Shenzhen DeepMaterial Technologies Co., Ltd Datasheets for Electrical and Electronic Resins
Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Electrical and Electronic Resins: Learn more
| Product Name | Notes |
|---|---|
| Classic underfill, ultra-low viscosity suitable for most underfill applications. | |
| DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy | |
| Dual-curing adhesives are specially designed for the assembly of temperature-sensitiv e electronic components. The formula of this product is to perform initial curing under ultraviolet radiation, and then perform secondary... | |
| Easy to repair, fast curing, high elongation, low hardness. | |
| Fast curing at low temperature, used for the assembly of CCD or CMOS components and VCM motors. This product is specifically designed for heat-sensitive applications that require low-temperature curing. It... | |
| In industrial applications, it is mainly used for the bonding, sealing or coating of metal and glass parts. This product is suitable for the reinforcement of printed circuit boards and... | |
| It is a conformal coating designed to provide strong protection from moisture and harsh chemicals. Compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. | |
| It is a fast curing, fast flowing liquid epoxy resin designed for capillary flow filling chip size packages, is to improve the process speed in production and design its rheological... | |
| It is a one-component, high-viscosity anaerobic structural adhesive. Suitable for bonding most materials. The product will cure when exposed to suitable UV light. The bonding on the surface of the... | |
| It is a one-component, thermosetting epoxy resin. It is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stress in handheld electronic devices. | |
| It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12... | |
| Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. | |
| Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the... | |
| Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire drawing problems, greatly saving... | |
| One-component epoxy resin adhesive is a filling resin that can be reused in CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to... | |
| Suitable for stress-sensitive materials, PC/PVC strong bonding. This product shows excellent adhesion to most substrates including glass, many plastics and most metals. | |
| The no-flow package is designed for local circuit board protection. This adhesive can be cured in a few seconds under UV light of appropriate intensity. In addition to light curing,... | |
| The reusable epoxy primer is designed for CSP and BGA applications. It can be cured quickly at moderate temperatures to reduce the pressure on other parts. After curing, the material... | |
| The reusable underfill is specially designed for CSP, WLCSP and BGA applications. Its formula is to cure quickly at moderate temperatures to reduce stress on other parts. The material has... | |
| Used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is usually used from -53°C to 204°C. |