Shenzhen DeepMaterial Technologies Co., Ltd Datasheets for Encapsulants and Potting Compounds
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Encapsulants and Potting Compounds: Learn more
| Product Name | Notes |
|---|---|
| Classic underfill, ultra-low viscosity suitable for most underfill applications. | |
| DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy | |
| For gasket and sealing applications. The product has high resilience. This product is usually used from -53°C to 250°C. | |
| It is a conformal coating designed to provide strong protection from moisture and harsh chemicals. Compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. | |
| It is a fast curing, fast flowing liquid epoxy resin designed for capillary flow filling chip size packages, is to improve the process speed in production and design its rheological... | |
| It is a one-component, thermosetting epoxy resin. It is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stress in handheld electronic devices. | |
| It is a single-component, VOC-free conformal coating. This product is specially designed to quickly gel and cure under ultraviolet light, even if exposed to moisture in the air in the... | |
| One-component epoxy resin adhesive is a filling resin that can be reused in CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to... | |
| The reusable epoxy primer is designed for CSP and BGA applications. It can be cured quickly at moderate temperatures to reduce the pressure on other parts. After curing, the material... | |
| The reusable underfill is specially designed for CSP, WLCSP and BGA applications. Its formula is to cure quickly at moderate temperatures to reduce stress on other parts. The material has... | |
| Used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is usually used from -53°C to 204°C. |