Shenzhen DeepMaterial Technologies Co., Ltd Reactive polyurethane Moisture curing Hot Melt Adhesive DM-6530

Description
Fast curing, low modulus, super high initial adhesion.
Description
Fast curing, low modulus, super high initial adhesion.

Suppliers

Company
Product
Description
Supplier Links
Reactive polyurethane Moisture curing Hot Melt Adhesive - DM-6530 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
Reactive polyurethane Moisture curing Hot Melt Adhesive
DM-6530
Reactive polyurethane Moisture curing Hot Melt Adhesive DM-6530
Fast curing, low modulus, super high initial adhesion.

Fast curing, low modulus, super high initial adhesion.

Supplier's Site

Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives
Product Number DM-6530
Product Name Reactive polyurethane Moisture curing Hot Melt Adhesive
Cure / Technology Thermoplastic / Hot Melt; Reactive or Moisture Cured
Unlock Full Specs
to access all available technical data

Similar Products

ELANTAS PDG ELAN-Tron® E 203 Epoxy Resin Black 1 pt Can - E 203 BLACK PINT DP - Ellsworth Adhesives
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Features Sealant
View Details
Adhesives -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Cure / Technology Two Component  
Chemical System Epoxy; Silicone
View Details