It is a one-component thermal curing epoxy resin. This product is suitable for low-temperature curing and has good adhesion to a variety of materials in a very short time. Typical applications include memory card, CCD/CMOS assembly. It is especially suitable for applications where low curing temperature is required for heat-sensitive components.
| Shenzhen DeepMaterial Technologies Co., Ltd | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | DM-6109 |
| Product Name | Low temperature curing adhesive |
| Cure / Technology | Heat curing |
