Shenzhen DeepMaterial Technologies Co., Ltd Epoxy Resin DM-6198

Description
It is a thixotropic, non-depressed paste that combines very well with carbon composite materials and aluminum materials. This one-component, non-mixing, heat-activated formula has tough and strong structural bonds, and has excellent peeling resistance and impact strength. When fully cured, epoxy resin has excellent mechanical properties and can withstand the erosion of various solvents and chemicals. Heat curing, high strength, high temperature resistance, can bond carbon fiber.
Description
It is a thixotropic, non-depressed paste that combines very well with carbon composite materials and aluminum materials. This one-component, non-mixing, heat-activated formula has tough and strong structural bonds, and has excellent peeling resistance and impact strength. When fully cured, epoxy resin has excellent mechanical properties and can withstand the erosion of various solvents and chemicals. Heat curing, high strength, high temperature resistance, can bond carbon fiber.

Suppliers

Company
Product
Description
Supplier Links
Epoxy Resin - DM-6198 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
Epoxy Resin
DM-6198
Epoxy Resin DM-6198
It is a thixotropic, non-depressed paste that combines very well with carbon composite materials and aluminum materials. This one-component, non-mixing, heat-activated formula has tough and strong structural bonds, and has excellent peeling resistance and impact strength. When fully cured, epoxy resin has excellent mechanical properties and can withstand the erosion of various solvents and chemicals. Heat curing, high strength, high temperature resistance, can bond carbon fiber.

It is a thixotropic, non-depressed paste that combines very well with carbon composite materials and aluminum materials. This one-component, non-mixing, heat-activated formula has tough and strong structural bonds, and has excellent peeling resistance and impact strength. When fully cured, epoxy resin has excellent mechanical properties and can withstand the erosion of various solvents and chemicals. Heat curing, high strength, high temperature resistance, can bond carbon fiber.

Supplier's Site

Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives
Product Number DM-6198
Product Name Epoxy Resin
Cure / Technology Single Component; Heat Curing
Chemical System Epoxy
Substrate Compatibility Composites; Metal
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Applications - Retaining Compounds - Cylinlock 842 - 3842HV60 - Hernon Manufacturing, Inc.
Specs
Features Threadlocker or Retainer
Substrate Compatibility Metal; Metallic or non-metallic substrates
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Fluon® Perfluoro Adhesive - EA-2000 - AGC Chemicals Americas, Inc.
AGC Chemicals Americas, Inc.
Specs
Chemical System PFA
Type / Form Pellets
Features Laminaes
View Details
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Features Flame Retardant; Thermally Conductive; UL Rating
View Details
High-Performance Carbon Fiber Thermal Conductive Pad for Mass Storage Devices - CSF20 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details