It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is suitable for the bonding of mobile phone and notebook shells, screens and keyboard frames, and is suitable for medium-speed production lines.
It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is suitable for the bonding of mobile phone and notebook shells, screens and keyboard frames, and is suitable for medium-speed production lines.
| Shenzhen DeepMaterial Technologies Co., Ltd | Shenzhen DeepMaterial Technologies Co., Ltd | |
|---|---|---|
| Product Category | Industrial Adhesives | Industrial Adhesives |
| Product Number | DM-6063 | DM-6063 |
| Product Name | Epoxy Resin | Two-component Epoxy Structural Adhesive |
| Cure / Technology | Two Component ; Room Temperature Vulcanizing or Curing | Two Component ; Reactive or Moisture Cured |
