Shenzhen DeepMaterial Technologies Co., Ltd UV Thermally Curing Adhesive , Heat curing DM-6434

Description
It is a single component, high-end adhesive with dual curing mechanism, specially designed for the optical device industry, typical applications include PLC packaging, semiconductor laser packaging, collimator lens bonding, filter bonding, optical detector lens and fiber bonding, isolator ROSA adhesive, Its good curing characteristics meet the industry requirements of rapid assembly while ensuring a satisfactory product pass rate.
Description
It is a single component, high-end adhesive with dual curing mechanism, specially designed for the optical device industry, typical applications include PLC packaging, semiconductor laser packaging, collimator lens bonding, filter bonding, optical detector lens and fiber bonding, isolator ROSA adhesive, Its good curing characteristics meet the industry requirements of rapid assembly while ensuring a satisfactory product pass rate.

Suppliers

Company
Product
Description
Supplier Links
UV Thermally Curing Adhesive , Heat curing - DM-6434 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
UV Thermally Curing Adhesive , Heat curing
DM-6434
UV Thermally Curing Adhesive , Heat curing DM-6434
It is a single component, high-end adhesive with dual curing mechanism, specially designed for the optical device industry, typical applications include PLC packaging, semiconductor laser packaging, collimator lens bonding, filter bonding, optical detector lens and fiber bonding, isolator ROSA adhesive, Its good curing characteristics meet the industry requirements of rapid assembly while ensuring a satisfactory product pass rate.

It is a single component, high-end adhesive with dual curing mechanism, specially designed for the optical device industry, typical applications include PLC packaging, semiconductor laser packaging, collimator lens bonding, filter bonding, optical detector lens and fiber bonding, isolator ROSA adhesive, Its good curing characteristics meet the industry requirements of rapid assembly while ensuring a satisfactory product pass rate.

Supplier's Site

Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives
Product Number DM-6434
Product Name UV Thermally Curing Adhesive , Heat curing
Cure / Technology Thermoplastic / Hot Melt; UV or Radiation Cured
Unlock Full Specs
to access all available technical data

Similar Products

High-Reliability Thermoplastic Adhesives for Microelectronics - STAYSTIK ® 472 - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Thermoplastic / Hot Melt; Thermoset
Type / Form Sheet or Film
Features Thermally Conductive
View Details
Thermal sil pad for power amplifiers - SC800FG - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Silicone
Features Thermally Conductive
Industry Electronics
View Details
Fiber Adhesive -  - Beijing Grish Hitech Co., Ltd.
Beijing Grish Hitech Co., Ltd.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Type / Form Liquid
View Details
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Features Flame Retardant; Thermally Conductive; UL Rating
View Details