Shenzhen DeepMaterial Technologies Co., Ltd Low temperature curing adhesive DM-6120

Description
Classic low-temperature curing adhesive, used for LCD backlight module assembly.
Description
Classic low-temperature curing adhesive, used for LCD backlight module assembly.

Suppliers

Company
Product
Description
Supplier Links
Low temperature curing adhesive - DM-6120 - Shenzhen DeepMaterial Technologies Co., Ltd
Shenzhen, Guangdong, China
Low temperature curing adhesive
DM-6120
Low temperature curing adhesive DM-6120
Classic low-temperature curing adhesive, used for LCD backlight module assembly.

Classic low-temperature curing adhesive, used for LCD backlight module assembly.

Supplier's Site

Technical Specifications

  Shenzhen DeepMaterial Technologies Co., Ltd
Product Category Industrial Adhesives
Product Number DM-6120
Product Name Low temperature curing adhesive
Cure / Technology Heat curing
Unlock Full Specs
to access all available technical data

Similar Products

Advanced Hybrid Sintering Die Attach Solutions - ATROX ® 800HT6B - MacDermid Alpha Electronics Solutions
Specs
Features Electrically Conductive; Thermally Conductive
Industry Electronics; Semiconductors, IC's
View Details
Adhesives -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Cure / Technology Two Component  
Chemical System Epoxy; Silicone
View Details
Formulations - Applications - Bonding - Tuffbond 395 - 339552 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Single Component
Chemical System Epoxy
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
UV-Curing Epoxy, NOA 86, 6 gm Syringe - NOA-86S - Newport MKS
Specs
Cure / Technology UV or Radiation Cured
Chemical System Epoxy
View Details