Shenzhen DeepMaterial Technologies Co., Ltd UV Thermally Curing Adhesive + heat accelerator DM-6423

Name: UV Thermally Curing Adhesive + heat accelerator
Brand: Shenzhen DeepMaterial Technologies Co., Ltd

Description

General-purpose classic product, tough and flexible after curing, impact resistance, moisture resistance, often used for glass bonding.

Description

General-purpose classic product, tough and flexible after curing, impact resistance, moisture resistance, often used for glass bonding.

Suppliers

Company

Product

Description

Supplier Links

Shenzhen, Guangdong, China

UV Thermally Curing Adhesive + heat accelerator
DM-6423

UV Thermally Curing Adhesive + heat accelerator DM-6423

General-purpose classic product, tough and flexible after curing, impact resistance, moisture resistance, often used for glass bonding.

Supplier's Site

	Shenzhen DeepMaterial Technologies Co., Ltd
Product Category	Industrial Adhesives
Product Number	DM-6423
Product Name	UV Thermally Curing Adhesive + heat accelerator
Cure / Technology	Thermoplastic / Hot Melt; UV or Radiation Cured

Unlock Full Specs

to access all available technical data

MacDermid Alpha Electronics Solutions

Specs

Features Electrically Conductive; Thermally Conductive

Industry Electronics; Semiconductors, IC's

ELANTAS North America LLC

Specs

Cure / Technology Two Component

Chemical System Polyurethane

Viscosity 72 cP

Dexmet® Corporation, a part of PPG’s engineered materials division

Specs

Cure / Technology Two Component

Chemical System Epoxy; Silicone

Mitsui Chemicals America, Inc.

Specs

Chemical System Polyurethane