cured by moisture, providing high initial strength and rapid setting speed instantly.

Supplier's Site

Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives
Product Number DM-6549
Product Name Reactive polyurethane Moisture curing Hot Melt Adhesive
Cure / Technology Thermoplastic / Hot Melt; Reactive or Moisture Cured
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Applications - Bonding - Fusionbond 370 - 3370AB22 - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Bonding - Fusionbond 370
3370AB22
Specs
Cure / Technology Two Component  
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Magna-Tac® TR 580 - - Beacon Adhesives, Inc.
Beacon Adhesives, Inc.
Magna-Tac® TR 580
View Details
Heat Transfer Compound - T-99 - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
T-99
Specs
Cure / Technology Single Component
Features Thermally Conductive
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details
Adhesives - - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Adhesives
Specs
Cure / Technology Two Component  
Chemical System Epoxy; Silicone
View Details