Shenzhen DeepMaterial Technologies Co., Ltd Reactive polyurethane Moisture curing Hot Melt Adhesive DM-6530

Description
Fast curing, low modulus, super high initial adhesion.
Description
Fast curing, low modulus, super high initial adhesion.

Suppliers

Company
Product
Description
Supplier Links
Reactive polyurethane Moisture curing Hot Melt Adhesive - DM-6530 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
Reactive polyurethane Moisture curing Hot Melt Adhesive
DM-6530
Reactive polyurethane Moisture curing Hot Melt Adhesive DM-6530
Fast curing, low modulus, super high initial adhesion.

Fast curing, low modulus, super high initial adhesion.

Supplier's Site

Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives
Product Number DM-6530
Product Name Reactive polyurethane Moisture curing Hot Melt Adhesive
Cure / Technology Thermoplastic / Hot Melt; Reactive or Moisture Cured
Unlock Full Specs
to access all available technical data

Similar Products

Fiber Adhesive -  - Beijing Grish Hitech Co., Ltd.
Beijing Grish Hitech Co., Ltd.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Type / Form Liquid
View Details
Mosaic Glue -  - Beacon Adhesives, Inc.
Beacon Adhesives, Inc.
Specs
Features Water Based 
View Details
Nickel Filled Electrically Conductive Epoxy System - EP76M - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Composition Filled
View Details
UV-Curing Epoxy, NOA 86, 6 gm Syringe - NOA-86S - Newport MKS
Specs
Cure / Technology UV or Radiation Cured
Chemical System Epoxy
View Details