Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a good adhesive output speed, and improves the production cycle.
| Shenzhen DeepMaterial Technologies Co., Ltd | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | DM-7180 |
| Product Name | Conductive Silver Adhesive |
| Cure / Technology | Heat curing |
