Shenzhen DeepMaterial Technologies Co., Ltd Datasheets for Epoxy Adhesives

Epoxy adhesives are chemical compounds for joining components. They require clean surfaces and are valued for their toughness and resistance to chemical and environmental damage.
Epoxy Adhesives: Learn more

Product Name Notes
Classic low-temperature curing adhesive, used for LCD backlight module assembly.
DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy
Fast curing at low temperature, used for the assembly of CCD or CMOS components and VCM motors. This product is specifically designed for heat-sensitive applications that require low-temperature curing. It...
It is a low-viscosity, epoxy adhesive industrial product. After mixing, the two-component epoxy resin is cured at room temperature with minimal shrinkage to form an ultra-clear adhesive tape with excellent...
It is a one-component thermal curing epoxy resin. This product is suitable for low-temperature curing and has good adhesion to a variety of materials in a very short time. Typical...
It is a thixotropic, non-depressed paste that combines very well with carbon composite materials and aluminum materials. This one-component, non-mixing, heat-activated formula has tough and strong structural bonds, and has...
It is a two-component epoxy resin structural adhesive. At room temperature (25°C), the operating time is 20 minutes, the curing position is 90 minutes, and the curing is complete in...
It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12...
It is suitable for a wide range of applications requiring fast curing, good environmental performance and high adhesion. The product cures quickly when exposed to temperatures as low as 100°...
Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems.
Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the...
Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire drawing problems, greatly saving...
Off-white/universal structural adhesive, low to medium viscosity, good manufacturability, steel sheet bonding strength over 38Mpa, temperature resistance 200 degrees.
The industrial window is wide, the operating time is 120min, and the bonding strength after curing is high. It is a high-viscosity industrial-grade epoxy adhesive with long service life. Once...