Shenzhen DeepMaterial Technologies Co., Ltd Reactive polyurethane Moisture curing Hot Melt Adhesive DM-6530

Name: Reactive polyurethane Moisture curing Hot Melt Adhesive
Brand: Shenzhen DeepMaterial Technologies Co., Ltd

Description

Fast curing, low modulus, super high initial adhesion.

Description

Fast curing, low modulus, super high initial adhesion.

Suppliers

Company

Product

Description

Supplier Links

Shenzhen, Guangdong, China

Reactive polyurethane Moisture curing Hot Melt Adhesive
DM-6530

Reactive polyurethane Moisture curing Hot Melt Adhesive DM-6530

Fast curing, low modulus, super high initial adhesion.

Supplier's Site

	Shenzhen DeepMaterial Technologies Co., Ltd
Product Category	Industrial Adhesives
Product Number	DM-6530
Product Name	Reactive polyurethane Moisture curing Hot Melt Adhesive
Cure / Technology	Thermoplastic / Hot Melt; Reactive or Moisture Cured

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Hernon Manufacturing, Inc.

Specs

Cure / Technology Thermoset; UV or Radiation Cured; Single Component

Substrate Compatibility Ceramic, Glass

Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial

Beacon Adhesives, Inc.

Thermon, Inc

Specs

Cure / Technology Single Component

Features Thermally Conductive

Use Temperature 32 to 2200 F (0 to 1204 C)

Dexmet® Corporation, a part of PPG’s engineered materials division

Specs

Cure / Technology Two Component

Chemical System Epoxy; Silicone