The no-flow package is designed for local circuit board protection. This adhesive can be cured in a few seconds under UV light of appropriate intensity. In addition to light curing, the adhesive also contains a secondary thermal curing initiator.
| Shenzhen DeepMaterial Technologies Co., Ltd | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | DM-6435 |
| Product Name | UV Thermally Curing Adhesive , Heat curing |
| Cure / Technology | Thermoplastic / Hot Melt; UV or Radiation Cured |
