Shenzhen DeepMaterial Technologies Co., Ltd Low temperature curing adhesive DM-6109

Description
It is a one-component thermal curing epoxy resin. This product is suitable for low-temperature curing and has good adhesion to a variety of materials in a very short time. Typical applications include memory card, CCD/CMOS assembly. It is especially suitable for applications where low curing temperature is required for heat-sensitive components.
Description
It is a one-component thermal curing epoxy resin. This product is suitable for low-temperature curing and has good adhesion to a variety of materials in a very short time. Typical applications include memory card, CCD/CMOS assembly. It is especially suitable for applications where low curing temperature is required for heat-sensitive components.

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Low temperature curing adhesive - DM-6109 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
Low temperature curing adhesive
DM-6109
Low temperature curing adhesive DM-6109
It is a one-component thermal curing epoxy resin. This product is suitable for low-temperature curing and has good adhesion to a variety of materials in a very short time. Typical applications include memory card, CCD/CMOS assembly. It is especially suitable for applications where low curing temperature is required for heat-sensitive components.

It is a one-component thermal curing epoxy resin. This product is suitable for low-temperature curing and has good adhesion to a variety of materials in a very short time. Typical applications include memory card, CCD/CMOS assembly. It is especially suitable for applications where low curing temperature is required for heat-sensitive components.

Supplier's Site

Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives
Product Number DM-6109
Product Name Low temperature curing adhesive
Cure / Technology Heat curing
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